<PAGE> 1
SECURITIES AND EXCHANGE COMMISSION
WASHINGTON, D.C. 20549
Amendment No. 1 to
FORM 8-K
Dated April 21, 1999, as filed on April 26, 1999
CURRENT REPORT
PURSUANT TO SECTION 13 OR 15(d) OF
THE SECURITIES EXCHANGE ACT OF 1934
April 21, 1999
------------------------------------------------
Date of Report (Date of earliest event reported)
AMKOR TECHNOLOGY, INC.
------------------------------------------------------
(Exact name of Registrant as specified in its charter)
Delaware
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(State or other jurisdiction of incorporation)
0-29472 23-1722724
--------------------- ------------------------------------
(Commission File No.) (IRS Employer Identification Number)
1345 Enterprise Drive
West Chester, PA 19380
(610) 431-9600
----------------------------------------
(Address of Principal Executive Offices)
-------------------------------------------------------------
(Former name or former address, if changed since last report)
<PAGE> 2
Item 2. ACQUISITION OR DISPOSITION OF ASSETS
We have acquired the assets, excluding cash and cash equivalents, notes
and accounts receivables, intercompany accounts and existing claims against
third parties, of the Kwangju packaging and test facility, known as K4, of Anam
Semiconductor, Inc. (the "Acquisition"). The purchase price for K4 was $575.0
million, plus the assumption of up to $7.0 million of employee benefit
liabilities. We used debt financing to pay the purchase price for K4. We
consummated the Acquisition on May 17, 1999. The asset purchase agreement for
the Acquisition is exhibit 2.1 to this report, and an amendment to this
agreement is exhibit 2.2 to this report. A press release issued by the Company
in connection with the consummation of the Acquisition is exhibit 99.1 to this
report.
Located in Kwangju, Korea, K4 is situated on approximately 100 acres and
currently consists of a 1,000,000 square foot facility, including 782,000 square
feet of manufacturing and administrative space. Opened in 1996, K4 has been
ramping up production throughout 1997 and 1998 and provides packaging and test
services for many of our most advanced packages. In addition, the K4 site has
the infrastructure in place to accommodate four pre-configured modules for a
total of 1.6 million square feet of incremental capacity.
In connection with the Acquisition, we entered into a Transition
Services Agreement with ASI. Pursuant to this agreement, ASI will continue to
provide many of the same services at K4 that it had provided prior to the
Acquisition, including human resources, accounting and general administrative
services and customer services. A copy of this agreement is attached hereto as
Exhibit 10.2.
We also entered into an Intellectual Property License Agreement with ASI
that became effective upon the closing of the Acquisition. Pursuant to this
agreement, ASI transferred certain patents to us and licensed certain
intellectual property rights to us under an exclusive, fully paid, perpetual
license. We licensed these patents and other rights back to ASI on a
non-exclusive basis. A copy of this agreement is attached hereto as Exhibit
10.1.
In connection with the Acquisition, we formed a special committee of our
Board of Directors consisting of the five non-employee members of our Board of
Directors. This special committee had the authority to review and approve the
Acquisition. In connection with the Acquisition, the special committee hired
financial and legal advisors. This special committee received a fairness opinion
from its financial advisor and approved the Acquisition.
To finance the purchase price of K4, on May 6, 1999, we completed a
private placement of $425 million of senior notes and $200 million of senior
subordinated notes. The senior notes mature in May 2006 and have a coupon rate
of 9.25%. The senior subordinated notes mature in May 2009 and have a coupon
rate of 10.50%. We must pay interest semi-annually in May and November for all
of the notes.
<PAGE> 3
RELATIONSHIP WITH ASI
WHO IS ANAM SEMICONDUCTOR, INC.?
ASI is a Korean company engaged primarily in providing semiconductor
packaging and test services. ASI currently operates four semiconductor packaging
and test factories in Korea, including K4. ASI also operates a semiconductor
wafer foundry in Korea. ASI derives substantially all of its revenues from the
sale of its packaging and test services to us. ASI also derives all of its wafer
fabrication revenues from the sale of services to us.
We have a long-standing relationship with ASI. ASI was founded in 1956
by Mr. H. S. Kim, the father of Mr. James Kim, our Chairman and Chief Executive
Officer. Since January 1992, in addition to his other responsibilities, Mr.
James Kim has served as Chairman and a Director of ASI. For the years ended
December 31, 1996, 1997 and 1998, we derived 72%, 68% and 69% of our net
revenues and 51%, 42% and 49% of our gross profit from sales of services
performed for us by ASI.
In January 1998, we entered into new supply agreements with ASI. Under
these agreements, we retain a first right to substantially all of its packaging
and test services and the exclusive right to all of the output of its
semiconductor wafer foundry. We expect to continue to purchase substantially all
of ASI's packaging and test services and to purchase all of ASI's semiconductor
wafer output.
THE KOREAN FINANCIAL CRISIS
ASI has been severely affected by the economic crisis in Korea. In late
1997, Korea began to undergo a foreign currency liquidity crisis resulting in
significant adverse economic circumstances and significant depreciation in the
value of the won against the U.S. dollar. In order to address this situation,
the government of Korea sought assistance from the International Monetary Fund
and implemented a comprehensive policy intended to address the structural
weaknesses in the Korean economy and financial sector. While the reform policies
were intended to alleviate the economic difficulties and improve the economy
over time, in the short term, they have resulted in: (1) slower economic growth,
(2) a reduction in the availability of credit, (3) an increase in interest
rates, (4) an increase in taxes, (5) an increase in the rate of inflation, (6)
volatility in the value of the won, (7) an increase in the number of
bankruptcies of Korean corporate entities and (8) unrest resulting from a
significant increase in unemployment. Although the Korean economy recovered
somewhat in the latter half of 1998, these conditions and similar conditions in
other countries in the Asia Pacific region continue to pose a threat to the
economies of such countries and to the region as a whole.
ASI historically operated with a significant amount of debt relative to
its equity. The economic crisis in Korea led to sharply higher interest rates
and significantly reduced opportunities for refinancing maturing debts. Because
ASI maintained a substantial amount of short-term debt, its inability to
refinance this debt created a liquidity crisis for ASI. In addition to its own
leveraged financial position, ASI guarantees certain debt obligations of its
affiliates, many of which have encountered financial difficulties as a result of
the crisis.
ASI WORKOUT
In October 1998, ASI announced that it had applied for and was accepted
into the Korean financial restructuring program known as the "Workout." The
Workout program is the result of an accord among Korean financial institutions
to assist in the restructuring of Korean businesses and does not involve the
judicial system.
We expect the Workout to significantly improve the financial condition
of ASI. The Workout became effective in April 1999. The information setting
forth the details of the Workout is based on the exchange rate
<PAGE> 4
of W1,207.8 to $1.00 that was in effect as of December 31, 1998. The Workout
contains the following provisions:
o The creditor financial institutions will allow ASI to defer repayment on
principal of ordinary loans until December 31, 2003. After December 31, 2003,
ordinary loans with repayment terms will be payable through readjustment of
repayment schedules in effect on October 24, 1998. For ordinary loans without
repayment terms, the schedule to repay principal amounts will be determined by
ASI and the creditor financial institutions at the end of such period.
o The creditor financial institutions will allow ASI to defer repayment of
principal under capital leases until December 31, 1999, with payments of
principal to resume under a seven-year installment plan thereafter.
o The creditor financial institutions will allow ASI to defer the maturity of
its won-denominated debentures for an additional three-year term after
currently scheduled maturity dates.
o The creditor financial institutions will allow ASI to make no interest
payments on ordinary loans until December 31, 1999. The creditor financial
institutions will add accrued interest to the principal amounts of these loans
every three months.
o The creditor financial institutions will reduce interest rates on ASI's
remaining outstanding won-denominated ordinary loans to 10% or the prime rate
of each creditor financial institution, whichever is greater. This would
reduce ASI's weighted average interest rate from 12.9% before the Workout to
10.5% after the Workout.
o The creditor financial institutions will give ASI a grace period until
December 31, 2003 against enforcement of guarantees made by ASI for
liabilities of ASI's affiliates. In addition, interest will not accrue on
guaranteed obligations during this period.
o The creditor financial institutions will provide to ASI a short-term loan of
W50 billion ($41 million) at the prime rate plus 1%, to be repaid with
proceeds from the sale of K4.
o The creditor financial institutions may receive additional payments if ASI's
financial performance exceeds expectations.
o For the duration of the Workout, the creditor financial institutions will be
entitled to vote the ASI shares owned by Mr. James Kim and his family.
o The creditor financial institutions will convert W250 billion ($208 million)
of ASI debt held by the creditor financial institutions into: (1) equity
shares of ASI in the amount of W122.3 billion ($102 million), (2) five-year
non-interest bearing convertible debt in the amount of W108.1 billion ($90
million) and (3) non-interest bearing loans in the amount of W19.6 billion
($16 million), provided that we make a $150 million equity investment in ASI.
The conversion would take place in installments over four years, with the
first installment to be made in October 1999, at a conversion rate equal to
W5,000 per share, the par value of ASI's common stock. In order for the
initial conversion of debt to take place in accordance with the terms of the
Workout, ASI will have to undergo a series of corporate actions, including a
reverse stock split, to bring the fair market value of its equity shares to a
price at least equal to the par value of such shares. The conversion of ASI
debt by the creditor financial institutions would coincide with each
installment of our equity investment in ASI.
We have executed a letter with ASI committing to make the equity
investment in installments of $41 million in each of 1999, 2000 and 2001 and $27
million in 2002. Our commitment to invest in ASI is subject to: (1) execution of
a definitive stock purchase agreement, (2) concurrent conversion of debt by the
creditor financial institutions, (3) the Workout remaining in effect and (4) the
supply agreements between our company and ASI remaining in effect. We would
purchase the ASI shares at W5,000 per share. Because our commitment is in U.S.
dollars, the number of shares we would purchase will vary based on the exchange
rate of Korean won to U.S. dollars.
<PAGE> 5
Upon completion of the first installment of our equity investment in ASI
and conversion of debt by the creditor financial institutions, we expect the
relative equity ownership of ASI among the creditor financial institutions, the
Kim family and our company to be approximately 27%, 21% and 21%, respectively,
subject to the creditor financial institutions' right to vote the Kim family's
stock for the duration of the Workout. Upon completion of all conversions of
debt by the creditor financial institutions and all installments of our equity
investment pursuant to the Workout, we expect the relative equity ownership of
ASI among the creditor financial institutions, the Kim family and our company to
be approximately 29%, 11% and 43%, respectively, subject to the creditor
financial institutions' voting rights. Upon conversion of all of the convertible
debt issued to the creditor financial institutions, which would be permitted
beginning one year after the date of issuance of such debt, the ownership of ASI
among the credit or financial institutions, the Kim family and our company would
be approximately 43%, 9% and 34%, respectively, subject to the creditor
financial institutions' voting rights.
The creditor financial institutions have the right to terminate or
modify the Workout if ASI does not fulfill the terms of the Workout, including
meeting certain financial targets. In addition, the creditor financial
institutions can modify the terms of the Workout upon agreement of creditor
financial institutions holding at least 75% of the debt restructured under the
Workout. If the creditor financial institutions subsequently terminate the
Workout, the creditor financial institutions could reinstate and enforce the
original terms of ASI's debt, including accelerating ASI's obligations and
pursuing ASI's guarantees of its affiliates' debt. If this were to occur, ASI's
and our businesses would be harmed.
RELATIONSHIP WITH ASI FOLLOWING THE WORKOUT AND THE ACQUISITION OF K4
We expect ASI to continue to be important to our business in the future.
Under our supply agreements with ASI, we have a first right to substantially all
of the packaging and test services of ASI and the exclusive right to all of the
wafer output of ASI's wafer foundry. The supply agreements have a five-year
term, expiring December 31, 2002, and may be terminated by either party upon
five years' written notice after completion of the initial five year term. The
supply agreements may also be terminated upon breach or insolvency of either
party. We expect to continue to have certain contractual and other business
relationships with ASI, including those under the supply agreements. The supply
agreements generally provide for continued cooperation between our company and
ASI in research and development, as well as cross-licensing of intellectual
property rights. The supply agreements also provide for continued capital
investment by ASI based on our forecasts. It is not certain whether the Workout
will be sufficient to enable ASI to continue to provide services to our company
at current levels or to obtain funds for capital expansion.
As described above, concurrent with the completion of the Acquisition,
we entered into a transition services agreement and an intellectual property
licensing agreement with ASI.
Our company and ASI will also continue to have close ties due to our
overlapping ownership and management. We expect that Mr. James Kim will continue
to serve as Chairman of ASI and as our Chairman and Chief Executive Officer. The
Kim family currently beneficially owns approximately 65.8% of our outstanding
common stock and approximately 40.7% of ASI's common stock. Both our investment
in ASI and the conversion of debt to equity will substantially decrease the Kim
Family's ownership in ASI. Furthermore, for the duration of the Workout, the
creditor financial institutions will be entitled to vote the ASI shares owned by
Mr. James Kim and his family. Even though the Kim family's ownership of ASI will
be reduced and the voting rights in their ASI shares assigned to the creditor
financial institutions, we believe that the Kim family will continue to exercise
significant influence over our company, ASI and its affiliates.
We have also entered into agreements with ASI and Texas Instruments,
Inc. relating to our wafer fabrication business. In addition, we may engage in
other transactions with ASI from time to time that are material to us. To
provide you with additional information about our relationship with ASI, we
hereby incorporate by reference to our Annual Report on Form 10-K filed on March
31, 1999 Part III, Item 13, "Certain Relationships and Related Transactions,"
into this Report.
The indentures entered into in connection with our financing of the
acquisition of K4 (Exhibits 4.1 and 4.2 to this Report) restrict our
ability to enter into transactions with ASI and other affiliates.
<PAGE> 6
ASI CONSOLIDATED CONDENSED FINANCIAL INFORMATION
The following is a summary of the audited consolidated financial
information pertaining to ASI. The financial information is prepared in
accordance with Korean GAAP, which differs significantly from U.S. GAAP. U.S.
GAAP financial statements are not available.
<TABLE>
<CAPTION>
YEAR ENDED DECEMBER 31,
------------------------
1997 1998
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(IN MILLIONS)
<S> <C> <C>
INCOME STATEMENT DATA:
Sales....................................................... W1,786,457 W2,547,326
Gross profit............................................ 279,186 201,926
Operating income........................................ 176,028 77,734
Interest expense, net....................................... 113,066 313,971
Foreign exchange (gains) losses, net, loss from forward
contract and amortization of deferred charges............. 345,232 (182,958)
(Gains) from sale of investments............................ (3,473) (89,397)
Loss on valuation of inventories............................ 724 24,150
Other, net.................................................. 12,192 11,041
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Total non-operating (income) expense, net........... 467,741 76,807
---------- ----------
Ordinary income (loss) before income taxes and
extraordinary items.................................... (291,713) 927
Income tax.................................................. 7,922 2,063
Extraordinary losses, net................................... 1,039 193,571
Minority interests.......................................... (1,206) (72,049)
Equity in losses of affiliates.............................. 49,261 18,830
---------- ----------
Net loss................................................ W (348,729) W (141,488)
========== ==========
OTHER FINANCIAL DATA:
Depreciation expense........................................ W 137,989 W 311,461
</TABLE>
<TABLE>
<CAPTION>
DECEMBER 31
------------------------
1997 1998
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(IN MILLIONS)
<S> <C> <C>
BALANCE SHEET DATA (AT END OF PERIOD):
ASSETS
Cash and bank deposits.................................... W 215,024 W 37,969
Trade accounts and notes receivable, net.................. 189,522 144,501
Inventories............................................... 260,302 183,786
Short-term loans to affiliates............................ 62,846 188,188
Other current assets...................................... 179,119 95,921
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Total current assets.................................... 906,813 650,365
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Property, plant and equipment, net........................ 2,159,466 2,284,263
Investments............................................... 121,880 72,136
Long-term trade accounts receivable....................... 203,739 18,876
Other long-term assets.................................... 544,132 276,656
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Total long-term assets.................................. 3,029,217 2,651,931
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Total assets........................................ W3,936,030 W3,302,296
========== ==========
LIABILITIES AND SHAREHOLDERS' EQUITY
Short-term borrowings..................................... W1,720,916 W1,351,919
Current maturities of long-term debt...................... 120,913 249,526
Provision for loss contingencies related to affiliate
companies............................................... -- 190,000
Other current liabilities................................. 282,653 270,895
---------- ----------
Total current liabilities............................... 2,124,482 2,062,340
---------- ----------
Long-term debt, net of current maturities................. 736,784 494,867
Long-term obligations under capital leases................ 861,813 661,286
Other long-term liabilities............................... 111,017 112,938
---------- ----------
Total long-term liabilities............................. 1,709,614 1,269,091
---------- ----------
Total liabilities....................................... 3,834,096 3,331,431
---------- ----------
Minority interests in consolidated subsidiaries........... 25,160 21,538
Shareholders' equity(deficit)............................. 76,774 (50,673)
---------- ----------
Total liabilities and shareholders' equity (deficit).... W3,936,030 W3,302,296
========== ==========
</TABLE>
<PAGE> 7
Beginning in late 1997 and continuing into 1998, Korea experienced
severe economic instability as well as devaluation of the Korean won relative to
the U.S. dollar. The exchange rate as of December 31, 1996, was W884 to $1.00 as
compared to W1,415 to $1.00 as of December 31, 1997 and W1,207 to $1.00 as of
December 31, 1998. No representation is made that the won or U.S. dollar amounts
referred to herein could have been or could be converted into U.S. dollars or
won, as the case may be, at any particular rate or at all.
A significant amount of the current and long-term liabilities of ASI are
denominated in U.S. dollars and other foreign currencies. At December 31, 1998,
the amount of U.S. dollar and other foreign currency denominated short-term
borrowings, current maturities of long-term debt, long-term debt (net of current
maturities) and capital lease obligations were W436 billion, W35 billion, W103
billion and W686 billion, respectively. A substantial amount of ASI's revenues
are denominated in U.S. dollars which mitigates ASI's exposure to currency
fluctuations.
As of December 31, 1998, ASI was contingently liable under guarantees in
respect of debt of ASI's affiliates in the Anam Group in the aggregate amount of
approximately W455 billion. If any affiliates of ASI were to fail to make
interest or principal payments or otherwise default under their debt obligations
then, pursuant to the Workout, creditors could not seek to enforce the
guarantees provided by ASI until December 31, 2003.
<PAGE> 8
Item 7. FINANCIAL STATEMENTS AND EXHIBITS.
The following financial statements and exhibits are filed as part of
this Report:
(a) Financial statements of K4 for the year ended December 31, 1998
were previously filed with this report on April 26, 1999.
(b) Pro forma financial information for the year ended December 31,
1998 was previously filed with this report on April 26, 1999.
(c) Exhibits in accordance with Item 601 of Regulation S-K:
<TABLE>
<CAPTION>
EXHIBIT
NUMBER DESCRIPTION
<S> <C>
2.1 Asset Purchase Agreement by and between Amkor Technology Inc. and
Anam Semiconductor Inc., dated December 30, 1998.*
2.2 Amendment to Asset Purchase Agreement by and between Amkor Technology
Inc. and Anam Semiconductor Inc.
4.1 Indenture dated as of May 13, 1999 and form of Senior Note.**
4.2 Indenture dated as of May 13, 1999 and form of Senior
Subordinated Note.**
10.1 Intellectual Property Transfer and License Agreement by and between
Amkor Technology Inc. and Anam Semiconductor Inc.
10.2 Transition Services Agreement by and between Amkor Technology Inc.
and Anam Semiconductor Inc.
23.1 Consent of Samil Accounting Corporation.
99.1 Press release dated April 21, 1999.***
99.2 Press release dated May 17, 1999.
</TABLE>
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* Incorporated by reference to the Company's Annual Report on Form 10-K filed
March 31, 1999.
** Incorporated by reference to the Company's quarterly Report on Form 10-Q
filed May 17, 1999.
*** Previously filed with this report.
<PAGE> 9
SIGNATURES
Pursuant to the requirements of the Securities Exchange Act of 1934, the
registrant has duly caused this report to be signed on its behalf by the
undersigned hereunto duly authorized.
AMKOR TECHNOLOGY, INC.
By: /s/ Frank J. Marcucci
---------------------------------
Frank J. Marcucci
Chief Financial Officer
Dated: June 1, 1999
<PAGE> 10
=================================
SECURITIES AND EXCHANGE COMMISSION
Washington, D.C. 20549
EXHIBITS
TO
FORM 8-K
CURRENT REPORT PURSUANT TO SECTION 13 OR 15(d)
OF
THE SECURITIES EXCHANGE ACT OF 1934
----------
AMKOR TECHNOLOGY, INC.
----------
=================================
<PAGE> 11
INDEX TO EXHIBITS
<TABLE>
<CAPTION>
EXHIBIT
NUMBER DESCRIPTION
------ -----------
<S> <C>
2.1 Asset Purchase Agreement by and between Amkor Technology Inc. and
Anam Semiconductor Inc., dated December 30, 1998.*
2.2 Amendment to Asset Purchase Agreement by and between Amkor Technology
Inc. and Anam Semiconductor Inc.
4.1 Indenture dated as of May 13, 1999 and form of Senior Note.**
4.2 Indenture dated as of May 13, 1999 and form of Senior
Subordinated Note.**
10.1 Intellectual Property Transfer and License Agreement by and between
Amkor Technology Inc. and Anam Semiconductor Inc.
10.2 Transition Services Agreement by and between Amkor Technology Inc.
and Anam Semiconductor Inc.
23.1 Consent of Samil Accounting Corporation.
99.1 Press release dated April 21, 1999.***
99.2 Press release dated May 17, 1999.
</TABLE>
- --------------------------------------------------------------------------------
* Incorporated by reference to the Company's Annual Report on Form 10-K filed
March 31, 1999.
** Incorporated by reference to the Company's quarterly Report on Form 10-Q
filed May 17, 1999.
*** Previously filed with this report.
<PAGE> 1
EXHIBIT 2.2
[EXECUTION COPY]
AMENDMENT
TO
ASSET PURCHASE AGREEMENT
BY AND BETWEEN
AMKOR TECHNOLOGY, INC.
as Purchaser
AND
ANAM SEMICONDUCTOR, INC.
as Seller
Dated as of May 6, 1999
<PAGE> 2
AMENDMENT TO ASSET PURCHASE AGREEMENT
This is AMENDMENT TO ASSET PURCHASE AGREEMENT (the "Amendment"), dated
May 6, 1999 by and between Amkor Technology, Inc., a corporation organized under
the laws of the State of Delaware of the United States, ("Amkor" or "Purchaser")
and Anam Semiconductor, Inc., a corporation organized under the laws of the
Republic of Korea ("Seller"). Purchaser and Seller shall sometimes each be
referred to as a Party and collectively as the Parties.
RECITALS:
WHEREAS, Seller and Purchaser entered into an Asset Purchase Agreement dated
December 30, 1998 (the "Original Agreement") under which Seller agreed to sell
and Purchaser agreed to purchase the semiconductor packaging and test operations
generally known as K4 located at Advanced Science & Industrial Complex, 2 block,
Daechon-dong, Buk-gu, City of Kwangju 500-470 the Republic of Korea
("Business");
WHEREAS, it is Seller's intention that it will use the proceeds from the sale of
K4, upon Closing, primarily for the repayment of its debt to its Korean
creditors, including certain banks and other forms of financial institutions in
Korea (the "Workout Banks"); and
WHEREAS, both Parties desires to make changes to certain sections of the
Original Agreement by entering in an amendment in accordance with Section 5.7 of
the Original Agreement.
NOW THEREFORE, in consideration of the mutual agreements, covenants,
representations and warranties contained herein, and in reliance thereon,
Purchaser and Seller hereby agree as follows:
DEFINITIONS:
Unless specifically defined otherwise herein, the terms defined herein
shall have the same meanings as they were used in the Original Agreement.
AMENDMENTS OF CERTAIN DEFINITIONS
The definition of "IP Licensing Agreements" in the Original Agreement
(on page 4 of the Original Agreement) is hereby deleted and the following shall
be substituted therefor:
<PAGE> 3
-3-
"IP Assignment and Licensing Agreements" have the meaning as described
in the paragraph immediately following Section 1.1(h) of this Amendment.
The definition of "Base Rate" in the Original Agreement (on page 2 of
the Original Agreement) is hereby deleted.
1.1. Amendment of Section 1.1. "Sale and Purchase of Assets" of the
Original Agreement.
The paragraph immediately following Section 1.1(h) of the Original
Agreement (on page 9 of the Original Agreement) is hereby deleted and the
following shall be substituted therefor:
"The Parties agree that certain Intellectual Properties (including
Licensed Intellectual Property) which are identified in Schedule 2.16 as
the Assigned Intellectual Property shall be assigned to Purchaser
hereunder, while the Intellectual Properties which are identified in
Schedule 2.16 as the Licensed Intellectual Properties shall be licensed
to Purchaser rather than being assigned to Purchaser. With respect to
the Assigned Intellectual Properties, to the extent legally and/or
contractually permissible, Seller shall sell, transfer, convey and
assign to Purchaser, free and clear of all Liens of every kind, nature
and description, all right, title and interest of Seller in and to such
Intellectual Properties. Immediately after the assignment of the
Assigned Intellectual Properties, however, Purchaser shall grant to
Seller, an irrevocable, worldwide, non-exclusive, perpetual, paid-up,
royalty-free and transferable (and sub-licensable) license (or
sub-license) to utilize such Assigned Intellectual Properties (including
the Licensed Intellectual Property), after obtaining any and all
consents necessary therefor for Seller to be able to operate the other
businesses of Seller substantially in the manner as such businesses were
operated by Seller. With respect to the Licensed Intellectual
Properties, to the extent legally and/or contractually permissible,
Seller hereby shall grant to Purchaser and its Affiliates, effective at
the Closing Date, an irrevocable, worldwide, non-exclusive, perpetual,
paid-up, royalty-free and transferable (and sub-licensable) license (or
sub-license) to utilize such Intellectual Properties (including the
Licensed Intellectual Property) which Seller has rights to use as of the
Closing Date, after obtaining any and all consents necessary therefor
for Purchaser to be able to operate the Business substantially in the
manner as such Business was operated by Seller. For this purpose,
Purchaser shall enter into one or more assignment and licensing
agreements (the "IP Assignment and
<PAGE> 4
-4-
Licensing Agreements") with the holders of relevant Intellectual
Properties, including Seller itself, prior to the Closing. All costs, if
any, shall be payable by Seller to any third parties in connection with
the transfer, licenses or sub-licenses for the benefit of Purchaser
pursuant to this Agreement."
1.3. Amendment of Section 1.3. "Purchase Price" of the Original
Agreement2Amendment of Section 1.3. "Purchase Price" of the
Original Agreement.
(a) Section 1.3(a) of the Original Agreement (on page 11 of the
Original Agreement) is hereby deleted and the following shall be substituted
therefor:
"The total aggregate purchase price for the Purchased Assets exclusive
of VAT shall be US$575,000,000 (the "Purchase Price") plus the Assumed
Liabilities."
(b) Section 1.3(b) of the Original Agreement (on page 11 of the
Original Agreement) is hereby deleted.
(c) Immediately following the first paragraph in Section 1.3(c) of the
Original Agreement (on pages 11 of the Original Agreement), the following shall
be added:
"In the event that such ruling by the Korean tax authority shall be
issued to the effect that the transaction contemplated hereunder and
under the Original Agreement shall be VAT-payable, Purchaser shall pay
the amount equal to the Purchase Price to Seller at Closing, out of
which Seller shall pay the VAT amount to be payable in accordance with
the relevant VAT law of Korea ("Payable VAT") to the relevant Korean tax
authority when due, and shall immediately provide a copy of the receipt
to Purchaser. When Purchaser actually receives the refund of the VAT in
the amount of the Payable VAT from the relevant tax office, Purchaser
shall immediately deposit the same amount to an Escrow Account or a bank
account designated by Seller's creditor banks for the repayment of debt
by Seller to its creditor banks. Deposit by Purchaser of the refunded
VAT shall discharge ATK's obligation to pay the Purchase Price
irrespective of whether such refunded VAT amount is less than Payable
VAT.
In the event that the ruling by the Korean tax authority shall be issued
to the effect that the transaction contemplated hereunder and under the
Original Agreement shall be VAT-exempt, Purchaser shall not withhold any
amount from the Purchase Price in connection with the VAT."
<PAGE> 5
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(d) Section 1.3(d) of the Original Agreement (on pages 12 through 13 of
the Original Agreement) is hereby deleted in its entirety and the following
shall be substituted therefor:
"(d) On or prior to the Closing Date, Seller, Purchaser and an
escrow agent to be appointed by mutual consent of Seller and Purchaser
("Escrow Agent") shall enter into one or more escrow agreements ("Escrow
Agreements") in such form and substance to be mutually agreed by the
Parties. Such portion of the Purchase Price as provided in Section
1.4(b) shall be deposited with one or more escrow accounts ("Escrow
Accounts") to assure the repayment of certain liabilities by Seller, and
released to its creditors in accordance with the terms of the Escrow
Agreements."
1.4. Amendment of Section 1.4. "Payment of Purchase Price" of the
Original Agreement2Amendment of Section 1.4. "Payment of Purchase
Price" of the Original Agreement.
(a) Section 1.4(a) of the Original Agreement (on page 12 of the
Original Agreement) is hereby deleted and the following shall be substituted
therefor:
"(a) Purchaser's payment at the Closing of the amount which shall
be set forth in Schedule 1.4(a), by wire transfer or delivery of a
certified bank check immediately available and in accordance with the
instructions of Seller;"
(b) Section 1.4(b) of the Original Agreement (on page 12 of the
Original Agreement) is hereby deleted and the following shall be substituted
therefor:
"(b) Purchaser's deposit at the Closing into an Escrow Account of
the amount which shall be set forth in Schedule 1.4(b);"
(c) Section 1.4(c) of the Original Agreement (on page 12 of the
Original Agreement) is hereby deleted.
1.6 Amendment of Section 1.6 "Adjustments to Purchase Price" of the
Original Agreement.
(b) Section 1.6.(b) of the Original Agreement (on pages 13 through 14)
is hereby deleted and the following shall be replaced therefor:
"(b) Adjustment Formula.
<PAGE> 6
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If the Net Asset Value at the Closing Date is less than the Net
Asset Value as of the Balance Sheet Date (without considering the
depreciation between the Closing Date and the Balance Sheet Date), then,
the Purchase Price shall be reduced by the amount of such deficiency
accordingly. In order to give effect to any such reduction, the
Purchaser, at the Purchaser's option, may demand Seller to compensate
for such deficiency by requiring payments or delivery of additional
assets having values equivalent to such deficiency within 15 days from
the date of discovery of such deficiency by the Purchaser, or,
alternatively, withholding of such deficient amount from any amount
owing to Seller by Purchaser or its Affiliates to the extent permissible
under Korean law."
2
1.8. Amendment of Section 1.8 "Conditions to Each Party's Obligations"
of the Original Agreement.
(a) The first sentence of Section 1.8(a) of the Original Agreement (on
page 16 of the Original Agreement) is hereby deleted and the following shall be
substituted therefor:
"(a) The Escrow Agreement, the IP Assignment and Licensing
Agreements (or any equivalent thereof), the Transition Service
Agreement, the assignment agreement provided in Section 1.10(b) hereof,
and any other agreements, if any, necessary to vest in Purchaser good,
valid and marketable title to the Purchased Assets (collectively, the
"Ancillary Agreements") have been duly executed and delivered after
having been duly authorized by all necessary corporate actions by the
relevant parties thereto."
1.10 Amendment of Section 1.10 "Conditions to Purchaser's Obligations"
of the Original Agreement.
(h) Section 1.10(h) of the Original Agreement (on page 19 of the
Original Agreement) is hereby deleted and the following shall be substituted
therefor:
"(h) After (i) Amkor shall have been satisfied with the results
of their due diligence, (ii) Amkor shall have entered into an
arrangement satisfactory to Amkor in its sole discretion, to finance the
Purchase Price in full, (iii) Amkor shall have received a fairness
opinion with respect to the terms of the transactions contemplated by
this Agreement, (iv) Amkor shall have received a tax exemption under the
Foreign Capital Promotion Law in regard to its purchase of the Business
("Tax Exemption"), and (v) the Board of Directors of Amkor shall have
<PAGE> 7
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determined that the transactions contemplated herein are in the best
interest of Amkor and Purchaser in light of all circumstances associated
with Seller and the transactions contemplated hereby."
(i) Section 1.10(i) of the Original Agreement (on page 19 of the
Original Agreement) is hereby deleted and the following shall be substituted
therefor:
"(i) Purchaser shall have a right of first refusal if Seller
intends to sell any of K1, K2, K3 or the wafer fabrication facilities to
any third party;"
1.11. Amendment of Section 1.11 "Closing" of the Original Agreement.
Section 1.11 of the Original Agreement (on page 20 of the Original
Agreement) is hereby deleted and the following shall be substituted therefor:
"The closing under this Agreement will take place at such other time,
date or place as the Parties shall mutually agree (the "Closing"). The
date on which Closing occurs is sometimes referred to herein as the
"Closing Date."
1.12. Amendment of Section 1.12 "Deliveries and Proceedings at 2
1.12. Amendment of Section 1.12 "Deliveries and Proceedings at Closing"
of the Original Agreement.
(b) Section 1.12(b)(i) and (ii) of the Original Agreement (on page 21
of the Original Agreement) is hereby deleted and the following shall be
substituted therefor:
"(i) payment of the amount stated in Schedule 1.4(a);
(ii) a certificate evidencing the deposit of the amount stated in
Schedules 1.4(b) with the Escrow Account;"
2.6. Amendment of Section 2.6. "No Changes" of the Original Agreement.
The second sentence of Section 2.6 of the Original Agreement (on page 27
of the Original Agreement) is hereby deleted and the following shall be
substituted therefor:
"Without limiting the generality of the foregoing sentence, there has
not been:"
2.13. Amendment of Section 2.13. "Consent" of the Original
<PAGE> 8
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Agreement.
The reference of "Schedule 2.10" in Section 2.13 of the Original
Agreement (on page 36 of the Original Agreement) is hereby deleted and "Schedule
2.13" shall be substituted therefor.
2.22. Amendment of Section 2.22. "Insurance" of the Original Agreement.
The entire paragraph under Section 2.22 of the Original Agreement (on
pages 42 through 43 of the Original Agreement) is hereby deleted and the
following shall be substituted therefor:
"Attached hereto as Schedule 2.22 is a complete and correct list of all
policies of insurance relating to the Business or the Purchased Assets
of which Seller is the owner, insured or beneficiary, or covering any of
the property of the Business, true, correct and complete copies of which
have been delivered to Purchaser, indicating for each policy the
carrier, the insured, type of coverage, the amounts of coverage,
deductible, premium rate, cash value if any, expiration date and any
pending claims thereunder. All such policies are in full force and
effect. The coverage provided by such policies are reasonable, in both
scope and amount, in light of the risks attendant to the Business and
the Purchased Assets. Seller has paid-in-full all premiums due on such
policies as of the Closing Date. There is no default with respect to any
provision contained in any such policy, nor has there been any failure
to give any notice or present any claim under any such policy in a
timely fashion or in the manner or detail required by the policy. Except
as set forth on Schedule 2.22, there are no outstanding unpaid premiums
or claims under such policies. No notice of cancellation or non-renewal
with respect to, or disallowance of any claim under, any such policy has
been received by Seller. Except as set forth on Schedule 2.22, Seller
has not been refused any insurance, nor has its coverage been limited by
any insurance carrier to which it has applied for insurance or with
which it has carried insurance during the last five years."
4.2 Amendment of Section 4.2 "Employees of the Business" of the Original
Agreement.2
4.2 Amendment of Section 4.2 "Employees of the Business" of the
Original Agreement.
The first sentence under Section 4.2(b) of the Original Agreement (on
page 46 of the Original Agreement) is hereby deleted and the following shall be
substituted
<PAGE> 9
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therefor:
"With respect to the Transferred Employees who elect to terminate their
employment with Seller and commence new employment relation with
Purchaser, Seller shall pay, in a timely manner in accordance with the
requirements of the Labor Standards Act and current company practices,
all salary, bonuses, allowances, severance, unused leave (including the
pro rata portion of accrued but unused leave attributable to the portion
of the 1999 calendar year prior to closing) and any other monetary
obligations or claims relating to the Transferred Employees' employment
with Seller or its Affiliates that may have accrued to those personnel
prior to their separation."
4.7 Amendment of Section 4.7 "Transition Services" of the Original
Agreement.
The entire paragraph under Section 4.7(a) of the Original Agreement (on
page 53 of the Original Agreement) is hereby deleted and the following shall be
substituted therefor:
"(a) During a certain period from the Closing Date (the "Transition
Period") to be separately agreed by the Parties, Seller shall ensure
that the Business is continued to be provided with all of the services
and parts and components currently provided to the Business by Seller or
any Person affiliated with Seller including, among other things, the
research and development, accounting, data processing, materials
procurement, electronic data processing, administrative services and all
other such support services as are reasonably required in connection
with the operation of the Business, on the terms and conditions not less
favorable than the terms and conditions pursuant to which such services
and parts and components are now being provided to the Business.
Purchaser shall pay a reasonable fee for the services to be provided by
Seller during the Transition Period, as mutually agreed by the Parties.
Prior to the Closing, Seller and Purchaser shall enter into a service
agreement ("Transition Service Agreement") to ensure such continued
services during the Transition Period, in such form and substance as
attached hereto as Schedule 4.7."
5.11 Amendment of Section 5.11 "Arbitration" of the Original
Agreement.
Section 5.11 (a) of the Original Agreement (on page 59 of the Original
Agreement) is hereby deleted in its entirety and the following shall be
substituted therefor.
<PAGE> 10
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"(a) Any dispute arising under this Agreement which is not
settled after good faith attempts by the Parties to amicably resolve
such dispute shall be resolved by final and binding arbitration. The
arbitration shall be held in Seoul, Korea if the arbitration is brought
by Purchaser and in [San Francisco, C.A.], United States of America if
the arbitration is brought by Seller in accordance with the Rules of
Conciliation and Arbitration of the International Chamber of Commerce
("ICC Rules") as then existing and shall be heard and determined by an
arbitral tribunal composed of three (3) arbitrators. Each of the Parties
shall appoint one arbitrator each, and both of such arbitrators shall
appoint a third arbitrator who shall serve as the Chairman of such
arbitral tribunal, provided that such third arbitrator is not a citizen
of the U.S.A. or Korea. If either Party fails or decides against
appointing an arbitrator within a period of thirty (30) days of the
appointment of the first arbitrator, or if the arbitrators designated by
the Parties fail or otherwise are unable to appoint the third arbitrator
within (30) days of the appointment of the second arbitrator, then the
remaining arbitrator(s) shall be selected by the President of the
International Chamber of Commerce, U.S.A., which shall act as the
appointing authority."
<PAGE> 11
IN WITNESS WHEREOF, the Parties have caused this AMENDMENT to be signed in their
respective names by an officer thereof duly authorized as of the date first
above written.
Amkor Technology, Inc.
By:________________________
Name:
Title:
Anam Semiconductor, Inc.
By:________________________
Name:
Title:
<PAGE> 1
EXHIBIT 10.1
INTELLECTUAL PROPERTY TRANSFER AND LICENSE AGREEMENT
THIS INTELLECTUAL PROPERTY TRANSFER AND LICENSE AGREEMENT (the
"Agreement") is entered into effective as of May 6, 1999 (the "Effective Date"),
by and between Amkor Technology Korea, Inc. ("Amkor"), a corporation organized
under the laws of the Republic of Korea, and Anam Semiconductor, Inc. ("Anam"),
a corporation organized under the laws of the Republic of Korea and having
offices in Seoul, Korea (each of Amkor and Anam, a "Party"; together, the
"Parties").
W I T N E S S E T H:
WHEREAS, the Parties have entered into that certain "Asset Purchase
Agreement" dated as of December 30, 1998, pursuant to which Amkor shall acquire
from Anam certain assets related to Anam's K4 packaging facility;
WHEREAS, In connection with such acquisition, Amkor will acquire certain
intellectual property rights and license certain other intellectual property
rights from Anam;
WHEREAS, Anam will license from Amkor certain intellectual property
rights.
NOW, THEREFORE, in consideration of the mutual covenants and promises
contained herein, the Parties hereby agree as follows:
ARTICLE 1.
CONSTRUCTION AND DEFINITIONS
SECTION 1.1. Construction.
(a) All references in this Agreement to "Articles," "Sections"
and "Exhibits" refer to the articles, sections and exhibits of this Agreement.
(b) As used in this Agreement, neutral pronouns and any
variations thereof shall be deemed to include the feminine and masculine and all
terms used in the singular shall be deemed to include the plural, and vice
versa, as the context may require.
(c) The words "hereof," "herein" and "hereunder" and other words
of similar import refer to this Agreement as a whole, as the same may from time
to time be amended or supplemented, and not to any subdivision contained in this
Agreement.
(d) The word "including" when used herein is not intended to be
exclusive and means "including, without limitation."
SECTION 1.2. Definitions. As used herein:
(a) "Anam Facilities" means Anam's "K1," "K2" and "K3"
semiconductor packaging facilities located in and around Seoul, Korea.
<PAGE> 2
(b) "Bankruptcy Event" means any of the following events or
circumstances with respect to a Party: such Party (i) ceases conducting its
business; (ii) makes a general assignment for the benefit of its creditors;
(iii) petitions, applies for, or suffers or permits with or without its consent
the appointment of a custodian, receiver, trustee in bankruptcy or similar
officer for all or any substantial part of its business or assets; or (iv)
avails itself or becomes subject to any proceeding under the U.S. Bankruptcy
Code or any similar state, federal or foreign statute relating to bankruptcy,
insolvency, reorganization, receivership, arrangement, adjustment of debts,
dissolution or liquidation, which proceeding is not dismissed within sixty (60)
days of commencement thereof.
(c) "Change of Control" means, with respect to a Party: (A) the
direct or indirect acquisition of either (i) the majority of the voting stock of
such Party or (ii) all or substantially all of the assets of such Party, by
another entity in a single transaction or series of related transactions; or (B)
such Party is merged with, or into, another entity.
(d) "Confidential Information" means (i) any information
disclosed by one Party (the "Disclosing Party") to the other (the "Receiving
Party"), which, if in written, graphic, machine-readable or other tangible form
is marked as "Confidential" or "Proprietary", or which, if disclosed orally or
by demonstration, is identified at the time of initial disclosure as
confidential and reduced to a writing marked "Confidential" and delivered to the
Receiving Party within thirty (30) days of such disclosure; and (ii) the terms
of this Agreement as set forth in Section 8.3.
(e) "Intellectual Property Rights" means all rights of a Person
in, to, or arising out of: (i) any U.S., international or foreign patent,
utility model or registered design or any application therefor and any and all
reissues, divisions, continuations, renewals, extensions and
continuations-in-part thereof; (ii) inventions (whether patentable or not in any
country), invention disclosures, improvements, trade secrets, proprietary
information, know-how, technology and technical data; (iii) copyrights,
copyright registrations, mask works, mask work registrations, and applications
therefor in the U.S. or any foreign country, and all other rights corresponding
thereto throughout the world; (iv) moral rights; and (v) any other proprietary
rights anywhere in the world similar to those described in this definition,
including, without limitation, rights in registered computer programs.
(f) "License Term" means the time period commencing on the
Effective Date and ending on the earlier of the expiration or termination of
that certain "Packaging & Test Services Agreement" by and among Amkor
Technology, Inc., Amkor Electronics, Inc., C.I.L. Limited, Anam USA, Inc. and
Anam Industrial Co., Ltd.
(g) "Person" means any legal person or entity, including any
individual, corporation, partnership, joint venture, association, joint stock
company, trust, unincorporated association, limited liability corporation,
governmental entity, or other person or entity of similar nature.
(h) "Subsidiary" of a first entity means any corporation or other
entity that is directly or indirectly controlling, controlled by or under common
control with such first entity.
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<PAGE> 3
For the purpose of this definition, "control" shall mean the direct or indirect
ownership of fifty percent (50%) or more of the shares of the subject entity
entitle to vote in the election of directors (or, in the case of an entity that
is not a corporation, for the election of managing authority).
(i) "Term" means the term of this Agreement as set forth in
Section 11.1.
(j) "Type A Materials" means those documents and other materials
listed on Exhibit B attached hereto and all derivative works and compilations
thereof.
(k) "Type A Patents" means the patents listed on Exhibit A
attached hereto, the patent applications listed on Exhibit D attached hereto,
all patents issuing therefrom and all reissues, renewals, extensions,
continuations, continuations-in-part, divisions and reexaminations thereof and
foreign and domestic counterparts of all of the foregoing.
(l) "Type B Materials" means all materials, documents,
information and data of Anam ("Materials") relating to the K4 packaging facility
and all other Materials provided to or learned by Amkor.
(m) "Type B Patents" means all patents and patent applications
owned or controlled by Anam, and all reissues, renewals, extensions,
continuations, continuations-in-part, divisions and reexaminations thereof and
foreign and domestic counterparts of all of the foregoing, other than Type A
Patents, including the patents and patent applications listed on Exhibit E
attached hereto.
ARTICLE 2.
TYPE A PATENTS
SECTION 2.1. Assignment to Amkor. Anam hereby irrevocably transfers,
conveys and assigns to Amkor in perpetuity all worldwide right, title and
interest in and to the Type A Patents. In furtherance of the foregoing, upon
Amkor's request, Anam shall execute and deliver to Amkor a patent assignment
substantially in the form attached hereto as Exhibit C.
SECTION 2.2. License to Anam. Amkor hereby grants to Anam a
royalty-free, nonexclusive, worldwide, transferable, sublicensable, royalty-free
license under the Type A Patents during the License Term to make in the Anam
Facilities, use, sell and import any product and practice any process in the
Anam Facilities.
ARTICLE 3.
TYPE B PATENTS
SECTION 3.1. License to Amkor. Anam hereby grants to Amkor and its
Subsidiaries a royalty-free, perpetual, irrevocable, nonterminable,
nonexclusive, worldwide, transferable, sublicensable, royalty-free license under
the Type B Patents to make, have made, use, sell, offer for sale and import any
product and practice any process.
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<PAGE> 4
ARTICLE 4.
TYPE A MATERIALS
SECTION 4.1. Assignment to Amkor. Anam hereby irrevocably transfers,
conveys and assigns to Amkor in perpetuity all worldwide right, title and
interest in and to the Type A Materials, including without limitation (i) Anam's
trade secret rights in the information contained in the Type A Materials, (ii)
Anam's copyrights and maskwork rights in the Type A Materials, (iii) the right
to file in Amkor's name patents on inventions disclosed in the Type A Materials
and any other application for or registration of any Intellectual Property Right
in or to any of the Type A Materials in Amkor's sole discretion, and (iv) all
other Intellectual Property Rights in and to any of the Type A Materials
(collectively, the "Type A IP").
SECTION 4.2. Confidential Information. The information contained in the
Type A Materials is and shall become Amkor's Confidential Information.
SECTION 4.3. License to Anam. Amkor hereby grants to Anam a
nonexclusive, worldwide, transferable, sublicensable, royalty-free license under
the Type A IP during the License Term to make in the Anam Facilities, use, sell
and import any product and practice in the Anam Facilities any process.
ARTICLE 5.
TYPE B MATERIALS
SECTION 5.1. License to Amkor. Anam hereby grants to Amkor and its
Subsidiaries a royalty-free, perpetual, irrevocable, nonterminable,
nonexclusive, worldwide, transferable, sublicensable license under Anam's
existing and future Intellectual Property Rights in and to the Type B Materials
to make, have made, use, sell, offer for sale and import any product and
practice any process.
ARTICLE 6.
DELIVERY OF MATERIALS
SECTION 6.1. Delivery. Within five (5) days of the Closing (as such term
is defined in the Asset Purchase Agreement), Anam shall, in connection with the
transfer of the assets of Anam's K4 semiconductor packaging facility to Amkor,
deliver to Amkor copies of the Type A Materials and the Type B Materials (the
date of such delivery, the "Transfer Date").
ARTICLE 7.
NEW TECHNOLOGY SHARING
SECTION 7.1. Meeting; Delivery.
(a) The Parties shall hold regular meetings of an engineering
council substantially similar to the meetings held by representatives of the K1,
K2, K3 and K4 packaging facilities prior to the Effective Date. Anam shall
ensure that representatives of Amkor are invited to, and
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<PAGE> 5
given reasonable opportunity to attend, all such meetings and any similar
technology sharing meetings.
(b) No less frequently than once per calendar quarter, the
Parties shall meet to discuss inventions and know-how ("New Technology") created
or acquired by each of the Parties since the last such meeting or, in the case
of the first such meeting, since the Transfer Date. With respect to each item of
New Technology, upon mutual agreement of the Parties, the Party owning or
controlling, as the case may be, such item of New Technology shall (i) disclose
such item of New Technology to the other Party and grant such other Party a
license under the disclosing Party's intellectual property rights to make, have
made, use, sell, offer for sale and import any products and practice any
processes. The foregoing obligation shall not apply to any item of New
Technology or any Intellectual Property Right owned or controlled by a purchaser
of or successor to Amkor, which item or right was not acquired from Amkor.
SECTION 7.2. Jointly Developed Technology. The Parties shall own jointly
developed works of authorship and jointly developed inventions, including all
Intellectual Property Rights associated therewith, jointly, without a duty to
account.
ARTICLE 8.
CONFIDENTIAL INFORMATION
SECTION 8.1. Confidential Information and Exclusions. Notwithstanding
Section 1.2(d), Confidential Information shall exclude information that the
Receiving Party can demonstrate:
(a) was independently developed by the Receiving Party without
any use of the Disclosing Party's Confidential Information or by the Receiving
Party's employees or other agents (or independent contractors hired by the
Receiving Party) who have not been exposed to the Disclosing Party's
Confidential Information;
(b) becomes known to the Receiving Party, without restriction,
from a source other than the Disclosing Party, which source has no duty of
confidentiality with respect thereto;
(c) was in the public domain at the time it was disclosed or
becomes in the public domain through no act or omission of the Receiving Party;
or
(d) was rightfully known to the Receiving Party, without
restriction, at the time of disclosure;
except that neither Section 8.1(a) nor Section 8.1(d) shall be considered in
determining whether the Type A Materials is Amkor's Confidential Information.
SECTION 8.2. Confidentiality Obligation. The Receiving Party shall treat
as confidential all of the Disclosing Party's Confidential Information. Without
limiting the foregoing, the Receiving Party shall use at least the same degree
of care which it uses to prevent the disclosure of its own confidential
information of like importance, but in no event with less than reasonable care,
to prevent the disclosure of the Disclosing Party's Confidential Information.
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<PAGE> 6
Notwithstanding the foregoing, Amkor shall have the right to disclose Anam's
Confidential Information to Amkor's Subsidiaries pursuant to an agreement
containing provisions at least as protective of such Confidential Information as
this Article 8.
SECTION 8.3. Confidentiality of Agreement. Each Party agrees that the
terms and conditions, but not the existence, of this Agreement shall be treated
as the other's Confidential Information and that no reference to the terms and
conditions of this Agreement or to activities pertaining thereto can be made in
any form of public or commercial advertising without the prior written consent
of the other Party; provided, however, that each Party may disclose the terms
and conditions of this Agreement: (i) as required by any court or other
governmental body; (ii) as otherwise required by law; (iii) to legal counsel of
the Parties; (iv) in connection with the requirements of an initial public
offering or securities filing or offering; (v) in confidence, to accountants,
banks, and financing sources and their advisors; (vi) in confidence, in
connection with the enforcement of this Agreement or rights under this
Agreement; or (vii) in confidence, in connection with a merger or acquisition or
proposed merger or acquisition, or the like.
SECTION 8.4. Compelled Disclosure. If a Receiving Party believes that it
will be compelled by a court or other authority to disclose Confidential
Information of the Disclosing Party, it shall give the Disclosing Party prompt
written notice so that the Disclosing Party may take steps to oppose such
disclosure.
SECTION 8.5. Remedies. Unauthorized use by a Party of the other Party's
Confidential Information will diminish the value of such information. Therefore,
if a Party breaches any of its obligations with respect to confidentiality or
use of Confidential Information hereunder, the other Party shall be entitled to
seek equitable relief to protect its interest therein, including injunctive
relief, as well as money damages.
SECTION 8.6. Residuals. Each Party shall be free, and each Party hereby
grants to the other Party the right, to use for any purpose the Residuals
resulting from access to or work with the Confidential Information. "Residuals"
means information retained in the unaided memory of an individual who has had
access to Confidential Information without conscious attempt by such individual
to memorize such information. Neither Party shall have any obligation to limit
or restrict the assignment of any individual who has had access to the other
Party's Confidential Information or to pay royalties for any work resulting from
the use of Residuals. However, the foregoing shall not be deemed to grant to
either Party a license under the other Party's copyrights or patents.
ARTICLE 9.
WARRANTIES, DISCLAIMERS AND INDEMNITIES
SECTION 9.1. General Warranty. Each Party hereby represents and warrants
to the other that: (i) all corporate action on the part of such Party, its
officers, directors and shareholders necessary for the authorization of this
Agreement and the performance of all obligations of such Party hereunder has
been taken; and (ii) this Agreement, when executed and delivered, will be a
valid and binding obligation of such Party enforceable in accordance with its
terms.
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<PAGE> 7
SECTION 9.2. No Conflict. Each Party hereby represents and warrants to
the other that such Party's making of this Agreement and performance hereunder
does not and will not violate any agreement existing between such Party and any
third party.
SECTION 9.3. Intellectual Property. Anam hereby represents and warrants
to Amkor that, to the best of Anam's knowledge: (i) the Type A Materials, the
Type B Materials and Amkor's use thereof as authorized herein will not infringe
any Intellectual Property Right of any third party; (ii) neither the Type A
Materials nor the Type A Patents are subject to any third-party lien or
encumbrance; (iii) no third party is infringing or misappropriating or has
infringed or misappropriated: (A) any claim of any of the Type A Patents or the
Type B Patents or (B) any other Intellectual Property Right in or to the Type A
Materials or the Type B Materials; and (iv) all Intellectual Property Rights
transferred or licensed to Amkor hereunder are valid and subsisting, and no
grounds exist to invalidate or render unenforceable any such Intellectual
Property Right.
SECTION 9.4. Disclaimer. EXCEPT AS EXPRESSLY SET FORTH HEREIN, NEITHER
PARTY MAKES ANY WARRANTIES OR CONDITIONS, EXPRESS, STATUTORY, IMPLIED, OR
OTHERWISE, WITH RESPECT TO ANY PRODUCT OR SERVICE PROVIDED HEREUNDER, AND EACH
PARTY HEREBY DISCLAIMS THE IMPLIED WARRANTIES AND CONDITIONS OF NONINFRINGEMENT
OF THIRD PARTY RIGHTS, SATISFACTORY QUALITY, MERCHANTABILITY AND FITNESS FOR A
PARTICULAR PURPOSE WITH RESPECT THERETO.
SECTION 9.5. Indemnity. Anam shall indemnify and hold Amkor, its
affiliates and customers harmless from and against all loss, cost, liability,
damage and expense suffered or incurred by any of them in connection with any
breach by Anam of any warranty set forth herein.
ARTICLE 10.
LIABILITY LIMITATIONS
SECTION 10.1. Exclusion of Damages. EXCEPT IN CONNECTION WITH A BREACH
OF A PROVISION OF ARTICLE 8, IN NO EVENT SHALL EITHER PARTY BE LIABLE TO THE
OTHER FOR ANY INDIRECT, SPECIAL, INCIDENTAL OR CONSEQUENTIAL DAMAGES, WHETHER
BASED ON BREACH OF CONTRACT, TORT (INCLUDING NEGLIGENCE), PRODUCT LIABILITY, OR
OTHERWISE, AND WHETHER OR NOT THE PARTY AGAINST WHOM LIABILITY IS SOUGHT HAS
BEEN ADVISED OF THE POSSIBILITY OF SUCH DAMAGE.
SECTION 10.2. Failure of Essential Purpose. The limitations specified in
this ARTICLE 10 shall survive and apply even if any limited remedy specified in
this Agreement is found to have failed of its essential purpose.
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<PAGE> 8
ARTICLE 11.
TERM AND TERMINATION
SECTION 11.1. Term. Unless earlier terminated in accordance with Section
11.2, the term ("Term") of this Agreement shall commence on the Effective Date
and continue in full force and effect until the Parties agree to mutually
terminate this Agreement.
SECTION 11.2. Default. If either Party defaults in the performance of
any of its material obligations hereunder, such Party shall use its best efforts
to correct such default within thirty (30) days (or such additional time as the
Parties may agree) after written notice thereof from the other Party. If any
such default cannot be, or is not, corrected within such thirty (30)-day period,
then the non-defaulting Party shall have the right, in addition to any other
remedies it may have, to terminate this Agreement by giving written notice to
the Party in default.
SECTION 11.3. Survival. The following provisions of this Agreement shall
survive any expiration or termination hereof: Articles 1, 3, 5, 8, 9, 10, 11, 12
and 13 and Sections 2.1, 4.1 and 4.2.
ARTICLE 12.
ARBITRATION
SECTION 12.1. Arbitration of Disputes.
(a) Any dispute arising out of, in connection with, or in
relation to the interpretation, performance or breach of this Agreement,
including any claim based on contract, tort or statute, which is not settled
after good faith attempts by the Parties to amicably resolve such dispute shall
be resolved by final and binding arbitration. The arbitration shall be held in
Seoul, Korea if the arbitration is brought by Amkor and in San Francisco,
California, United States of America if the arbitration is brought by Seller in
accordance the Rules of Conciliation and Arbitration of the International
Chamber of Commerce ("ICC Rules") as then existing and shall be heard and
determined by an arbitration tribunal composed of three (3) arbitrators. Each of
the Parties shall appoint one arbitrator each, and both of such arbitrators
shall appoint a third arbitrator who shall serve as the Chairman of such
arbitration tribunal, provided that such third arbitrator is not a citizen of
the United States of America of Korea. If either party fails or decides against
appointing an arbitrator within a period of thirty (30) days of the appointment
of the first arbitrator, or if the arbitrators designated by the Parties fail or
otherwise are unable to appoint the third arbitrator within (30) days of the
appointment of the second arbitrator, then the remaining arbitrator (s) shall be
selected by the President of the International Chamber of Commerce, U.S.A.,
which shall act as the appointing authority.
(b) All arbitration proceedings shall be conducted in the English
language and the arbitration award (the "Award") shall be rendered no later than
six (6) months from the commencement of the arbitration or as otherwise provided
by the ICC Rules, unless otherwise extended by the arbitration tribunal for no
more than an additional six (6) months for reasons that are just and equitable.
-8-
<PAGE> 9
(c) The Parties expressly understand and agree that the Award
shall be the sole, exclusive, final and binding remedy between them regarding
any and all disputes presented to the arbitration tribunal. Each Party hereby
expressly waives any and all rights that such Party may have with respect to a
judicial review of the Award in the courts having jurisdiction over the Party
(or its assets) against whom the Award is rendered for a judicial acceptance of
the Award and an order of enforcement.
(d) Notwithstanding any other provision of this Agreement, either
Party shall be entitled to seek preliminary injunctive relief from any court of
competent jurisdiction pending the final decision or award of the arbitrators.
Any arbitration shall be held before a single arbitrator, who shall be selected
in accordance
ARTICLE 13.
MISCELLANEOUS
SECTION 13.1. Further Assurances. At any time, and from time to time,
Anam shall forthwith, upon Amkor's (or its successors' or assigns') request,
take any and all steps necessary to execute, acknowledge and deliver to Amkor
(or its successors or assigns), any and all further instruments and assurances
(including, without limitation, assignments of patent and copyright rights and
patent applications) necessary or expedient in order to invest all right, title
and interest in the Type A Patents and Type A Materials in Amkor (or its
successors or assigns) and to facilitate Amkor's (or its successors' and
assigns') enjoyment, enforcement and recordation of such rights. Anam hereby
constitutes and appoints Amkor as Anam's true and lawful attorney-in-fact with
full power of substitution, in Anam's name, place and stead to take any and all
steps, including proceedings at law, in equity or otherwise, to execute,
acknowledge and deliver any and all documents, instruments and assurances
necessary or expedient in order to vest, record or perfect all Amkor's (or its
successors' or assigns') rights in the Type A Patents and Type A Materials, to
protect the same, or to enforce any claim or any right of any kind with respect
thereto. This includes, but is not limited to, any rights with respect to the
Type A Patents and Type A Materials that may have accrued in Anam's favor at any
time prior to the date of this Agreement. Anam hereby declares that the
foregoing power is coupled with an interest and, as such, is irrevocable.
Without limiting the foregoing, Anam shall, upon Amkor's request, provide to
Amkor all reasonable cooperation in connection with the application for or
registration of Intellectual Property Rights in or to the Type A Patents and/or
the Type A Materials, including without limitation cooperation in connection
with the prosecution of the patent applications included in the Type A Patents.
SECTION 13.2. Licensor Bankruptcy. All rights and licenses granted to
Amkor pursuant to this Agreement are, and shall otherwise be deemed to be, for
purposes of Section 365(n) of Title 11 of the United States Code (the
"Bankruptcy Code"), licenses to rights of "intellectual property" as defined
thereunder. Notwithstanding any provision contained herein to the contrary, if
Anam is under any proceeding under the Bankruptcy Code and the trustee in
bankruptcy of Anam, or Anam as a debtor in possession, rightfully elects to
reject this Agreement, Amkor may, pursuant to Sections 365(n)(1) and (2) of the
Bankruptcy Code, retain any and all of Amkor's rights hereunder, to the maximum
extent permitted by law, subject to Amkor's making the payments specified
herein.
-9-
<PAGE> 10
SECTION 13.3. Governing Law. THIS AGREEMENT SHALL BE GOVERNED BY AND
INTERPRETED IN ACCORDANCE WITH THE LAWS OF THE REPUBLIC OF KOREA, WITHOUT
REFERENCE TO CONFLICT OF LAWS PRINCIPLES.
SECTION 13.4. Independent Contractors. The Parties are independent
contractors. Nothing contained herein or done pursuant to this Agreement shall
constitute either Party the agent of the other Party for any purpose or in any
sense whatsoever, or constitute the Parties as partners or joint venturers.
SECTION 13.5. Assignment. Anam shall not assign or delegate this
Agreement, or any of its rights or duties hereunder, directly, indirectly, by
operation of law, in connection with a Change of Control or otherwise, and any
such purported assignment or delegation shall be void, except with the express
written permission of Amkor in its sole discretion. Amkor may assign or delegate
this Agreement and any of Amkor's rights or duties hereunder in Amkor's sole
discretion.
SECTION 13.6. Amendment. No alteration, amendment, waiver, cancellation
or any other change in any term or condition of this Agreement shall be valid or
binding on either Party unless mutually assented to in writing by both Parties.
SECTION 13.7. No Waiver. The failure of either Party to enforce at any
time any of the provisions of this Agreement, or the failure to require at any
time performance by the other Party of any of the provisions of this Agreement,
shall in no way be construed to be a present or future waiver of such
provisions, nor in any way affect the validity of either Party to enforce each
and every such provision thereafter. The express waiver by either Party of any
provision, condition or requirement of this Agreement shall not constitute a
waiver of any future obligation to comply with such provision, condition or
requirement.
SECTION 13.8. Severability. If, for any reason, a court of competent
jurisdiction finds any provision of this Agreement, or portion thereof, to be
invalid or unenforceable, such provision of the Agreement will be enforced to
the maximum extent permissible so as to effect the intent of the Parties, and
the remainder of this Agreement will continue in full force and effect. The
Parties agree to negotiate in good faith an enforceable substitute provision for
any invalid or unenforceable provision that most nearly achieves the intent and
economic effect of such provision.
SECTION 13.9. Notices. All notices, requests, demands, waivers, and
other communications required or permitted hereunder shall be in writing and
shall be deemed to have been duly given: (i) when delivered by hand or confirmed
facsimile transmission; (ii) one day after delivery by receipted overnight
delivery; or (iii) four days after being mailed by certified or registered mail,
return receipt requested, with postage prepaid to the following, or to such
other person or address as either Party shall furnish to the other Party in
writing pursuant to the above:
(a) in the case of notices to Amkor, to the attention of the
General Counsel at the relevant address set forth on the first page hereof, with
a copy to Selwyn B. Goldberg, Esq., Wilson Sonsini Goodrich & Rosati, 650 Page
Mill Road, Palo Alto, CA 94304.
-10-
<PAGE> 11
(b) in the case of notices to Anam, to [ ].
SECTION 13.10. Titles and Subtitles. The titles and subtitles used in
this Agreement are used for convenience only and are not to be considered in
construing or interpreting this Agreement.
SECTION 13.11. Entire Agreement. The terms and conditions herein
contained and the referenced Exhibits which are hereby incorporated herein by
reference constitute the entire agreement between the Parties with respect to
the subject matter hereof and supersede all previous and contemporaneous
agreements and understandings, whether oral or written, between the Parties with
respect to the subject matter hereof.
SECTION 13.12. Counterparts. This Agreement may be executed in
counterparts or duplicate originals, both of which shall be regarded as one and
the same instrument, and which shall be the official and governing version in
the interpretation of this Agreement.
*** End of Agreement ***
-11-
<PAGE> 12
IN WITNESS WHEREOF, the Parties have caused this Agreement to be
executed by duly authorized officers or representatives to be effective as of
the date first above written.
Amkor Technology, Inc. Anam Semiconductor, Inc.
By: /s/ By: /s/
---------------------------- ----------------------------
Name: Name:
-------------------------- --------------------------
Title: Title:
------------------------- -------------------------
-12-
<PAGE> 13
Exhibit A
<TABLE>
<CAPTION>
HEAT SINK PATENTS
No. Title Inventor Appl No. Filing Date Req. Date Patent Assignee Remark
- ------------------------------------------------------------------------------------------------------------------------------------
<S> <C> <C> <C> <C> <C> <C> <C> <C>
AP-094 Semiconductor package having heatsink D.H. Moon 94-22437 Sep 7, '94 Dec 26, '97 P137066 Anam
and method of manufacturing
it (Heatsink structure)
- ------------------------------------------------------------------------------------------------------------------------------------
AP-108 Semiconductor package (Making heatsink W.S. Shin 94-25862 Oct 10, '94 Dec 26, '97 P134933 Anam
when it's easy to eject in
molding process)
- ------------------------------------------------------------------------------------------------------------------------------------
AP-109 A method of manufacturing for J.Y Jung 94-25863 Oct 10, '94 Jan 23, '98 P137325 Anam
semiconductor package (Attaching
heatsink at last time)
- ------------------------------------------------------------------------------------------------------------------------------------
AP-111 Apparatus of attaching tape for L.H. Kim 94-27136 Oct 24, '94 Mar 31, '98 P144313 Anam
preventing heatsink plating
- ------------------------------------------------------------------------------------------------------------------------------------
AP-114 Method of attaching between heatsink B.T. Dho 94-28904 Nov 4, '94 May 22, '98 P159965 Anam
and leadframe of semiconductor package
- ------------------------------------------------------------------------------------------------------------------------------------
AU-128 Structure of heatspreader for K.J. Kim 94-33576 Dec 10, '94 Jan 23, '98 U117453 Anam
semiconductor package
- ------------------------------------------------------------------------------------------------------------------------------------
AP-181 Method of eliminating tape attached L.H. Kim 94-39353 Dec 30, '94 Feb 26, '98 P142135 Anam
in heatsink
- ------------------------------------------------------------------------------------------------------------------------------------
BGA PATENTS
No. Title Inventor Appl No. Filing Date Req. Date Patent Assignee Remark
- ------------------------------------------------------------------------------------------------------------------------------------
AP-027 Semiconductor package (BGA + PQ) N.H. Kwak 93-27078 Dec 9, '93 Sep 25, '97 P127737 Anam
- ------------------------------------------------------------------------------------------------------------------------------------
AP-091 Cap type BGA package and method Y.W. Heo 94-21781 Aug 31, '94 Mar 31, '98 P144311 Anam
of manufacturing it
- ------------------------------------------------------------------------------------------------------------------------------------
LEADFRAME PATENTS
No. Title Inventor Appl No. Filing Date Req. Date Patent Assignee Remark
- ------------------------------------------------------------------------------------------------------------------------------------
AP-035 Surface mounting integrated circuit G. Lee 94-01773 Jan 31, '94 Sep 12, '97 P124790 Anam
package (BLP)
- ------------------------------------------------------------------------------------------------------------------------------------
45 Plastic mold package with heatsink Rorert 94-05545 Mar 19, '94 Jun 30, '97 P126052
- ------------------------------------------------------------------------------------------------------------------------------------
</TABLE>
-1-
<PAGE> 14
<TABLE>
<CAPTION>
No. Title Inventor Appl No. Filing Date Req. Date Patent Assignee Remark
- ------------------------------------------------------------------------------------------------------------------------------------
<S> <C> <C> <C> <C> <C> <C> <C> <C>
46 Forming method of plastic mold package Rorert 94-05546 Mar 19, '94 Jun 30, '97 P126053
with heatsink
- ------------------------------------------------------------------------------------------------------------------------------------
PKG PATENTS
No. Title Inventor Appl No. Filing Date Req. Date Patent Assignee Remark
1 Safe setting method for solder ball 93-15983 P105750
for integrated circuit package (BGA)
- ------------------------------------------------------------------------------------------------------------------------------------
2 Method of decreasing bending for 93-15984 P122789
integrated circuit package (BGA)
- ------------------------------------------------------------------------------------------------------------------------------------
3 Mold runner removal from a 93-15985 P128174
substrate-based packaged electronic
device (BGA, Gold gate)
- ------------------------------------------------------------------------------------------------------------------------------------
4 Semiconductor package (BGA+PQ) 93-27078 P127737
- ------------------------------------------------------------------------------------------------------------------------------------
5 Method of mounting chip for BGA 94-02982 P131392
semiconductor package and structure
using the same (Double Adhesive)
- ------------------------------------------------------------------------------------------------------------------------------------
6 Cap type BGA package and method of 94-21781 P144311
manufacturing it
- ------------------------------------------------------------------------------------------------------------------------------------
7 Method for checking wire bonding in 94-24280 P131389
result of BGA package
- ------------------------------------------------------------------------------------------------------------------------------------
8 Semiconductor package (Consists of 94-39354 P167141
metal cap and advanced adhesive)
- ------------------------------------------------------------------------------------------------------------------------------------
9 Method for leveling solder ball array 95-10418 P179473
in BGA semiconductor package
- ------------------------------------------------------------------------------------------------------------------------------------
11 BGA semiconductor package with improved 95-19582 P159987
heat dissipation and dehumidification
- ------------------------------------------------------------------------------------------------------------------------------------
19 Printed circuit board having epoxy 95-37513 P170024
barrier around its throughout slot
and ball grid array semiconductor
package using such a printed circuit
board, thereby exhibiting a high
moisture discharge characteristic
- ------------------------------------------------------------------------------------------------------------------------------------
119 Method of decreasing bending for 97-10103 P122847
integrated circuit package (BGA)
- ------------------------------------------------------------------------------------------------------------------------------------
</TABLE>
-2-
<PAGE> 15
Exhibit B
Type A Materials
I. All documents, databases and other materials in Anam's possession or
control, whether in printed, electronic or other form, describing, addressing,
related to or useful in connection with any of the following topics:
A. With respect to TSOP/TSSOP/SSOP:
1. General leadframe design rules including strip configurations and
die design guidelines.
2. Wafer Backgrinding process recipe for optimized surface finish
and residual stress.
3. Leadframe design criteria specific to ePad TSSOP delamination
control.
4. Low loop and second stitch on ball wire bonding process recipes.
5. Dispense tool design criteria for thermally enhanced epoxy
processing.
6. ePad TSSOP deflashing process and recipe.
7. ePad process flow for delamination enhancement.
B. Generally:
1. Tape design rules, including with respect to lead length/notch
width, reliability, yield and quality.
2. Tape to frame lamination material and process.
3. Elastomer material, including with respect to thickness,
supplier, type, reliability and manufacturability.
4. Frame design, including with respect to cost reduction.
5. Elastomer to tape to die size design rules, including issues with
respect to quality and yield optimization.
6. Multiple unit punching of elastomer onto tape sites, including
with respect to cost reduction.
7. D/A process and optimization methodology, including with respect
to time/press/temp to meet MRT.
-1-
<PAGE> 16
8. Lead bond parameters (90E and 45E leads) (to allow reliable perf)
9. Coverlay tape material, including with respect to specific
adhesion level but with release properties.
10. Coverlay tape attach process (void free).
11. Encap material prep, including with respect to filtering/mixing.
12. Encap dispense/vacuum/cure process (high speed/void free).
13. Solderball attach process, including with respect to small balls
and multiple units on strip.
14. Mark (laser mark on Si backside without die damage).
15. Singulation (process parameters to avoid burrs).
-2-
<PAGE> 17
II. The following drawings and all information contained therein:
<TABLE>
<CAPTION>
================================================================================
DRAWING # TITLE
================================================================================
<S> <C>
001 0501 2099 BGA Standard Process Description
- --------------------------------------------------------------------------------
001 0307 2025 Saw and Clean Monitor
- --------------------------------------------------------------------------------
001 0510 2495 Precure Process (before die attach)
- --------------------------------------------------------------------------------
001 0310 2033 Die Mounting Monitor
- --------------------------------------------------------------------------------
001 0311 2078 Ball Shear Test
- --------------------------------------------------------------------------------
001 0311 2465 Bond Strength Test
- --------------------------------------------------------------------------------
001 0311 2455 Wire Bond Monitor
- --------------------------------------------------------------------------------
001 0314 2032 Oven Monitor
- --------------------------------------------------------------------------------
001 0410 2637 Incoming Inspection for Die Attach Adhesive
- --------------------------------------------------------------------------------
001 0411 2694 Incoming Inspection for Bonding Wires
- --------------------------------------------------------------------------------
001 0440 2688 Incoming Inspection for PCB
- --------------------------------------------------------------------------------
001 0506 2001 Wafer Mounting Process
- --------------------------------------------------------------------------------
001 0507 2002 Wafer Sawing Process
- --------------------------------------------------------------------------------
001 0510 2042 Die Bonding for Adhesive
- --------------------------------------------------------------------------------
001 0510 2052 Adhesive Curving Process
- --------------------------------------------------------------------------------
001 0511 2044 Wire Bonding for Gold Wire
- --------------------------------------------------------------------------------
001 0511 2497 Precure Process (before wire bond)
- --------------------------------------------------------------------------------
001 0517 2496 Precure Process (before mold)
- --------------------------------------------------------------------------------
001 0417 2690 Incoming Inspection for Mold Compound
- --------------------------------------------------------------------------------
001 0513 2005 Internal Visual Inspection for Commercial Product
- --------------------------------------------------------------------------------
</TABLE>
-3-
<PAGE> 18
<TABLE>
- --------------------------------------------------------------------------------
<S> <C>
001 0313 2009 Internal Visual Lot Acceptance
- --------------------------------------------------------------------------------
001 0419 2671 Incoming Inspection for Marking/Dot Ink
- --------------------------------------------------------------------------------
001 0517 2447 Process for Molding
- --------------------------------------------------------------------------------
001 0317 2476 Mold Monitor
- --------------------------------------------------------------------------------
001 0217 2223 X-Ray Monitor Mold
- --------------------------------------------------------------------------------
001 0519 2062 Laser Marking
- --------------------------------------------------------------------------------
001 0319 2105 Laser Marking Monitor
- --------------------------------------------------------------------------------
================================================================================
DRAWING # TITLE
================================================================================
001 0519 2062 Marking
- --------------------------------------------------------------------------------
001 0319 2105 Marking Monitor
- --------------------------------------------------------------------------------
001 0514 2038 Post Mold Cure
- --------------------------------------------------------------------------------
001 0314 2032 Oven Monitor
- --------------------------------------------------------------------------------
001 0319 2472 Marking Permanency Test
- --------------------------------------------------------------------------------
001 0431 2083 Procurement Spec for Shipping Tray
- --------------------------------------------------------------------------------
001 0340 2482 Solder Ball Attach Monitor
- --------------------------------------------------------------------------------
001 0340 2481 Solder Ball Shear Strength Test
- --------------------------------------------------------------------------------
001 0521 2014 DTFS for Plastic Packages
- --------------------------------------------------------------------------------
001 0422 2666 Anode & Solder Incoming Inspection
- --------------------------------------------------------------------------------
001 0540 2624 Solder Ball Attach Process
- --------------------------------------------------------------------------------
001 0321 2259 DTFS Monitor (Deflash/Trim/Form/Singulation)
- --------------------------------------------------------------------------------
001 0530 2623 Final Visual Inspection
- --------------------------------------------------------------------------------
001 0330 2010 Final V/M Lot Acceptance
- --------------------------------------------------------------------------------
</TABLE>
-4-
<PAGE> 19
<TABLE>
- --------------------------------------------------------------------------------
<S> <C>
001 0531 2247 Dry Packing
- --------------------------------------------------------------------------------
001 0331 2248 Dry Packing Monitor
- --------------------------------------------------------------------------------
001 0531 2234 Packing Operation Procedure
- --------------------------------------------------------------------------------
001 0331 2158 Packing Monitor
- --------------------------------------------------------------------------------
BODY SIZE STRIP DRAWING #
- --------------------------------------------------------------------------------
13 X 13 72132
- --------------------------------------------------------------------------------
14 X 22 72076
- --------------------------------------------------------------------------------
15 X 15 72371
- --------------------------------------------------------------------------------
17 X 17 72176
- --------------------------------------------------------------------------------
23 X 23 70821
- --------------------------------------------------------------------------------
27 x 27 70795
- --------------------------------------------------------------------------------
31 x 31 71218
- --------------------------------------------------------------------------------
35 x 35 70796
- --------------------------------------------------------------------------------
37.5 x 37.5 75312
- --------------------------------------------------------------------------------
</TABLE>
-5-
<PAGE> 20
Exhibit C
Patent Assignment
ASSIGNMENT OF PATENT RIGHTS
For good and valuable consideration, the receipt of which is hereby
acknowledged, __________, a__________ corporation, having offices at __________
("Assignor"), does hereby sell, assign, transfer and convey unto __________, a
__________ corporation, having offices at __________ ("Assignee") or its
designees, all of Assignor's right, title and interest in and to the patent
applications and patents listed below, any patents issuing on any patent
applications listed below, the inventions disclosed in any of the foregoing, any
and all counterpart United States, international and foreign patents,
applications and certificates of invention based upon or covering any portion of
the foregoing and all reissues, divisionals, renewals, extensions, provisionals,
continuations and continuations-in-part of any of the foregoing (collectively
"Patent Rights"):
<TABLE>
<CAPTION>
PATENT OR APPLICATION
NUMBER COUNTRY ISSUE OR FILING DATE TITLE AND INVENTOR(S)
- --------------------- ------- -------------------- ---------------------
<S> <C> <C> <C>
- --------------------- ------- -------------------- ---------------------
</TABLE>
Assignor represents, warrants and covenants that: (i) it is the sole owner,
assignee and holder of record title to the Patent Rights identified above, (ii)
it has obtained and properly recorded previously executed assignments for all
patent applications and patents identified above as necessary to fully perfect
its rights and title therein in accordance with governing law and regulations in
each respective jurisdiction, and (iii) it has full power and authority to make
the present assignment. Assignor shall indemnify and hold harmless Assignee for
any breach of the foregoing.
Assignor further agrees to and hereby does sell, assign, transfer and convey
unto Assignee all rights: (i) in and to causes of action and enforcement rights
for the Patent Rights including all rights to pursue damages, injunctive relief
and other remedies for past and future infringement of the Patent Rights, and
(ii) to apply in any or all countries of the world for patents, certificates of
invention or other governmental grants for the Patent Rights, including without
limitation under the Paris Convention for the Protection of Industrial Property,
the International Patent Cooperation Treaty, or any other convention, treaty,
agreement or understanding. Assignor also hereby authorizes the respective
patent office or governmental agency in each jurisdiction to issue any and all
patents or certificates of invention which may be granted upon any of the Patent
Rights in the name of Assignee, as the assignee to the entire interest therein.
-1-
<PAGE> 21
Assignor will, at the reasonable request of Assignee and without demanding any
further consideration therefor, do all things necessary, proper, or advisable,
including without limitation the execution, acknowledgment and recordation of
specific assignments, oaths, declarations and other documents on a
country-by-country basis, to assist Assignee in obtaining, perfecting,
sustaining, and/or enforcing the Patent Rights. Such assistance shall include
providing, and obtaining from the respective inventors, prompt production of
pertinent facts and documents, giving of testimony, execution of petitions,
oaths, powers of attorney, specifications, declarations or other papers and
other assistance reasonably necessary for filing patent applications, complying
with any duty of disclosure, and conducting prosecution, reexamination, reissue,
interference or other priority proceedings, opposition proceedings, cancellation
proceedings, public use proceedings, infringement or other court actions and the
like with respect to the Patent Rights.
The terms and conditions of this Assignment shall inure to the benefit of
Assignee, its successors, assigns and other legal representatives, and shall be
binding upon Assignor, its successor, assigns and other legal representatives.
IN WITNESS WHEREOF this Assignment of Patent Rights is executed at __________,
on __________.
ASSIGNOR
By:
_____________________________________________
Name:
_____________________________________________
(Notarization Required) Title:
_____________________________________________
State of )
)
______________________________ County of )
Name
On _________, 1997, before me, _________,
personally appeared ____________________'
[ ] personally known to me or [ ] proved
______________________________ to me on the basis of staisfactory
Date evidence, to be the person whose name is
subscribed to the within instrument and
acknowleged to me that he/she executed
the same in his/her authorized capacity,
and that by his/her signature on the
instrument the person or the entity upon
behalf of which the person acted,
executed the instrument.
WITNESS my hand and offical seal.
_________________________________________
(Notary Public)
-2-
<PAGE> 22
Exhibit D
Patent Applications
<TABLE>
<CAPTION>
HEAT SINK PATENTS
No. Title Inventor Appl No. Filing Date Req. Date Patent Assignee Remark
- ----------------------------------------------------------------------------------------------------------------------------------
<S> <C> <C> <C> <C> <C> <C> <C> <C>
AU-278 Heatsink structure for W.S. Shin 95-34075 Nov 17, '95 Aug 28, '98 Anam Notice of
semiconductor package (Forming Allowance
a plural of Ni/Pd layer on
heatsink)
- ----------------------------------------------------------------------------------------------------------------------------------
AP-392 Structure of semiconductor0 L.S. Yoon 96-06301 Mar 11, '96 Oct 30, '98 Anam Notice of
package (Making ground ring at Allowance
the heatsink)
- ----------------------------------------------------------------------------------------------------------------------------------
BGA PATENTS
No. Title Inventor Appl No. Filing Date Req. Date Patent Assignee Remark
- ----------------------------------------------------------------------------------------------------------------------------------
AP-242 BGA semiconductor package circuit W.Y. Pyo 95-25173 Aug 16, '95 Nov 9, '98 Anam Notice of
board structure of using the Allowance
solderballs as I/O part
- ----------------------------------------------------------------------------------------------------------------------------------
AP-296 Humidity per coating prevention Y.W. Heo 95-54766 Dec 22, '95 Sep 11, '98 Anam Notice of
structure of BGA semiconductor Allowance
package
- ----------------------------------------------------------------------------------------------------------------------------------
AP-390 Structure of BGA semiconductor Y.W. Heo 96-05344 Feb 29, '96 Oct 30, '98 Anam Notice of
package and method of manufacturing Allowance
the same (CSP BGA)
- ----------------------------------------------------------------------------------------------------------------------------------
AP-400 Structure of PCB substrate of Y.M. Kim 96-09779 Apr 1, '96 Nov 27, '98 Anam Notice of
BGA semiconductor package Allowance
- ----------------------------------------------------------------------------------------------------------------------------------
AP-401 BGA semiconductor package M.E. Lee 96-09780 Apr 1, '96 Nov 27, '98 Anam Notice of
Allowance
- ----------------------------------------------------------------------------------------------------------------------------------
AP-545 The Structure of semiconductor D.J. Kim 96-62306 Dec 6, '96 Anam
package (BGA - Using half-etching
& one-side molding)
- ----------------------------------------------------------------------------------------------------------------------------------
AP-576 BGA semiconductor package L.K. Shin 96-77898 Dec 30, '96 Anam
built-in carrier frame
- ----------------------------------------------------------------------------------------------------------------------------------
</TABLE>
-1-
<PAGE> 23
<TABLE>
<CAPTION>
No. Title Inventor Appl No. Filing Date Req. Date Patent Assignee Remark
- ----------------------------------------------------------------------------------------------------------------------------------
<S> <C> <C> <C> <C> <C> <C> <C> <C>
AP-577 BGA semiconductor package with L.K. Shin 96-77899 Dec 30, '96 Anam
carrier frame
- ----------------------------------------------------------------------------------------------------------------------------------
AP-610 BGA semiconductor package with L.K. Shin 97-02503 Jan 28, '97 Anam
heatsink
- ----------------------------------------------------------------------------------------------------------------------------------
AP-612 Free-delamination pad for BGA L.K. Shin 97-02505 Jan 28, '97 Anam
semiconductor package
- ----------------------------------------------------------------------------------------------------------------------------------
AP-613 BGA semiconductor package with Y.M. Kim 97-02506 Jan 28, '97 Anam
heatsink
- ----------------------------------------------------------------------------------------------------------------------------------
AP-615 BGA semiconductor package using Y.W. Heo 97-04430 Feb 14, 97 Anam
the flexible circuit board
- ----------------------------------------------------------------------------------------------------------------------------------
AP-616 The method of forming solder-ball L.K. Shin 97-04431 Feb 14, '97 Anam
land and BGA semiconductor package
including the same
- ----------------------------------------------------------------------------------------------------------------------------------
AP-916 Molding device of ball grid array S.G. Lee 98-37203 Sep 9, '98 Anam
semiconductor using a carrier
frame
- ----------------------------------------------------------------------------------------------------------------------------------
AP-919 Attaching method of flexible S.H. Ha 98-37630 Sep 11, '98 Anam
circuit board on carrier frame
for ball grid array semiconductor
package
- ----------------------------------------------------------------------------------------------------------------------------------
AP-923 Structure of BGA semiconductor D.H. Park 98-37970 Sep 15, '98 Anam
packages with cavity down type
- ----------------------------------------------------------------------------------------------------------------------------------
AP-926 Structure of ball grid array L.G Ham 98-38259 Sep 16, '98 Anam
semiconductor package using
flexible circuit board strip
- ----------------------------------------------------------------------------------------------------------------------------------
LEADFRAME PATENTS
No. Title Inventor Appl No. Filing Date Req. Date Patent Assignee Remark
- ----------------------------------------------------------------------------------------------------------------------------------
AP-233 Structure of semiconductor W.S. Shin 95-19587 Jul 5, '95 Nov 9, '98 Anam Notice of
package (Paddleless) Allowance
- ----------------------------------------------------------------------------------------------------------------------------------
AP-397 Semiconductor package and method W.S. Shin 96-09776 Apr 1, '96 Nov 30, '96 Anam Notice of
of manufacturing the same (BLP) Allowance
- ----------------------------------------------------------------------------------------------------------------------------------
AP-649 Area array bumped semiconductor W.S. Shin 97-18509 May 13, '97 Anam
package
- ----------------------------------------------------------------------------------------------------------------------------------
AP-650 The method forming area array W.S. Shin 97-18510 May 13, '97 Anam
burned semiconductor package
- ----------------------------------------------------------------------------------------------------------------------------------
</TABLE>
-2-
<PAGE> 24
<TABLE>
<CAPTION>
No. Title Inventor Appl No. Filing Date Req. Date Patent Assignee Remark
- ----------------------------------------------------------------------------------------------------------------------------------
<S> <C> <C> <C> <C> <C> <C> <C> <C>
AP-660 Grid array leadframe and lead L.K. Han 97-24409 Jun 12, '97 Anam
grid array semiconductor package
using the same
- ----------------------------------------------------------------------------------------------------------------------------------
AP-760 Array type semiconductor package S.G. Lee 97-54507 Oct 23, '97 Anam
using lead frame and its method
- ----------------------------------------------------------------------------------------------------------------------------------
AP-762 Array type semiconductor package S.G. Lee 97-54509 Oct 23, '97 Anam
using lead frame and its method
- ----------------------------------------------------------------------------------------------------------------------------------
WAFER SCALE PACKAGING
No. Title Inventor Appl No. Filing Date Req. Date Patent Assignee Remark
- ----------------------------------------------------------------------------------------------------------------------------------
AP-623 Structure and manufacturing S.J. Kim 97-04652 Feb 17, '97 Anam
method for flip-ship
semiconductor package
- ----------------------------------------------------------------------------------------------------------------------------------
AP-763 Semiconductor package for a flip S.J. Kim 97-54510 Oct 23, '97 Anam
chip and its manufacturing method
- ----------------------------------------------------------------------------------------------------------------------------------
AP-959 A flexible film for semiconductor D.S. You 98-47798 Nov 06, '98 Anam
packages
- ----------------------------------------------------------------------------------------------------------------------------------
AP-964 Flexible substrate structure and S.H. Lee 98-48929 Nov 14, '98 Anam
semiconductor packages and
manufacturing method with the
structure
- ----------------------------------------------------------------------------------------------------------------------------------
AP-761 Ball grid array semiconductor W.J. Kang 97-54508 Oct 23, '97 Anam
package using a silicon substrate
- ----------------------------------------------------------------------------------------------------------------------------------
PKG PATENTS
No. Title Inventor Appl No. Filing Date Req. Date Patent Assignee Remark
- ----------------------------------------------------------------------------------------------------------------------------------
10 Thin BGA semiconductor package 95-25172
with exposed heatsink
- ----------------------------------------------------------------------------------------------------------------------------------
11 BGA semiconductor package circuit 95-25173
board structure of using the
solderballs as I/O part
- ----------------------------------------------------------------------------------------------------------------------------------
12 Ball grid array semiconductor 95-41438
package with ring-type heatsink
- ----------------------------------------------------------------------------------------------------------------------------------
13 Semiconductor chip bonding method 95-41845
and structure for using solder ball
- ----------------------------------------------------------------------------------------------------------------------------------
14 Humidity per coating prevention 95-54766
structure of BGA semiconductor
package
- ----------------------------------------------------------------------------------------------------------------------------------
</TABLE>
-3-
<PAGE> 25
<TABLE>
<CAPTION>
No. Title Inventor Appl No. Filing Date Req. Date Patent Assignee Remark
- ----------------------------------------------------------------------------------------------------------------------------------
<S> <C> <C> <C> <C> <C> <C> <C> <C>
15 Semiconductor package for using 95-69093
solderballs and leads as
I/O terminal
- ----------------------------------------------------------------------------------------------------------------------------------
16 BGA semiconductor package 95-69098
- ----------------------------------------------------------------------------------------------------------------------------------
17 Structure of BGA semiconductor 96-05344
package and method of manufacturing
the same (CSP BGA)
- ----------------------------------------------------------------------------------------------------------------------------------
18 Method of producing BGA 96-05345
semiconductor package metal carrier
frame and BGA package produced by
such method
- ----------------------------------------------------------------------------------------------------------------------------------
19 Method of manufacturing 96-06302
semiconductor package and
structure produced by such method
(CSP: Making solder bump on
chip pad)
- ----------------------------------------------------------------------------------------------------------------------------------
20 Semiconductor package and method 96-09776
of manufacturing the same (BLP)
- ----------------------------------------------------------------------------------------------------------------------------------
21 BGA semiconductor package 96-09777
- ----------------------------------------------------------------------------------------------------------------------------------
22 Structure of PCB substrate of BGA 96-09779
semiconductor package
- ----------------------------------------------------------------------------------------------------------------------------------
23 BGA semiconductor package 96-09780
- ----------------------------------------------------------------------------------------------------------------------------------
24 Method of molding BGA semiconductor
attached heatsink 96-22903
25 Stacking BGA semiconductor package 96-41464
- ----------------------------------------------------------------------------------------------------------------------------------
26 BGA semiconductor package 96-43844
- ----------------------------------------------------------------------------------------------------------------------------------
27 BGA semiconductor package 96-62300
- ----------------------------------------------------------------------------------------------------------------------------------
28 Semiconductor package 96-62301
- ----------------------------------------------------------------------------------------------------------------------------------
29 BGA semiconductor package 96-62302
- ----------------------------------------------------------------------------------------------------------------------------------
</TABLE>
-4-
<PAGE> 26
<TABLE>
<CAPTION>
No. Title Inventor Appl No. Filing Date Req. Date Patent No. Assignee Remark
- ----------------------------------------------------------------------------------------------------------------------------------
<S> <C> <C> <C> <C> <C> <C> <C> <C>
30 The structure of semiconductor 96-62306
package (BGA: Using half-etching &
one-sided molding
- ----------------------------------------------------------------------------------------------------------------------------------
31 Structure and method of BGA 96-65236
semiconductor package with heatsink
- ----------------------------------------------------------------------------------------------------------------------------------
32 Structure and manufacturing method 96-74115
of semiconductor package (Attaching
internally double chip on leadframe)
- ----------------------------------------------------------------------------------------------------------------------------------
33 The structure of PCB for BGA 96-74117
semiconductor package
- ----------------------------------------------------------------------------------------------------------------------------------
34 Printed circuit for ball grid array 96-74120
semiconductor package and method
for molding ball grid array
semiconductor package using the same
- ----------------------------------------------------------------------------------------------------------------------------------
35 BGA semiconductor package built-in 96-77898
carrier frame
- ----------------------------------------------------------------------------------------------------------------------------------
36 BGA semiconductor package with 96-77899
carrier frame
- ----------------------------------------------------------------------------------------------------------------------------------
37 Flexible circuit board of die flag 96-77900
for BGA semiconductor package
- ----------------------------------------------------------------------------------------------------------------------------------
38 Flexible circuit board of die flag 96-77901
for BGA semiconductor package
- ----------------------------------------------------------------------------------------------------------------------------------
39 Flexible circuit board of die flag 96-77902
for BGA semiconductor package
- ----------------------------------------------------------------------------------------------------------------------------------
40 The structure of semiconductor 96-77931
with carrier frame
- ----------------------------------------------------------------------------------------------------------------------------------
41 BGA semiconductor package with 97-02503
heatsink
- ----------------------------------------------------------------------------------------------------------------------------------
42 The singulation method of BGA 97-02504
semiconductor package
- ----------------------------------------------------------------------------------------------------------------------------------
43 Free-delamination pad for BGA 97-02505
semiconductor package
- ----------------------------------------------------------------------------------------------------------------------------------
44 BGA semiconductor package with 97-02506
heatsink
- ----------------------------------------------------------------------------------------------------------------------------------
45 BGA semiconductor package using 97-0443 0
flexible circuit board
- ----------------------------------------------------------------------------------------------------------------------------------
46 Semiconductor package (PGA) 97-04432
- ----------------------------------------------------------------------------------------------------------------------------------
</TABLE>
-5-
<PAGE> 27
<TABLE>
<CAPTION>
No. Title Inventor Appl No. Filing Date Req. Date Patent No. Assignee Remark
- ----------------------------------------------------------------------------------------------------------------------------------
<S> <C> <C> <C> <C> <C> <C> <C> <C>
47 Semiconductor package (Using 97-04433
the pin-type of metal sheet)
- ----------------------------------------------------------------------------------------------------------------------------------
48 BGA semiconductor package 97-04653
- ----------------------------------------------------------------------------------------------------------------------------------
49 Structure and manufacturing method 97-04656
of BGA
- ----------------------------------------------------------------------------------------------------------------------------------
50 Ball grid array semiconductor 97-04657
package
- ----------------------------------------------------------------------------------------------------------------------------------
51 The structure of semiconductor 97-06062
package
- ----------------------------------------------------------------------------------------------------------------------------------
52 Semiconductor package (Attaching 97-18551
heatsink on the top of chip)
- ----------------------------------------------------------------------------------------------------------------------------------
53 Semiconductor package (Attaching 97-18507
the leadframe of array type at
the bottom of package)
- ----------------------------------------------------------------------------------------------------------------------------------
54 Area array bumped semiconductor 97-18509
package
- ----------------------------------------------------------------------------------------------------------------------------------
55 The method forming area array 97-18510
bumped semiconductor package
- ----------------------------------------------------------------------------------------------------------------------------------
56 Semiconductor package (Making 97-18623
test terminals in circuit test)
- ----------------------------------------------------------------------------------------------------------------------------------
57 Semiconductor package (BGA) 97-18624
- ----------------------------------------------------------------------------------------------------------------------------------
58 Semiconductor package (Attaching 97-18629
coupling agent for preventing crack
& popcorn from PCB)
- ----------------------------------------------------------------------------------------------------------------------------------
59 Ball grid array semiconductor 97-54508
package suing a silicon substrate
- ----------------------------------------------------------------------------------------------------------------------------------
60 Array type semiconductor package 97-54509
suing lead frame and its method
- ----------------------------------------------------------------------------------------------------------------------------------
61 Printed circuit board of wafer 97-64123
taped chip scale package and method
of routing it
- ----------------------------------------------------------------------------------------------------------------------------------
62 Ball grid array semiconductor 97-64125
package
- ----------------------------------------------------------------------------------------------------------------------------------
63 Structure of micro film for micro 97-43970
ball grid array semiconductor
package
- ----------------------------------------------------------------------------------------------------------------------------------
</TABLE>
-6-
<PAGE> 28
<TABLE>
<CAPTION>
No. Title Inventor Appl No. Filing Date Req. Date Patent No. Assignee Remark
- ----------------------------------------------------------------------------------------------------------------------------------
<S> <C> <C> <C> <C> <C> <C> <C> <C>
64 Structure of fan-in TAB lead for 97-43971
micro-film for a semiconductor
package
- ----------------------------------------------------------------------------------------------------------------------------------
65 Structure of micro film for micro 97-43972
ball grid array semiconductor
package
- ----------------------------------------------------------------------------------------------------------------------------------
66 Structure of micro film for micro 97-43973
ball grid array semiconductor
package
- ----------------------------------------------------------------------------------------------------------------------------------
67 Structure of micro film for micro 97-43974
ball grid array semiconductor
package
- ----------------------------------------------------------------------------------------------------------------------------------
68 Structure of micro film for micro 97-43975
ball grid array semiconductor
package
- ----------------------------------------------------------------------------------------------------------------------------------
69 Structure of micro film for micro 97-43976
ball grid array semiconductor
package
- ----------------------------------------------------------------------------------------------------------------------------------
70 Structure of chip array ball grid 97-79222
array semiconductor package
- ----------------------------------------------------------------------------------------------------------------------------------
71 Ball grid array semiconductor 97-79225
package using a flexible circuit
board
- ----------------------------------------------------------------------------------------------------------------------------------
72 Ball grid array semiconductor 97-79228
package using a flexible circuit
board
- ----------------------------------------------------------------------------------------------------------------------------------
73 Singulation method of ball grid 97-79230
array semiconductor package using
a flexible circuit board strip
- ----------------------------------------------------------------------------------------------------------------------------------
74 Ball grid array semiconductor 97-79232
package using a flexible circuit
board and its manufacturing method
- ----------------------------------------------------------------------------------------------------------------------------------
75 Semiconductor package 98-12364
- ----------------------------------------------------------------------------------------------------------------------------------
76 Structure of semiconductor package 98-09915
- ----------------------------------------------------------------------------------------------------------------------------------
77 Structure of BGA-semiconductor 98-09916
package
- ----------------------------------------------------------------------------------------------------------------------------------
78 Printed circuit board for 98-36897
semiconductor package for
preventing static electricity
- ----------------------------------------------------------------------------------------------------------------------------------
79 Printed circuit board for 98-36898
semiconductor package for
preventing static electricity
- ----------------------------------------------------------------------------------------------------------------------------------
80 Attaching method of flexible circuit 98-37630
board on carrier frame for ball
grid array semiconductor package
- ----------------------------------------------------------------------------------------------------------------------------------
</TABLE>
-7-
<PAGE> 29
<TABLE>
<CAPTION>
No. Title Inventor Appl No. Filing Date Req. Date Patent No. Assignee Remark
- ----------------------------------------------------------------------------------------------------------------------------------
<S> <C> <C> <C> <C> <C> <C> <C> <C>
81 Structure of BGA semiconductor 98-37970
packages with cavity down type
82 Structure of ball grid array 98-38259
semiconductor package using
flexible circuit board strip
83 Micro ball grid array 98-40125
semiconductor package
84 Semiconductor package and its 98-48046
manufacturing method
85 Flexible circuit board and 98-25418
semiconductor packages using it
</TABLE>
Exhibit E
Type B Patents
I. Korean Patents and Applications
<TABLE>
<CAPTION>
- ----------------------------------------------------------------------------------------------------------------------------------
APPLICATION NO. TITLE INVENTOR APPLICATION DATE ISSUE NO.
- ----------------------------------------------------------------------------------------------------------------------------------
<S> <C> <C> <C> <C>
87-15336 Marking apparatus of leadframe for assembling semiconductor J.H. Choi 87/9/8 U0 49666
- ----------------------------------------------------------------------------------------------------------------------------------
91-16361 Pad cleaner of marking machine for semiconductor device S.M. Choi 91/9/19 P0 70556
- ----------------------------------------------------------------------------------------------------------------------------------
91-16589 Method and apparatus of lead bending for surface mounting device Y.H. Kang 91/9/24 P0 81093
- ----------------------------------------------------------------------------------------------------------------------------------
91-22233 Method and apparatus of cam form for IC package K.C. Park 91/12/5 P0 81833
- ----------------------------------------------------------------------------------------------------------------------------------
92-03869 Method and apparatus of Forming for surface mounting device G. Lee 92/3/9 P0 81834
- ----------------------------------------------------------------------------------------------------------------------------------
</TABLE>
-8-
<PAGE> 30
<TABLE>
<S> <C> <C> <C> <C>
- ----------------------------------------------------------------------------------------------------------------------------------
92-04715 Structure of package for surface mounting device Y.W. Heo 92/3/25 U0 89814
- ----------------------------------------------------------------------------------------------------------------------------------
92-10285 Method and apparatus of LASER marking for IC package H.Y. Lee 92/6/13 P1 13208
- ----------------------------------------------------------------------------------------------------------------------------------
92-10526 Heatspreader fixture J.Y. Kil 92/6/13 U0 88640
- ----------------------------------------------------------------------------------------------------------------------------------
92-26797 Gate cull of quad type intergrated circuit package and gate tiebar G. Lee 92/12/30 P0 95030
of leadframe (QFP, making the structure of gate tiebar for easily
triming process)
- ----------------------------------------------------------------------------------------------------------------------------------
92-26798 Matrix structure of dual in line leadframe (PDIP) Y.W. Heo 92/12/30 P1 05768
- ----------------------------------------------------------------------------------------------------------------------------------
93-03199 Automatic leadframe loader S.Y. Park 93/3/4 P1 05760
- ----------------------------------------------------------------------------------------------------------------------------------
93-13930 Apparatus for inspecting leadframe bonding C.G. Son 93/7/26 U0 94008
- ----------------------------------------------------------------------------------------------------------------------------------
93-13931 Apparatus for inspecting intergrated circuit package H.M. Aha 93/7/26 U0 94009
- ----------------------------------------------------------------------------------------------------------------------------------
93-14164 Feeding system for marking intergrated circuit package S.S. Han 93/7/26 P1 18553
- ----------------------------------------------------------------------------------------------------------------------------------
93-15983 Safe setting method for solder ball for integrated circuit Y.W. Heo 93/8/18 P1 05750
package (BGA)
- ----------------------------------------------------------------------------------------------------------------------------------
93-15984 Method of decreasing bending for integrated circuit package (BGA) Y.W. Heo 93/8/18 P1 22789
- ----------------------------------------------------------------------------------------------------------------------------------
93-15986 Apparatus of eliminating gate for intergated circuit package K.D. Shim 93/8/18 P1 05749
- ----------------------------------------------------------------------------------------------------------------------------------
</TABLE>
-9-
<PAGE> 31
<TABLE>
<S> <C> <C> <C> <C>
- ----------------------------------------------------------------------------------------------------------------------------------
93-18223 Structure of heatsink for mounting in intergated circuit package N.H. Kwak 93/9/10 P1 05745
(Power Quad)
- ----------------------------------------------------------------------------------------------------------------------------------
93-22858 Loading and unloading apparatus of plating rack S.Y. Park 93/10/30 P1 12771
- ----------------------------------------------------------------------------------------------------------------------------------
93-25775 Semiconductor leadframe (Dambar supporting lead) M.J. Lee 93/11/30 P1 22885
- ----------------------------------------------------------------------------------------------------------------------------------
93-30799 Stucture of leadframe pad (QFP, Tiebar Downset) C.K. Park 93/12/30 U1 05970
- ----------------------------------------------------------------------------------------------------------------------------------
93-31195 Method of eliminating flash for intergated circuit package and G. Lee 93/12/30 P1 09990
structure of leadframe hereof (QFP, Tiebar Trim)
- ----------------------------------------------------------------------------------------------------------------------------------
94-00395 Molding method and device of semiconductor package (MGP Mold) G. Lee 94/1/12 P1 24549
- ----------------------------------------------------------------------------------------------------------------------------------
94-01158 Method of manufacturing mold for semiconductor package and structure G. Lee 94/1/22 P1 27190
of mold thereof (Mold Tool)
- ----------------------------------------------------------------------------------------------------------------------------------
94-01771 Method of manufacturing ink marking apparatus and structure of ink S.M. Choi 94/1/31 P1 27189
marking apparatus (Marking ad)
- ----------------------------------------------------------------------------------------------------------------------------------
94-01772 Indexing method and apparatus in wire bonding process for Y.G. Hwang 94/1/31 P1 13187
semiconductor package
- ----------------------------------------------------------------------------------------------------------------------------------
94-01774 Tiebar structure of leadframe (QFP) G. LEE 94/1/31 P1 19059
- ----------------------------------------------------------------------------------------------------------------------------------
94-02476 Ground terminal C.B. LEE 94/2/8 U1 09467
- ----------------------------------------------------------------------------------------------------------------------------------
94-03322 Method of recognizing leadframe in wire bonding process for Y.G. Hwang 94/2/24 P1 21047
semiconductor package (Pattern recognition system)
- ----------------------------------------------------------------------------------------------------------------------------------
</TABLE>
-10-
<PAGE> 32
<TABLE>
<S> <C> <C> <C> <C>
- ----------------------------------------------------------------------------------------------------------------------------------
94-03494 Heatsink structure of thin package (PQ2) S.D. Lee 94/2/25 P1 19650
- ----------------------------------------------------------------------------------------------------------------------------------
94-03820 Heatsink structure (PQ2) S.D. Lee 94/2/28 P1 24789
- ----------------------------------------------------------------------------------------------------------------------------------
94-04109 Multi-magazine holder H.Y. Lee 94/3/3 P1 26534
- ----------------------------------------------------------------------------------------------------------------------------------
94-05635 Semiconductor leadframe (Oxide) J.D. Kim 94/3/21
- ----------------------------------------------------------------------------------------------------------------------------------
94-05636 Semiconductor epoxy tool S.K. Hwang 94/3/21 P1 21113
- ----------------------------------------------------------------------------------------------------------------------------------
94-05852 Pick up tool of bonding semiconductor chip (Quad Type) S.I. Kim 94/3/23 P1 22774
- ----------------------------------------------------------------------------------------------------------------------------------
94-05967 Surface structure of heatsink for semiconductor package (PQ2) S.D. Lee 94/3/24 P1 25999
- ----------------------------------------------------------------------------------------------------------------------------------
94-06063 Structure of leadframe (Tiebar) S.M. Seo 94/3/24 P1 26000
- ----------------------------------------------------------------------------------------------------------------------------------
94-06064 Structure of heatsink for semiconductor package (PQ2: Making S.D. Lee 94/3/25 P1 26001
grooves at the center of heatsink
- ----------------------------------------------------------------------------------------------------------------------------------
94-06289 Pad structure of leadframe (Making holes at the center of paddle S.M. Seo 94/3/28 P1 19651
for preventing delamination rom paddle surface)
- ----------------------------------------------------------------------------------------------------------------------------------
94-06290 Pad structure of leadframe (Making Down thickness at paddle as S.M. Seo 94/3/28 P1 19652
an ecthing method for free elamination)
- ----------------------------------------------------------------------------------------------------------------------------------
94-06291 Pad structure of leadframe (consists of double paddle for S.M. Seo 94/3/28 P1 19653
reducing dimension)
- ----------------------------------------------------------------------------------------------------------------------------------
94-06421 Leadframe structure (Free moisture) S.M. Seo 94/3/29 U1 11266
- ----------------------------------------------------------------------------------------------------------------------------------
</TABLE>
-11-
<PAGE> 33
<TABLE>
<S> <C> <C> <C> <C>
- ----------------------------------------------------------------------------------------------------------------------------------
94-06742 Tiebar of leadframe(Making holes in tiebar) J.H. Ahn 94/3/31 P1 33014
- -----------------------------------------------------------------------------------------------------------------------------------
94-06756 Mold of wire bonding for semiconductor package(Install subheater) B.K. Han 94/3/31
- -----------------------------------------------------------------------------------------------------------------------------------
94-06775 Injection method of mold compound(Connect electric signal) J.H. Ahn 94/3/31 P1 21114
- -----------------------------------------------------------------------------------------------------------------------------------
94-06776 Structure of mold semiconductor package(Air vent) G. Lee 94/3/31 P1 21112
- -----------------------------------------------------------------------------------------------------------------------------------
94-08596 Heatsink feeding apparatus G. Lee 94/4/22 P1 26529
- -----------------------------------------------------------------------------------------------------------------------------------
94-08646 Leadframe of inspecting trimming and forming process K.C. Park 94/4/22 U1 08304
(Identification mark)
- ----------------------------------------------------------------------------------------------------------------------------------
94-09056 Feeding apparatus for ink marking of intergrated circuit package S.M. Choi 94/4/27
- ----------------------------------------------------------------------------------------------------------------------------------
94-09667 Font mask for LASER marking of intergrated circuit package H.Y. Lee 94/5/2 U1 09734
- ----------------------------------------------------------------------------------------------------------------------------------
94-10643 Copper heatspreader (Making embossed pattern on the central paddle) T.H. Lee 94/5/16 P1 23424
- ----------------------------------------------------------------------------------------------------------------------------------
94-10938 Leadframe (Making wave pattern in inner lead) J.D. Kim 94/5/19 P1 23423
- ----------------------------------------------------------------------------------------------------------------------------------
94-11454 Pot coupling structure of transfer apparatus J.H. Choi 94/5/23
- ----------------------------------------------------------------------------------------------------------------------------------
94-11455 Transfer apparatus for molding semiconductor package J.H. Choi 94/5/23 U1 16194
- ----------------------------------------------------------------------------------------------------------------------------------
94-13647 Copper Oxide Filled polymer die attach adhesive composition for C.W. Kwak 94/6/16 P1 24788
semiconductor package
- ----------------------------------------------------------------------------------------------------------------------------------
</TABLE>
-12-
<PAGE> 34
<TABLE>
<S> <C> <C> <C> <C>
- ----------------------------------------------------------------------------------------------------------------------------------
94-14332 Tape for preventing plating and method of plating semiconductor N.H. Kwak 94/6/22 P1 26273
package
- ----------------------------------------------------------------------------------------------------------------------------------
94-15996 Relocation structure for cutting dambar I.S. Kim 94/6/30 U1 14547
- ----------------------------------------------------------------------------------------------------------------------------------
94-15772 Method and apparatus of ejecting semiconductor chip J.H. Choi 94/7/1 P1 42152
- ----------------------------------------------------------------------------------------------------------------------------------
94-15873 Method of reducing moisture and contamination penetration into J.D. Kim 94/7/2 P1 28165
microelectronics (Coating oxidation in leadframe)
- ----------------------------------------------------------------------------------------------------------------------------------
94-16492 Transfer dual molding apparatus J.H. Choi 94/7/8
- ----------------------------------------------------------------------------------------------------------------------------------
94-16948 Leadframe for plastic package (Coating silver in only wire C.K. Park 94/7/8
bonding area)
- ----------------------------------------------------------------------------------------------------------------------------------
94-18497 Heatsink projected out of semiconductor package W.S. Shin 94/7/28 P1 56513
- ----------------------------------------------------------------------------------------------------------------------------------
94-18498 Mold for molding semiconductor package W.S. Shin 94/7/28 P1 56514
- ----------------------------------------------------------------------------------------------------------------------------------
94-18499 Semiconductor package(Apply new type heatspreader) W.S. Shin 94/7/28 P1 56515
- ----------------------------------------------------------------------------------------------------------------------------------
94-19006 Heatsink projected out of semiconductor package W.S. Shin 94/7/28 U1 09468
- ----------------------------------------------------------------------------------------------------------------------------------
94-19290 Pad of leadframe(Cutting partly pad for free delamination) D.H. Moon 94/8/4 P1 56516
- ----------------------------------------------------------------------------------------------------------------------------------
94-21273 Package for test and method of manufacturing it W.S. Shin 94/8/27 P1 44314
- ----------------------------------------------------------------------------------------------------------------------------------
</TABLE>
-13-
<PAGE> 35
<TABLE>
<S> <C> <C> <C> <C>
- ----------------------------------------------------------------------------------------------------------------------------------
94-21782 Method of molding and structure of mold(Dambarless) G. Lee 94/8/31 P1 32702
- ----------------------------------------------------------------------------------------------------------------------------------
94-23007 Leadframe of preventing leakage from solder and epoxy D.H. Moon 94/9/7 U1 29005
- ----------------------------------------------------------------------------------------------------------------------------------
94-22438 Method of manufacturing semiconductor package having heatsink B.T. Dho 94/9/7 P1 37067
(Solder material for preventing it from delamination and crack)
- ----------------------------------------------------------------------------------------------------------------------------------
94-22439 Method and device of molding for intergrated circuit package G. Lee 94/9/7 P1 62887
(Dambarless)
- ----------------------------------------------------------------------------------------------------------------------------------
94-22625 Method and device for molding of intergrated circuit package G. Lee 94/9/8 P1 42153
(Making a oxdatantlayer on heatspreader)
- ----------------------------------------------------------------------------------------------------------------------------------
94-22626 Copper Oxide filled polymer die attach adhesive composition for W.S. Shin 94/9/8 P1 44312
semiconductor package
- ----------------------------------------------------------------------------------------------------------------------------------
94-22712 Semiconductor package (Making embossed patterns as blocking L.H. Kim 94/9/9 P1 47420
epoxy wall)
- ----------------------------------------------------------------------------------------------------------------------------------
94-23309 Semiconductor package (Making a grooved surface in paddle) W.S. Shin 94/9/9 U1 33386
- ----------------------------------------------------------------------------------------------------------------------------------
94-23663 A dry system for leadframe (Making a filtering apparatus in system) N.H. Kwak 94/9/16 P1 49523
- ----------------------------------------------------------------------------------------------------------------------------------
94-23431 A printing circuit board in semiconductor package (Making holes W.S. Shin 94/9/10 U1 20612
in PCB)
- ----------------------------------------------------------------------------------------------------------------------------------
94-24279 Apparatus and method of elimination dummy dambar and dambar of K.C. Park 94/9/27 P1 59304
semiconductor package
- ----------------------------------------------------------------------------------------------------------------------------------
94-25860 A method of adhesion of heatsink for semiconductor package W.S. Shin 94/10/10 P1 47768
- ----------------------------------------------------------------------------------------------------------------------------------
</TABLE>
-14-
<PAGE> 36
<TABLE>
<S> <C> <C> <C> <C>
- ----------------------------------------------------------------------------------------------------------------------------------
94-25861 Leadframe (Connecting a plural of line pad & ground line pad) W.S. Shin 94/10/10 P1 37068
- ----------------------------------------------------------------------------------------------------------------------------------
94-26326 Leadframe (Making pattern for connecting signal, powerline and L.H. Kim 94/10/10 U1 29004
ground at the same time)
- ----------------------------------------------------------------------------------------------------------------------------------
94-27230 Semiconductor package (Making connections directly from chip Y.W. Heo 94/10/25 P1 86961
pad to PCB)
- ----------------------------------------------------------------------------------------------------------------------------------
94-28218 Method and apparatus of auto supply wafer S.Y. Park 94/10/31 P1 37828
- ----------------------------------------------------------------------------------------------------------------------------------
94-29045 Gate insert tip and tool used thereof J.Y. Chung 94/11/2 U1 17395
- ----------------------------------------------------------------------------------------------------------------------------------
94-30309 Driving apparatus of multi magazine for fabrication semiconductor W.H. Choi 94/11/16 U1 17628
equipment
- ----------------------------------------------------------------------------------------------------------------------------------
94-30518 Apparatus of inspecting wire bonding of semiconductor package K.B. Lee 94/11/19 P1 59967
(Making controller in wire bonding machine)
- ----------------------------------------------------------------------------------------------------------------------------------
94-30757 Leadframe (Making identation mark in out lead) W.Y. Pyo 94/11/21 U1 23589
- ----------------------------------------------------------------------------------------------------------------------------------
94-31033 Die of forming machine and die tip thereof K.H. Lee 94/11/23 U1 17412
- ----------------------------------------------------------------------------------------------------------------------------------
94-31781 Method of adhesive semiconductor package on PCB (Connecting out J.K. Chun 94/11/29
lead on PCB as a solder ball)
- ----------------------------------------------------------------------------------------------------------------------------------
94-32145 Method of eject marking for die bonding and apparatus thereof Y.Y. Moon 94/11/30 P1 65765
(Making a circle of pattern on packaging surface)
- ----------------------------------------------------------------------------------------------------------------------------------
94-32146 Ram apparatus of mold (Making respectively supporting ram parts) Y.Y. Moon 94/11/30 P1 65764
- ----------------------------------------------------------------------------------------------------------------------------------
</TABLE>
-15-
<PAGE> 37
<TABLE>
<S> <C> <C> <C> <C>
- ----------------------------------------------------------------------------------------------------------------------------------
94-32642 Ejecting method for die bonding and apparatus thereof C.W. Kwak 94/12/3
- ----------------------------------------------------------------------------------------------------------------------------------
94-32909 Automatic strip counter K.D. Lee 94/12/6
- ----------------------------------------------------------------------------------------------------------------------------------
94-33257 Lifter(Making masspoint for carring the objectives) K.N. Bae 94/12/8 U1 09535
- ----------------------------------------------------------------------------------------------------------------------------------
94-33288 Method of forming character and figure of tray(Easy to I. Hang 94/12/8
detach/Attach the character/Figure logo on tray surface)
- ----------------------------------------------------------------------------------------------------------------------------------
94-33423 Structure of hot plate for preheating leadframe (Making groove B.T. Dho 94/12/9 U1 17452
on hot plate)
- ----------------------------------------------------------------------------------------------------------------------------------
94-33831 Magazine holder structure of leadframe loader K.H. Lee 94/12/13 U1 12218
- ----------------------------------------------------------------------------------------------------------------------------------
94-33832 Pusher structure of leadframe loader(Making the sensor for S.L. Park 94/12/13 U1 29225
loading leadframe)
- ----------------------------------------------------------------------------------------------------------------------------------
94-33833 Pusher apparatus of leadframe loader (Making air-cylinder for W.H. Kung 94/12/13 U1 29221
loading leadframe)
- ----------------------------------------------------------------------------------------------------------------------------------
94-33834 Leadframe heater block stracture (Making embossed pattern and K.H. Lee 94/12/13 U1 17717
fixed gripper heater block)
- ----------------------------------------------------------------------------------------------------------------------------------
94-33835 Semiconductor package (Connecting a plural of signals for I.K. Park 94/12/13 U1 17716
integrated circuit package)
- ----------------------------------------------------------------------------------------------------------------------------------
94-33931 Gripper apparatus of leadframe loader for semiconductor package W.H. Kung 94/12/13 P1 38057
- ----------------------------------------------------------------------------------------------------------------------------------
94-33932 Feeding loader apparatus of leadframe loader for semiconductor S.L. Park 94/12/13 P1 38055
package
- ----------------------------------------------------------------------------------------------------------------------------------
94-33933 Leadframe loader system for semiconductor package K.H. Lee 94/12/13 P1 27628
- ----------------------------------------------------------------------------------------------------------------------------------
</TABLE>
-16-
<PAGE> 38
<TABLE>
<S> <C> <C> <C>
- ----------------------------------------------------------------------------------------------------------------------------------
94-33934 Megazine holder of leadframe loader for semiconductor package W.H. Kung 94/12/13 P1 27618
- ----------------------------------------------------------------------------------------------------------------------------------
94-33935 Robot apparatus of leadframe loader for semiconductor package M.H. Park 94/12/13 P1 27619
- ----------------------------------------------------------------------------------------------------------------------------------
94-33936 Heater block apparatus of leadframe loader for semiconductor package K.H. Lee 94/12/13 P1 38054
- ----------------------------------------------------------------------------------------------------------------------------------
94-33993 Pad structure of semiconductor package (Making a plural of heat B.H. Ahn 94/12/14
disppation shapes)
- ----------------------------------------------------------------------------------------------------------------------------------
94-34165 Leadframe for manufacturing semiconductor package (Preventing D.H. Park 94/12/14 P1 40458
wire shorting)
- ----------------------------------------------------------------------------------------------------------------------------------
94-34170 Heater block of wire bonding for semiconductor package (Making Y.S. Jung 94/12/14 P1 38056
a plural of embossed pattern on paddle for preventing crack &
distortion)
- ----------------------------------------------------------------------------------------------------------------------------------
94-34332 Heatsink for semiconductor package (Making a circle groved pattern W.S. Shin 94/12/16 U1 34092
on heatsink)
- ----------------------------------------------------------------------------------------------------------------------------------
94-34333 Heatsink for semiconductor package (Making a variety of heatsink K.S. Jung 94/12/16
for heat disspation)
- ----------------------------------------------------------------------------------------------------------------------------------
94-34334 Structure of leadframe (Making slots on pad for preventing thermal S.B. Kwak 94/12/16
distortion)
- ----------------------------------------------------------------------------------------------------------------------------------
94-34664 Structure of leadframe for manufacturing semiconductor package K.S. Jung 94/12/16
(Making a variety of pattern for combining molding resin)
- ----------------------------------------------------------------------------------------------------------------------------------
94-34809 Heater block for wirebonding (Making different steps on heater J.H. Jo 94/12/17 P1 79472
block)
- ----------------------------------------------------------------------------------------------------------------------------------
94-35635 Structure of leadframe for semiconductor package (Making specific G. Lee 94/12/21 P1 70022
dambar pattern)
- ----------------------------------------------------------------------------------------------------------------------------------
</TABLE>
-17-
<PAGE> 39
<TABLE>
<S> <C> <C> <C> <C>
- ----------------------------------------------------------------------------------------------------------------------------------
94-35636 Device and method of molding semiconductor (Dambarless) G. Lee 94/12/21 P1 72188
- ----------------------------------------------------------------------------------------------------------------------------------
94-35637 Device and method of molding semiconductor (Making a plural of I.T. Han 94/12/21 P1 43021
gates for same pressure on molding process)
- ----------------------------------------------------------------------------------------------------------------------------------
94-35246 Apparatus of eliminating particle of apparatus for manufacuring K.H. Lee 94/12/23 U1 33388
semiconductor package (Making air blower on trim/form appratus)
- ----------------------------------------------------------------------------------------------------------------------------------
94-35247 Cam floater of equipment for fabricating semiconductor package Y.H. Choi 94/12/23 U1 17627
- ----------------------------------------------------------------------------------------------------------------------------------
94-35248 Stroker of floating bar and index for fabricating semiconductor K.H. Lee 94/12/23 U1 19164
equipment
- ----------------------------------------------------------------------------------------------------------------------------------
94-35249 Adjusting apparatus of finger pin position for fabricating K.H. Lee 94/12/23
semiconductor equipment
- ----------------------------------------------------------------------------------------------------------------------------------
94-35250 Detecting apparatus for setting position of leadframe K.H. Lee 94/12/23
- ----------------------------------------------------------------------------------------------------------------------------------
94-35251 Spanking apparatus for fabricating semiconductor equipment K.H. Lee 94/12/23 U1 17800
- ----------------------------------------------------------------------------------------------------------------------------------
94-35252 Double forming apparatus for fabricating semiconductor equipment K.H. Lee 94/12/23 U1 23314
- ----------------------------------------------------------------------------------------------------------------------------------
94-35253 Detecting apparatus of mis-alignmented package for fabricating K.H. Lee 94/12/23 U1 17626
semiconductor equipment
- ----------------------------------------------------------------------------------------------------------------------------------
94-35254 Semiconductor package guide in semiconductor equipment K.H. Lee 94/12/23 U1 27109
- ----------------------------------------------------------------------------------------------------------------------------------
94-35255 Feeding apparatus of semiconductor package K.H. Lee 94/12/23 U1 26333
- ----------------------------------------------------------------------------------------------------------------------------------
94-35256 Degating apparatus Y.S. Kim 94/12/23 U1 20491
- ----------------------------------------------------------------------------------------------------------------------------------
</TABLE>
-18-
<PAGE> 40
<TABLE>
<S> <C> <C> <C> <C>
- ----------------------------------------------------------------------------------------------------------------------------------
94-35257 Burr pressing apparatus Y.S. Kim 94/12/23 U1 32461
- ----------------------------------------------------------------------------------------------------------------------------------
94-35258 Detecting apparatus of mis-loading tube for fabricating Y.H. Choi 94/12/23 U1 20490
semiconductor equipment
- ----------------------------------------------------------------------------------------------------------------------------------
94-35259 Inserting apparatus of package into tube K.H. Lee 94/12/23 U1 18231
- ----------------------------------------------------------------------------------------------------------------------------------
94-36206 Forming machine Y.M. Choi 94/12/23 P1 38840
- ----------------------------------------------------------------------------------------------------------------------------------
94-36207 Apparatus of operating slope cam Y.S. Kim 94/12/23 P1 27785
- ----------------------------------------------------------------------------------------------------------------------------------
94-36208 Tubular feeding method K.H. Lee 94/12/23 P1 37814
- ----------------------------------------------------------------------------------------------------------------------------------
94-36219 Method of coating in semiconductor chip K.H. Lee 94/12/23 P1 67143
- ----------------------------------------------------------------------------------------------------------------------------------
94-36220 Coating apparatus for semiconductor package K.H. Lee 94/12/23 P1 67142
- ----------------------------------------------------------------------------------------------------------------------------------
94-36221 Loader of feeding for coating equipment K.H. Lee 94/12/23 P1 43020
- ----------------------------------------------------------------------------------------------------------------------------------
94-36222 Coating machine for semiconductor package M.I. Kim 94/12/23 P1 67144
- ----------------------------------------------------------------------------------------------------------------------------------
94-36223 Machine of coating for semiconductor package M.I. Kim 94/12/23 P1 84714
- ----------------------------------------------------------------------------------------------------------------------------------
94-36224 Method of operating coating system M.I. Kim 94/12/23 P1 39266
- ----------------------------------------------------------------------------------------------------------------------------------
</TABLE>
-19-
<PAGE> 41
<TABLE>
<S> <C> <C> <C> <C>
- ----------------------------------------------------------------------------------------------------------------------------------
94-37167 Method of marking semiconductor package L.H. Kim 94/12/27
- ----------------------------------------------------------------------------------------------------------------------------------
94-37168 Leadframe pad structure (Making x-type paddle for reducing paddle I.K. Han 94/12/27 P0 201062
dimension)
- ----------------------------------------------------------------------------------------------------------------------------------
94-38872 Structure of molding for semiconductor package (Making champer Y.Y. Moon 94/12/29 P1 67145
type on the edge of siderail)
- ----------------------------------------------------------------------------------------------------------------------------------
94-39354 Semiconductor package (Consists of metal cap and advanced adhesive) Y.W. Heo 94/12/30 P1 67141
- ----------------------------------------------------------------------------------------------------------------------------------
95-00812 Jig of inspecting semiconductor package S.Y. Lee 95/1/20
- ----------------------------------------------------------------------------------------------------------------------------------
95-00940 Supporting trim die for leadframe I.S. Kim 95/1/20 P1 43139
- ----------------------------------------------------------------------------------------------------------------------------------
95-01928 Apparatus of lead sparking for semiconductor package I.S. Kim 95/2/3 P1 43138
- ----------------------------------------------------------------------------------------------------------------------------------
95-06328 Structure of feeding belt for equipment of manufacturing B.H. Park 95/3/31 U1 29220
semiconductor package
- ----------------------------------------------------------------------------------------------------------------------------------
95-06329 Apparatus of seperading bottom module B.H. Park 95/3/31 U1 20549
- ----------------------------------------------------------------------------------------------------------------------------------
95-07361 Transfer molding apparatus S.I. Kim 95/3/31 P1 72052
- ----------------------------------------------------------------------------------------------------------------------------------
95-07362 Method and device for forming the lead of PLCC semiconductor package B.H. Park 95/3/31 P1 72051
- ----------------------------------------------------------------------------------------------------------------------------------
95-07363 Semiconductor leadframe D.M. Moon 95/3/31
- ----------------------------------------------------------------------------------------------------------------------------------
95-09198 Semiconductor package (Connecting between chip and heatsink as PCB) J.H. Ku 95/4/19
- ----------------------------------------------------------------------------------------------------------------------------------
</TABLE>
-20-
<PAGE> 42
<TABLE>
<S> <C> <C> <C> <C>
- ----------------------------------------------------------------------------------------------------------------------------------
95-10418 Method for leveling solder ball array in BGA semiconductor package Y.W. Heo 95/4/29 P1 79473
- ----------------------------------------------------------------------------------------------------------------------------------
95-15045 A device for heating periphery of semiconductor mold die C.S. Yoo 95/6/8 P1 45996
- ----------------------------------------------------------------------------------------------------------------------------------
95-16397 Device for loading leadframe and heatspreader J.Y. Chung 95/6/20
- ----------------------------------------------------------------------------------------------------------------------------------
95-19581 Method and circuit board structure for leveling solder ball in BGA
semiconductor package
- ----------------------------------------------------------------------------------------------------------------------------------
95-19582 BGA simiconductor package with improved heat dissipation and I.K. Shim 95/7/5 P1 59987
dehumidification
- ----------------------------------------------------------------------------------------------------------------------------------
95-19583 Structure of heatsink for semiconductor package (Including Ni & W.S. Shin 95/7/5 P1 59985
Pd layer for wire bonding easily)
- ----------------------------------------------------------------------------------------------------------------------------------
95-19584 Method of manufacturing semiconductor package (Using solder W.S. Shin 95/7/5 P0 192226
plating and solder reflow)
- ----------------------------------------------------------------------------------------------------------------------------------
95-21041 Pad structure of leadframe I.K. Han 95/8/16
- ----------------------------------------------------------------------------------------------------------------------------------
95-21042 Leadframe structure (Making the paddle surface like net) D.H. Park 95/8/16
- ----------------------------------------------------------------------------------------------------------------------------------
95-21043 Heatsink structure (Making groove on heatsink's surface) S.M. Kim 95/8/16
- ----------------------------------------------------------------------------------------------------------------------------------
95-21044 Identifying mark for P.W.B. strip Y.M. Kim 95/8/16
- ----------------------------------------------------------------------------------------------------------------------------------
95-25172 Thin BGA semiconductor package with exposed heatsink I.K. Shim 95/8/16 P1 86759
- ----------------------------------------------------------------------------------------------------------------------------------
95-23884 Structure of semiconductor package (Attaching lead heatsink W.S. Shin 95/9/4
on lead surface)
- ----------------------------------------------------------------------------------------------------------------------------------
95-28770 Auxiliary oil pressure apparatus of mold press for manufacturing M.S. Lee 95/9/4
semiconductor package
- ----------------------------------------------------------------------------------------------------------------------------------
</TABLE>
-21-
<PAGE> 43
<TABLE>
<S> <C> <C> <C> <C>
- ----------------------------------------------------------------------------------------------------------------------------------
95-28772 Bonding method for the semiconductor chips S.J. Jang 95/9/4 P1 86752
- ----------------------------------------------------------------------------------------------------------------------------------
95-24350 Device of intergrated circuit and method thereof Rorert 95/8/7
- ----------------------------------------------------------------------------------------------------------------------------------
95-29420 Identifying mark for P.W.B strip C.K. Park 95/10/19 U1 43923
- ----------------------------------------------------------------------------------------------------------------------------------
95-29421 Heatsink structure for semiconductor package (Making groove on C.H. Woo 95/10/19
the below of heatsink)
- ----------------------------------------------------------------------------------------------------------------------------------
95-29422 Heatsink structure for semiconductor package J.H. Koo 95/10/19
- ----------------------------------------------------------------------------------------------------------------------------------
95-29423 Heatsink structure for semiconductor package (Making groove at D.B. Kang 95/10/19
dambar/tiebar)
- ----------------------------------------------------------------------------------------------------------------------------------
95-36139 Semiconductor package strip (Forming the rectangular of holes in D.J. Bae 95/10/19
trim/form process for identifying mark)
- ----------------------------------------------------------------------------------------------------------------------------------
95-36140 Semiconductor L.O.C. package structure S.G. Lee 95/10/19
- ----------------------------------------------------------------------------------------------------------------------------------
95-36141 PCB manufacturing method and BGA semiconductor package structure D.J. Bae 95/10/19
of the same
- ----------------------------------------------------------------------------------------------------------------------------------
95-36142 Tube vibrating device of semiconductor manufacturing equipment B.S. Bae 95/10/19
- ----------------------------------------------------------------------------------------------------------------------------------
95-36143 Leadframe of semiconductor package (Making notch for preventing G. Lee 95/10/19
distortion before trim/form process)
- ----------------------------------------------------------------------------------------------------------------------------------
95-36144 Marking method of semiconductor package W.S. Shin 95/10/19
- ----------------------------------------------------------------------------------------------------------------------------------
95-36145 Mold die for manufacturing semiconductor package L.H. Kim 95/10/19
- ----------------------------------------------------------------------------------------------------------------------------------
95-30143 Heater block structure for wire bonding J.M. Kim 95/10/25
- ----------------------------------------------------------------------------------------------------------------------------------
95-30144 Heater block structure for wire bonding D.S. Sho 95/10/25
- ----------------------------------------------------------------------------------------------------------------------------------
</TABLE>
-22-
<PAGE> 44
<TABLE>
<S> <C> <C> <C> <C>
- ----------------------------------------------------------------------------------------------------------------------------------
95-30145 Dispensing system for die coating B.H. Moon 95/10/25
- ----------------------------------------------------------------------------------------------------------------------------------
95-36947 Solder ball forming method of BGA semiconductor package I.K. Shim 95/10/25
- ----------------------------------------------------------------------------------------------------------------------------------
95-36948 M.C.M. package C.K. Park 95/10/25
- ----------------------------------------------------------------------------------------------------------------------------------
95-36949 Magazine fixing device of trim/forming apparatus for manufacturing B.H. Park 95/10/25 P1 66561
semiconductor package
- ----------------------------------------------------------------------------------------------------------------------------------
95-36950 Heatsink structure of semiconductor package (Making holes on J.H. Yun 95/10/25 P0 201063
heatsink)
- ----------------------------------------------------------------------------------------------------------------------------------
95-37513 Printed circuit board having epoxy barrier around its throughout Y.W. Heo 95/10/27 P1 70024
slot and ball grid array semiconductor package using such a printed
circuit board, thereby exhibiting a high moisture discharge
characteristic
- ----------------------------------------------------------------------------------------------------------------------------------
95-33139 Forming punch of manufacturing equipment for semiconductor package M.S. Moon 95/11/11
- ----------------------------------------------------------------------------------------------------------------------------------
95-33140 Trim die fixing holder of manufacturing equipment for semiconductor M.S. Moon 95/11/11
package
- ----------------------------------------------------------------------------------------------------------------------------------
95-40842 Automatic speed checking apparatus of transfer ram in mold press TY JUNG 95/11/11
of semiconductor manufacturing equipment
- ----------------------------------------------------------------------------------------------------------------------------------
95-40843 Semiconductor package forming method M.S. Moon 95/11/11
- ----------------------------------------------------------------------------------------------------------------------------------
95-33944 Supply device of semiconductor package inserted into the tube K.H. Lee 95/11/16
- ----------------------------------------------------------------------------------------------------------------------------------
95-33945 Semiconductor package lead fixing device K.H. Lee 95/11/16
- ----------------------------------------------------------------------------------------------------------------------------------
95-33946 Detecting device for bad tube K.H. Lee 95/11/16
- ----------------------------------------------------------------------------------------------------------------------------------
95-33947 Supply device of semiconductor package tube W.H. Choi 95/11/16
- ----------------------------------------------------------------------------------------------------------------------------------
</TABLE>
-23-
<PAGE> 45
<TABLE>
<S> <C> <C> <C> <C>
- ----------------------------------------------------------------------------------------------------------------------------------
95-33948 Marking structure in semiconductor package marking equipment W.H. Choi 95/11/16
- ----------------------------------------------------------------------------------------------------------------------------------
95-41665 Semiconductor package test equipment W.H. Choi 95/11/16 P1 71668
- ----------------------------------------------------------------------------------------------------------------------------------
95-41843 Semiconductor package leadframe manufacturing method and W.S. Shin 95/11/17 P0 198313
semiconductor package manufacturing process/structure thereof
- ----------------------------------------------------------------------------------------------------------------------------------
95-41844 Semiconductor package structure (Making a variety of chemicals W.S. Shin 95/11/17
layer for adhesive power)
- ----------------------------------------------------------------------------------------------------------------------------------
95-41845 Semiconductor chip bonding method and structure for using J.K. Lee 95/11/17 P0 201379
solder ball
- ----------------------------------------------------------------------------------------------------------------------------------
95-41846 Using printed circuit board carrier frame for ball grid array
semiconductor package and method for fabricating ball grid array
semiconductor package using the same
- ----------------------------------------------------------------------------------------------------------------------------------
95-34640 Epoxy mixing apparatus (Using irregular vibration) D.Y. Sho 95/11/21
- ----------------------------------------------------------------------------------------------------------------------------------
95-34641 Absorpation block of semiconductor package manufacturing method D.Y. Sho 95/11/21
of the same
- ----------------------------------------------------------------------------------------------------------------------------------
95-42560 Method and structure for manufacturing heatsink of semiconductor W.S. Shin 95/11/21
package (Using the method of casting & sintering)
- ----------------------------------------------------------------------------------------------------------------------------------
95-36372 Capillary of bonding device for manufacturing semiconductor package J.H. Choi 95/11/29
- ----------------------------------------------------------------------------------------------------------------------------------
95-36373 Heatspread safe mounter for semiconductor package D.S. Kim 95/11/29
- ----------------------------------------------------------------------------------------------------------------------------------
95-44553 Method and structure for manufacturing semiconductor package (CSP) W.S. Shin 95/11/29 P1 80280
- ----------------------------------------------------------------------------------------------------------------------------------
95-47009 Method and structure for manufacturing semiconductor package (CSP) I.T. Han 95/12/6 P1 78626
- ----------------------------------------------------------------------------------------------------------------------------------
</TABLE>
-24-
<PAGE> 46
<TABLE>
<S> <C> <C> <C> <C>
- ----------------------------------------------------------------------------------------------------------------------------------
95-38947 Solder ball forming method for BGA semiconductor package
- ----------------------------------------------------------------------------------------------------------------------------------
95-38855 Leadframe fixing apparatus for semiconductor package I.S. Hwang 95/12/7
- ----------------------------------------------------------------------------------------------------------------------------------
95-47349 Solder ball safe mounting device in integrated circuit package I.S. Hwang 95/12/7 P1 80281
- ----------------------------------------------------------------------------------------------------------------------------------
95-45942 Heater block of apparatus for manufacturing semiconductor package S.J. Son 95/12/22
- ----------------------------------------------------------------------------------------------------------------------------------
95-48972 Leadframe structure for semiconductor package (Reducing the S.G. Lee 95/12/27 U0 143373
dimension between paddle and lead)
- ----------------------------------------------------------------------------------------------------------------------------------
95-48973 Pad structure of leadframe (Making spiral shape on leadframe) D.H. Moon 95/12/27
- ----------------------------------------------------------------------------------------------------------------------------------
95-48974 Pad structure of leadframe I.K. Han 95/12/27
- ----------------------------------------------------------------------------------------------------------------------------------
95-58806 Semiconductor package leadframe with stress absorbing means on Y.S. Jung 95/12/27 P1 91078
fused leads
- ----------------------------------------------------------------------------------------------------------------------------------
95-58807 Semiconductor package using flip chip technique (CSP) D.S. Yoo 95/12/27
- ----------------------------------------------------------------------------------------------------------------------------------
95-58808 Frame structure for cleaning mold die (Anodizing metalliclayer D.S. Kim 95/12/27
or metallic tape)
- ----------------------------------------------------------------------------------------------------------------------------------
95-58809 Chip size semiconductor package (CSP using substrate attaching S.G. Lee 95/12/27
anisotropic conductive film and copper foil)
- ----------------------------------------------------------------------------------------------------------------------------------
95-50614 Semiconductor package (Making dam for preventing delamination W.S. Shin 95/12/28
from the top & bottom of paddle)
- ----------------------------------------------------------------------------------------------------------------------------------
95-50615 Structure of semiconductor package (Paddleless) D.H. Moon 95/12/28
- ----------------------------------------------------------------------------------------------------------------------------------
95-50616 Semiconductor package (Surrounded by metal-cap at the bottom) S.M. Kim 95/12/28
- ----------------------------------------------------------------------------------------------------------------------------------
95-50617 Leadframe structure for semiconductor packaging having fused area E.S. Son 95/12/28
- ----------------------------------------------------------------------------------------------------------------------------------
</TABLE>
-25-
<PAGE> 47
<TABLE>
<S> <C> <C> <C> <C>
- ----------------------------------------------------------------------------------------------------------------------------------
95-50618 Leadframe structure for semiconductor packaging (Making slots on E.S. Son 95/12/28
lead tip for reducing thermal stress)
- ----------------------------------------------------------------------------------------------------------------------------------
95-50619 Structure of semiconductor package (Attaching the reliable heatsink) J.H. Yoon 95/12/28
- ----------------------------------------------------------------------------------------------------------------------------------
95-50620 Plug of tube for shipping semiconductor package (Making a I. Hwang 95/12/28
versatile plug)
- ----------------------------------------------------------------------------------------------------------------------------------
95-61438 Semiconductor package (Making dam for sweeping molding compound) M.Y. Lee 95/12/28 P1 91076
- ----------------------------------------------------------------------------------------------------------------------------------
95-61439 Structure of heat slug for semiconductor package (Making wings on J.H. Ku 95/12/28 P1 91077
the peripheral heat plug for gaining locking power)
- ----------------------------------------------------------------------------------------------------------------------------------
95-61440 Method of manufacturing leadframe (Adding thermal process in W.S. Shin 95/12/28
forming process)
- ----------------------------------------------------------------------------------------------------------------------------------
95-52621 Leadframe structure for semiconductor package (Making tiebar for K.J. Kim 95/12/29
preventing chip out from chip paddle
- ----------------------------------------------------------------------------------------------------------------------------------
95-52622 Leadframe structure for semiconductor package (Making a lot of Y.C. Lyu 95/12/29
leads for integrated circuit)
- ----------------------------------------------------------------------------------------------------------------------------------
95-52623 Method for supplying electricity of rectifier during plating A.K. Kang 95/12/29
process by iron plating
- ----------------------------------------------------------------------------------------------------------------------------------
95-52624 Device for detecting fixed state of leadframe during plating C.K. Kim 95/12/29
process by iron plating (Attaching the touch sensor at the below of
Iron plating belt)
- ----------------------------------------------------------------------------------------------------------------------------------
95-52625 Structure for preventing grip belt from sagging during plating A.K. Kang 95/12/29
process by iron plating
- ----------------------------------------------------------------------------------------------------------------------------------
95-52626 Filtering method of plating liquid in plating process A.K. Kang 95/12/29
- ----------------------------------------------------------------------------------------------------------------------------------
</TABLE>
-26-
<PAGE> 48
<TABLE>
<S> <C> <C> <C> <C>
- ----------------------------------------------------------------------------------------------------------------------------------
95-53421 Pellet kicker structure for manufacturing semiconductor package Y.J. Kwun 95/12/29
- ----------------------------------------------------------------------------------------------------------------------------------
95-53422 Molding apparatus for cutting flash of thin semiconductor package Y.J. Kwun 95/12/29
- ----------------------------------------------------------------------------------------------------------------------------------
95-53423 Ink marking area structure of heatsink for semiconductor package L.H. Kim 95/12/29
- ----------------------------------------------------------------------------------------------------------------------------------
95-53424 Structure of semiconductor package for preventing leakage of D.H. Park 95/12/29
electromagnetic wave
- ----------------------------------------------------------------------------------------------------------------------------------
95-53425 Method of manufacturing chip size semiconductor package Y.S. Yoon 95/12/29
- ----------------------------------------------------------------------------------------------------------------------------------
95-53426 Tray for semiconductor package (Making supporting pole at the I. Hwang 95/12/29
side of tray)
- ----------------------------------------------------------------------------------------------------------------------------------
95-53427 Heatsink structure for semiconductor package (Making cap type) S.G. Lee 95/12/29
- ----------------------------------------------------------------------------------------------------------------------------------
95-53428 Heatsink structure for semiconductor package (Making a lot of D.B. Kang 95/12/29
stripe on heatsink)
- ----------------------------------------------------------------------------------------------------------------------------------
95-53429 Structure of installing pad of cam punch for forming H.Y. Lee 95/12/29
semiconductor package
- ----------------------------------------------------------------------------------------------------------------------------------
95-53430 Structure of controlling position of cam punch for forming H.Y. Lee 95/12/29
semiconductor package
- ----------------------------------------------------------------------------------------------------------------------------------
95-53431 Apparatus of operating cam punch for forming semiconductor package H.Y. Lee 95/12/29
- ----------------------------------------------------------------------------------------------------------------------------------
95-53432 Structure of cam punch for forming semiconductor package H.Y. Lee 95/12/29
- ----------------------------------------------------------------------------------------------------------------------------------
95-53433 Structure of cleaning pad for marking semiconductor package H.Y. Moon 95/12/29
- ----------------------------------------------------------------------------------------------------------------------------------
95-53434 Structure of semiconductor package (tiebarless & downset less) D.S. Yoo 95/12/29
- ----------------------------------------------------------------------------------------------------------------------------------
95-65450 Semiconductor package (CSP: connecting between chip pad and D.H. Park 95/12/29
bond pad as a gold ball)
- ----------------------------------------------------------------------------------------------------------------------------------
</TABLE>
-27-
<PAGE> 49
<TABLE>
<S> <C> <C> <C> <C>
- ----------------------------------------------------------------------------------------------------------------------------------
95-65451 Structure of semiconductor package (CSP) S.M. Kim 95/12/29
- ----------------------------------------------------------------------------------------------------------------------------------
95-65452 Structure of semiconductor package (Trim-less) S.M. Kim 95/12/29
- ----------------------------------------------------------------------------------------------------------------------------------
95-65453 Method of coating surface of semiconductor package B.H. Ahn 95/12/29
- ----------------------------------------------------------------------------------------------------------------------------------
95-67199 Cam die for forming semiconductor package H.Y. Lee 95/12/29
- ----------------------------------------------------------------------------------------------------------------------------------
95-67200 Mold die for molding semiconductor package D.J. Kim 95/12/29
- ----------------------------------------------------------------------------------------------------------------------------------
95-67201 Cam punch for forming semiconductor package H.Y. Lee 95/12/29
- ----------------------------------------------------------------------------------------------------------------------------------
95-67202 Method of adhesive semiconductor chip and structure of Y.K. Lee 95/12/29
leadframe (QFP)
- ----------------------------------------------------------------------------------------------------------------------------------
95-67203 Structure of leadframe and method of attaching semiconductor Y.J. Park 95/12/29
package using
- ----------------------------------------------------------------------------------------------------------------------------------
95-67204 Die of cutting lead J.Y. No 95/12/29
- ----------------------------------------------------------------------------------------------------------------------------------
95-67205 Punch of cutting lead I.K. Ko 95/12/29
- ----------------------------------------------------------------------------------------------------------------------------------
95-55056 Storage box of die-bonded leadframe materials M.S. Park 95/12/30
- ----------------------------------------------------------------------------------------------------------------------------------
95-55057 Storage box for leadframe stacked magazine during manufacturing H.L. Kim 95/12/30
package
- ----------------------------------------------------------------------------------------------------------------------------------
95-55058 Block letter pad attaching structure of marking equipment for B.H. Park 95/12/30
manufacturing semiconductor package
- ----------------------------------------------------------------------------------------------------------------------------------
95-55059 Semiconductor package (Making holes on PKG-body for controlling D.J. Bae 95/12/30
loading position)
- ----------------------------------------------------------------------------------------------------------------------------------
95-55060 Bend reforming device in PCB frame materials Y.S. Hwang 95/12/30
- ----------------------------------------------------------------------------------------------------------------------------------
95-69090 Flux spreading method of integrated circuit package Y.S. Hwang 95/12/30
- ----------------------------------------------------------------------------------------------------------------------------------
</TABLE>
-28-
<PAGE> 50
<TABLE>
<S> <C> <C> <C> <C>
- ----------------------------------------------------------------------------------------------------------------------------------
95-69091 Block letter plate fixing device of marking apparatus for B.H. Park 95/12/30
manufacturing semiconductor package
- ----------------------------------------------------------------------------------------------------------------------------------
95-69092 Marking apparatus for manufacturing semiconductor package B.H. Park 95/12/30
- ----------------------------------------------------------------------------------------------------------------------------------
95-69093 Semiconductor package for using solderballs and leads as I/O Y.S. Son 95/12/30
terminal
- ----------------------------------------------------------------------------------------------------------------------------------
95-69094 Chip size package structure and manufacturing method thereof S.H. Ha 95/12/30
- ----------------------------------------------------------------------------------------------------------------------------------
95-69095 Chip size package and manufacturing method thereof S.H. Ha 95/12/30
- ----------------------------------------------------------------------------------------------------------------------------------
95-69096 Chip size package structure and manufacturing method thereof S.H. Ha 95/12/30
- ----------------------------------------------------------------------------------------------------------------------------------
95-69097 Chip size package K.C. Lee 95/12/30
- ----------------------------------------------------------------------------------------------------------------------------------
95-69098 BGA semiconductor package N.H. Kwak 95/12/30
- ----------------------------------------------------------------------------------------------------------------------------------
95-69099 Leadframe of semiconductor package (Making double ring for wire S.D. Lee 95/12/30
bonding easily power bonding and ground bonding)
- ----------------------------------------------------------------------------------------------------------------------------------
95-69100 Package heating method during wire bonding process of B.H. Moon 95/12/30
manufacturing semiconductor package
- ----------------------------------------------------------------------------------------------------------------------------------
95-69101 Semiconductor package (CSP) Y.M. Kim 95/12/30
- ----------------------------------------------------------------------------------------------------------------------------------
96-05342 Die bonder C.J. Song 96/2/29 P0189378
- ----------------------------------------------------------------------------------------------------------------------------------
96-05343 Wafer map conversion method C.J. Song 96/2/29 P0192216
- ----------------------------------------------------------------------------------------------------------------------------------
96-05345 Method of producing BGA semiconductor package metal carrier I.K. Shim 96/2/29 P0192760
frame and BGA package produced by such method
- ----------------------------------------------------------------------------------------------------------------------------------
</TABLE>
-29-
<PAGE> 51
<TABLE>
<S> <C> <C> <C> <C>
- ----------------------------------------------------------------------------------------------------------------------------------
96-06302 Method of manufacturing semiconductor package and structure Y.W. Heo 96/3/11 P0192758
produced by such method (CSP: Making solder bump on chip pad)
- ----------------------------------------------------------------------------------------------------------------------------------
96-06303 Method of forming bump of CSP package (Forming bump on chip pad) Y.W. Heo 96/3/11 P0192759
- ----------------------------------------------------------------------------------------------------------------------------------
96-09774 Method of manufactuting semiconductor package and structure Y.W. Heo 96/4/1
produced by such method
- ----------------------------------------------------------------------------------------------------------------------------------
96-09775 Semiconductor package and method of manufacturing the same (BLP) W.S. Shin 96/4/1
- ----------------------------------------------------------------------------------------------------------------------------------
96-09777 BGA semiconductor package M.E. Lee 96/4/1
- ----------------------------------------------------------------------------------------------------------------------------------
96-09778 Solder ball land metal structure of BGA semiconductor package M.E. Lee 96/4/1
- ----------------------------------------------------------------------------------------------------------------------------------
96-06892 Structure for connecting mold chase of mold for manufacturing H.J. Lee 96/4/1 U0146456
semiconductor package
- ----------------------------------------------------------------------------------------------------------------------------------
96-14883 Apparatus for changing fixture of UVO3 automatic cleaner K.N. Kim 96/6/4 U0148893
- ----------------------------------------------------------------------------------------------------------------------------------
96-14884 Apparatus for controlling width of guide rail in leadframe loader Y.C. Cho 96/6/4
- ----------------------------------------------------------------------------------------------------------------------------------
96-14885 Leadframe loader K.N. Kim 96/6/4
- ----------------------------------------------------------------------------------------------------------------------------------
96-14886 Handler apparatus of UVO3 automatic cleaner Y.C. Cho 96/6/4 U0148894
- ----------------------------------------------------------------------------------------------------------------------------------
96-19858 Fixture structure of UVO3 automatic cleaner K.N. Kim 96/6/4
- ----------------------------------------------------------------------------------------------------------------------------------
96-19859 Loading and unloading apparatus of UVO3 automatic cleaner Y.C. Cho 96/6/4
- ----------------------------------------------------------------------------------------------------------------------------------
96-19860 UVO3 automatic cleaner apparatus K.N. Kim 96/6/4
- ----------------------------------------------------------------------------------------------------------------------------------
96-16791 Structure of heater block for bonding wire for BGA semiconductor I.S. Yoon 96/6/20
package
- ----------------------------------------------------------------------------------------------------------------------------------
</TABLE>
-30-
<PAGE> 52
<TABLE>
<S> <C> <C> <C> <C>
- ----------------------------------------------------------------------------------------------------------------------------------
96-16792 Mold structure for molding BGA semiconductor package I.S. Yoon 96/6/20
- ----------------------------------------------------------------------------------------------------------------------------------
96-16793 Heatsink for semiconductor package B.H. Ahn 96/6/20
- ----------------------------------------------------------------------------------------------------------------------------------
96-22659 Leadframe structure and method of manufacturing semiconductor S.K. Lee 96/6/20
package using the same (Making supporting poles near by tiebar)
- ----------------------------------------------------------------------------------------------------------------------------------
96-22660 Leadframe pad of semiconductor package for improving molding K.O. Sohn 96/6/20
reliability (Making a plural of adhesive pattern at the
peripheral of paddle)
- ----------------------------------------------------------------------------------------------------------------------------------
96-22661 Leadframe pad of semiconductor package for improving molding K.O. Sohn 96/6/20
reliability
- ----------------------------------------------------------------------------------------------------------------------------------
96-22897 Array chip scale semiconductor package W.S. Shin 96/6/21
- ----------------------------------------------------------------------------------------------------------------------------------
96-22898 Array chip on chip semiconductor package I.K. Han 96/6/21
- ----------------------------------------------------------------------------------------------------------------------------------
96-22899 Lead array leadframe and semiconductor package using the same B.J. Han 96/6/21
- ----------------------------------------------------------------------------------------------------------------------------------
96-22900 Semiconductor package and method of manufacturing the same L.H. Kim 96/6/21
(paddleless and tiebarless)
- ----------------------------------------------------------------------------------------------------------------------------------
96-22901 Semiconductor package and method for fabrication the same (CSP) Y.W. Heo 96/6/21
- ----------------------------------------------------------------------------------------------------------------------------------
96-22902 Leadframe structure and semiconductor package using the same B.H. Ahn 96/6/21 P0198312
(Downset-less)
- ----------------------------------------------------------------------------------------------------------------------------------
96-22903 Method of molding BGA semiconductor attached heatsink Y.M. Kim 96/6/21
- ----------------------------------------------------------------------------------------------------------------------------------
96-27617 Structure of socket for BGA semiconductor package J.H. Yoon 96/7/9
- ----------------------------------------------------------------------------------------------------------------------------------
96-27618 Leadframe structure and semiconductor package using the same (QFP) J.H. Yoon 96/7/9
- ----------------------------------------------------------------------------------------------------------------------------------
</TABLE>
-31-
<PAGE> 53
<TABLE>
<S> <C> <C> <C> <C>
- ----------------------------------------------------------------------------------------------------------------------------------
96-27619 Purity supply system for building wafer Y.W. Kim 96/7/9
- ----------------------------------------------------------------------------------------------------------------------------------
96-29000 Tray for inspecting reliability of semiconductor package H.S. Jang 96/7/18
- ----------------------------------------------------------------------------------------------------------------------------------
96-29001 Apparatus of inspecting reliability of semiconductor package H.S. Jang 96/7/18 P182191
- ----------------------------------------------------------------------------------------------------------------------------------
96-21510 Structure of megazine B.T. Hwang 96/7/22
- ----------------------------------------------------------------------------------------------------------------------------------
96-21511 Ion plating apparatus for semiconductor package A.K. Kang 96/7/22 U0149178
- ----------------------------------------------------------------------------------------------------------------------------------
96-21512 Apparatus of inserting semiconductor package B.H. Park 96/7/22
- ----------------------------------------------------------------------------------------------------------------------------------
96-21513 Loading apparatus of leadframe in ion plating process A.K. Kang 96/7/22 U0146267
- ----------------------------------------------------------------------------------------------------------------------------------
96-29555 Automatic solder ball placement apparatus D.S. Cho 96/7/22
- ----------------------------------------------------------------------------------------------------------------------------------
96-29556 Apparatus of loading PCB of automatic solder ball placement system J.L. Jang 96/7/22
- ----------------------------------------------------------------------------------------------------------------------------------
96-29557 Apparatus of vibrating solder ball mounting members of automatic D.S. Cho 96/7/22
solder ball placement system
- ----------------------------------------------------------------------------------------------------------------------------------
96-29558 Robot arm apparatus of automatic solder ball placement system J.Y. Ha 96/7/22
- ----------------------------------------------------------------------------------------------------------------------------------
96-29559 Apparatus of transferring leadframe of making apparatus for B.H. Park 96/7/22
manufacturing semiconductor package
- ----------------------------------------------------------------------------------------------------------------------------------
96-30286 Air blow system for semiconductor package Y.I. Jang 96/7/25 P0201378
- ----------------------------------------------------------------------------------------------------------------------------------
96-30287 Apparatus for reloading of automatic solder ball placement system B.P. Jung 96/7/25
- ----------------------------------------------------------------------------------------------------------------------------------
96-30486 Structure of establishing circuit position of mold for Y.Y. Moon 96/9/21 U145718
semiconductor package
- ----------------------------------------------------------------------------------------------------------------------------------
</TABLE>
-32-
<PAGE> 54
<TABLE>
<S> <C> <C> <C> <C>
- ----------------------------------------------------------------------------------------------------------------------------------
96-41463 Heatspreader structure (PQIP) S.K. Lee 96/9/21
- ----------------------------------------------------------------------------------------------------------------------------------
96-41464 Stacking BGA semiconductor package S.M. Kim 96/9/21
- ----------------------------------------------------------------------------------------------------------------------------------
96-41465 Circuit board for BGA semiconductor package for testing electric Y.M. Kim 96/9/21
reliability
- ----------------------------------------------------------------------------------------------------------------------------------
96-41466 Apparatus of testing electric reliability for semiconductor Y.M. Kim 96/9/21
package (Making prove pin on PCB)
- ----------------------------------------------------------------------------------------------------------------------------------
96-41467 Heatspreader for semiconductor package D.Y. Kim 96/9/21 P187801
- ----------------------------------------------------------------------------------------------------------------------------------
96-41468 Semiconductor package structure D.H. Park 96/9/21 P196493
- ----------------------------------------------------------------------------------------------------------------------------------
96-41470 Mold for BGA semiconductor package Y.Y. Moon 96/9/21 P194362
- ----------------------------------------------------------------------------------------------------------------------------------
96-41472 PCB clamping apparatus for molding BGA semiconductor package Y.Y. Moon 96/9/21 P196494
- ----------------------------------------------------------------------------------------------------------------------------------
96-43841 CSP structure and method of manufacturing the same Y.Y. Moon 96/10/4
- ----------------------------------------------------------------------------------------------------------------------------------
96-43842 CSP structure and method of manufacturing the same S.K. Lee 96/10/4
- ----------------------------------------------------------------------------------------------------------------------------------
96-43844 BGA semiconductor package S.K. Lee 96/10/4
- ----------------------------------------------------------------------------------------------------------------------------------
96-44452 3th form die holder of trim and form system S.K. Lee 96/10/7 P0207341
- ----------------------------------------------------------------------------------------------------------------------------------
96-44453 Singulation die holder of trim and form system J.B. Kim 96/10/7 P0207342
- ----------------------------------------------------------------------------------------------------------------------------------
</TABLE>
-33-
<PAGE> 55
<TABLE>
<S> <C> <C> <C> <C>
- ----------------------------------------------------------------------------------------------------------------------------------
96-44454 Form die holder of trim and form system M.H. Park 96/10/7 P189395
- ----------------------------------------------------------------------------------------------------------------------------------
96-44789 Heatsink-integrated semiconductor package with double W.S. Shin 96/10/9
encapsulating parts and method for fabricating the same
- ----------------------------------------------------------------------------------------------------------------------------------
96-46656 Semiconductor package S.K. Lee 96/10/18
- ----------------------------------------------------------------------------------------------------------------------------------
96-46657 Semiconductor package S.K. Lee 96/10/18
- ----------------------------------------------------------------------------------------------------------------------------------
96-34290 Wire spool structure of wire bonding apparatus S.H. Kim 96/10/18
- ----------------------------------------------------------------------------------------------------------------------------------
96-46948 PCB strip structure and semiconductor package produced by such
method
- ----------------------------------------------------------------------------------------------------------------------------------
96-46949 CSP semiconductor package and method of manufacturing the same S.K. Lee 96/10/19
- ----------------------------------------------------------------------------------------------------------------------------------
96-47915 Solder bumping apparatus K.H. Lee 96/10/24
- ----------------------------------------------------------------------------------------------------------------------------------
96-47916 Apparatus of transferring BGA semiconductor package of solder K.H. Lee 96/10/24
bumping apparatus
- ----------------------------------------------------------------------------------------------------------------------------------
96-47917 Solder ball mounting apparatus of solder bumping apparatus K.H. Lee 96/10/24
- ----------------------------------------------------------------------------------------------------------------------------------
96-47918 Solder tray apparatus of solder bumping apparatus K.H. Lee 96/10/24
- ----------------------------------------------------------------------------------------------------------------------------------
96-47919 Apparatus of inspecting adhesion status of solder bumping apparatus K.H. Lee 96/10/24
- ----------------------------------------------------------------------------------------------------------------------------------
96-47920 Solder ball unloading apparatus of solder bumping apparatus K.H. Lee 96/10/24
- ----------------------------------------------------------------------------------------------------------------------------------
96-47921 Apparatus of inspecting solder ball mounting of solder bumping K.H. Lee 96/10/24
apparatus
- ----------------------------------------------------------------------------------------------------------------------------------
96-47922 Loading apparatus of solder bumping apparatus K.H. Lee 96/10/24
- ----------------------------------------------------------------------------------------------------------------------------------
</TABLE>
-34-
<PAGE> 56
<TABLE>
<S> <C> <C> <C> <C>
- ----------------------------------------------------------------------------------------------------------------------------------
96-49378 Mold for semiconductor package H.Y. Yoo 96/10/29
- ----------------------------------------------------------------------------------------------------------------------------------
96-49379 Semiconductor package (Making at least one of the via-hole at H.Y. Yoo 96/10/29
the bottom in molding process)
- ----------------------------------------------------------------------------------------------------------------------------------
96-51528 Leadframe for semiconductor package Y.S. Jung 96/11/1
- ----------------------------------------------------------------------------------------------------------------------------------
96-58753 Method of manufacturing leadframe having exposed and arrayed W.S. Shin 96/11/28
I/O terminal at below surface of semiconductor package(CSP)
- ----------------------------------------------------------------------------------------------------------------------------------
96-58754 Method of manufacturing leadframe having fused solder ball at W.S. Shin 96/11/28
below surface of semiconductor package(CSP)
- ----------------------------------------------------------------------------------------------------------------------------------
96-58755 Semiconductor package structure(TQFP) W.S. Shin 96/11/28
- ----------------------------------------------------------------------------------------------------------------------------------
96-58756 CSP structure having bottom lead type W.S. Shin 96/11/28
- ----------------------------------------------------------------------------------------------------------------------------------
96-58757 Leadframe structure for CSP S.S. Jang 96/11/28
- ----------------------------------------------------------------------------------------------------------------------------------
96-58758 Method of forming flip chip bump J.H Song 96/11/28
- ----------------------------------------------------------------------------------------------------------------------------------
96-58759 Lead on chip area array bumped semiconductor package W.S. Shin 96/11/28
- ----------------------------------------------------------------------------------------------------------------------------------
96-58760 Area array bumped semiconductor package having ground and W.S. Shin 96/11/28
power lines
- ----------------------------------------------------------------------------------------------------------------------------------
96-58761 Area array bumped semiconductor package having a plurality of W.S. Shin 96/11/28
chips
- ----------------------------------------------------------------------------------------------------------------------------------
96-58762 Area array bumped semiconductor package having ground and W.S. Shin 96/11/28
power lines
- ----------------------------------------------------------------------------------------------------------------------------------
96-58800 Wafer transfer apparatus of wafer mounting system W.H. Kong 96/11/28
- ----------------------------------------------------------------------------------------------------------------------------------
96-58801 Alignment of wafer mounting system C.B. Lee 96/11/28 P199821
- ----------------------------------------------------------------------------------------------------------------------------------
</TABLE>
-35-
<PAGE> 57
<TABLE>
<S> <C> <C> <C> <C>
- ----------------------------------------------------------------------------------------------------------------------------------
96-58802 Chuck apparatus of wafer mounting system W.H. Kong 96/11/28 P199822
- ----------------------------------------------------------------------------------------------------------------------------------
96-58803 Wafer check of wafer mounting system W.H. Kong 96/11/28 P199823
- ----------------------------------------------------------------------------------------------------------------------------------
96-58804 Frame check of wafer mounting system W.H. Kong 96/11/28 P199824
- ----------------------------------------------------------------------------------------------------------------------------------
96-58805 Apparatus of cutting tape of wafer mounting system W.H. Kong 96/11/28 P199825
- ----------------------------------------------------------------------------------------------------------------------------------
96-58806 Roller apparatus of wafer mounting system C.B. Lee 96/11/28 P199826
- ----------------------------------------------------------------------------------------------------------------------------------
96-58807 Tape transfer apparatus of wafer mounting system W.H. Kong 96/11/28 P199827
- ----------------------------------------------------------------------------------------------------------------------------------
96-58808 Tape tension main tenance detaining of wafer mounting system W.H. Kong 96/11/28
- ----------------------------------------------------------------------------------------------------------------------------------
96-58809 Station of wafer mounting system W.H. Kong 96/11/28
- ----------------------------------------------------------------------------------------------------------------------------------
96-58810 Liner of mold for semiconductor package Y.Y. Moon 96/11/28
- ----------------------------------------------------------------------------------------------------------------------------------
96-58811 Loading bar of mold for semiconductor package Y.Y. Moon 96/11/28
- ----------------------------------------------------------------------------------------------------------------------------------
96-58812 PCB of BGA semiconductor package Y.Y. Moon 96/11/28
- ----------------------------------------------------------------------------------------------------------------------------------
96-58813 PCB of BGA semiconductor package Y.Y. Moon 96/11/28
- ----------------------------------------------------------------------------------------------------------------------------------
96-58814 PCB transferring apparatus of forming system for BGA Y.Y. Moon 96/11/28
semiconductor package
- ----------------------------------------------------------------------------------------------------------------------------------
96-58815 Cavity plating installation structure of molding device for BGA Y.Y. Moon 96/11/28 P198031
semiconductor package
- ----------------------------------------------------------------------------------------------------------------------------------
</TABLE>
-36-
<PAGE> 58
<TABLE>
<S> <C> <C> <C> <C>
- ----------------------------------------------------------------------------------------------------------------------------------
96-58816 Top moiding structure of molding device for BGA semiconductor Y.Y. Moon 96/11/28 P198032
package
- ----------------------------------------------------------------------------------------------------------------------------------
96-58817 Wafer mounting method and apparatus for semiconductor package C.B. Lee 96/11/28
- ----------------------------------------------------------------------------------------------------------------------------------
96-61958 Trimming method and apparatus for semiconductor package HJ Son 96/12/5
- ----------------------------------------------------------------------------------------------------------------------------------
96-61959 Apparatus for inspecting trag inner material C.H. Lee 96/12/5
- ----------------------------------------------------------------------------------------------------------------------------------
96-62298 Structure and manufacturing method of CSP I.T. Han 96/12/6
- ----------------------------------------------------------------------------------------------------------------------------------
96-62299 Structure and manufacturing method of CSP I.T. Han 96/12/6
- ----------------------------------------------------------------------------------------------------------------------------------
96-62300 BGA semiconductor package W.Y. Pyo 96/12/6
- ----------------------------------------------------------------------------------------------------------------------------------
96-62301 Semiconductor package K.C. Lee 96/12/6
- ----------------------------------------------------------------------------------------------------------------------------------
96-62302 BGA semiconductor package W.Y. Pyo 96/12/6
- ----------------------------------------------------------------------------------------------------------------------------------
96-62303 Structure preventing bending effect from semiconductor package T.B. Jung 96/12/6
- ----------------------------------------------------------------------------------------------------------------------------------
96-62304 Structure and manufacturing method of CSP I.T. Han 96/12/6
- ----------------------------------------------------------------------------------------------------------------------------------
96-62305 Method for marking poor quality printed
circuit board units of printed circuit
board strip for semiconductor package and
the printed board strip
- ----------------------------------------------------------------------------------------------------------------------------------
96-62307 The Structure of semiconductor package(The dual type of BGA package) W.S. Shin 96/12/6
- ----------------------------------------------------------------------------------------------------------------------------------
96-62308 The Structure of semiconductor package(Stacking chip on leadframe) W.S. Shin 96/12/6
- ----------------------------------------------------------------------------------------------------------------------------------
96-62309 The molding method of semiconductor package W.S. Shin 96/12/6
- ----------------------------------------------------------------------------------------------------------------------------------
96-62310 Structure of semiconductor package with good heat dissipation W.S. Shin 96/12/6
- ----------------------------------------------------------------------------------------------------------------------------------
</TABLE>
-37-
<PAGE> 59
<TABLE>
<S> <C> <C> <C> <C>
- ----------------------------------------------------------------------------------------------------------------------------------
96-62311 Cleaning method of die B.H. Moon 96/12/6
- ----------------------------------------------------------------------------------------------------------------------------------
96-62312 Manufacturing method of leadframe and CSP using the same W.S. Shin 96/12/6
- ----------------------------------------------------------------------------------------------------------------------------------
96-62313 The structure and manufacturing method of CSP W.S. Shin 96/12/6
- ----------------------------------------------------------------------------------------------------------------------------------
96-62314 The structure of leadframe and semiconductor package using the same I.S. Yoon 96/12/6
- ----------------------------------------------------------------------------------------------------------------------------------
96-62315 The structure of leadframe for semiconductor package S.M. Seo 96/12/6
- ----------------------------------------------------------------------------------------------------------------------------------
96-62316 Bond-pad structure of semiconductor chip J.H. Song 96/12/6
- ----------------------------------------------------------------------------------------------------------------------------------
96-62317 Lead-finger structure of flip-chip board S.M. Seo 96/12/6
- ----------------------------------------------------------------------------------------------------------------------------------
96-62318 The structure of flip-chip board J.H. Song 96/12/6
- ----------------------------------------------------------------------------------------------------------------------------------
96-65236 Structure and method of BGA semiconductor package with heatsink I.K. Shim 96/12/13
- ----------------------------------------------------------------------------------------------------------------------------------
96-65237 Semiconductor package S.K. Lee 96/12/13
- ----------------------------------------------------------------------------------------------------------------------------------
96-68819 Nonfunctional metal in clamping area Y.M. Kim 96/12/20
- ----------------------------------------------------------------------------------------------------------------------------------
96-68820 Structure and manufacturing method of semiconductor package J.H. Yoon 96/12/20
(Installing luminous diode in chip for malfunctional test)
- ----------------------------------------------------------------------------------------------------------------------------------
96-74111 The structure of leadframe and semiconductor package using the same J.H. Yoon 96/12/27
- ----------------------------------------------------------------------------------------------------------------------------------
96-74112 Structure and manufacturing method of CSP with pin grid array J.H. Yoon 96/12/27
- ----------------------------------------------------------------------------------------------------------------------------------
96-74113 Structure and manufacturing method of semiconductor package J.H. Yoon 96/12/27
- ----------------------------------------------------------------------------------------------------------------------------------
96-74114 Structure and manufacturing method of semiconductor package J.H. Yoon 96/12/27
- ----------------------------------------------------------------------------------------------------------------------------------
</TABLE>
-38-
<PAGE> 60
<TABLE>
<S> <C> <C> <C> <C>
- ----------------------------------------------------------------------------------------------------------------------------------
96-74115 Structure and manufacturing method of semiconductor package J.H. Yoon 96/12/27
(Attaching internally double chip on leadframe)
- ----------------------------------------------------------------------------------------------------------------------------------
96-74116 The solderball land of PCB for semiconductor package M.E. Lee 96/12/27
- ----------------------------------------------------------------------------------------------------------------------------------
96-74117 The structure of PCB for BGA semiconductor package Y.W. Heo 96/12/27
- ----------------------------------------------------------------------------------------------------------------------------------
96-74118 Attaching apparatus of solderball for integrated circuit package Y.W. Heo 96/12/27
- ----------------------------------------------------------------------------------------------------------------------------------
96-74119 The structure of semiconductor package D.B. Kang 96/12/27
- ----------------------------------------------------------------------------------------------------------------------------------
96-64037 Heatspreader for semiconductor package L.H. Kim 96/12/30
- ----------------------------------------------------------------------------------------------------------------------------------
96-77898 BGA semiconductor package built-in carrier frame I.K. Shim 96/12/30
- ----------------------------------------------------------------------------------------------------------------------------------
96-77899 BGA semiconductor package with carrier frame I.K. Shim 96/12/30
- ----------------------------------------------------------------------------------------------------------------------------------
96-77900 Flexible circuit board of die flag for BGA semiconductor package I.K. Shim 96/12/30
- ----------------------------------------------------------------------------------------------------------------------------------
96-77901 Flexible circuit board of die flag for BGA semiconductor package Y.W. Heo 96/12/30
- ----------------------------------------------------------------------------------------------------------------------------------
96-77902 Flexible circuit board of die flag for BGA semiconductor package Y.W. Heo 96/12/30
- ----------------------------------------------------------------------------------------------------------------------------------
96-77903 Molding apparatus for area array bumped semiconductor package W.S. Shin 96/12/30
- ----------------------------------------------------------------------------------------------------------------------------------
96-77904 The structure of leadframe paddle D.H. Moon 96/12/30
- ----------------------------------------------------------------------------------------------------------------------------------
96-77905 Apparatus dispensing epoxy for semiconductor package D.H. Moon 96/12/30
- ----------------------------------------------------------------------------------------------------------------------------------
96-77906 Apparatus dispensing epoxy for semiconductor package W.S. Shin 96/12/30
- ----------------------------------------------------------------------------------------------------------------------------------
96-77907 The structure of leadframe J.J. Lee 96/12/30
- ----------------------------------------------------------------------------------------------------------------------------------
96-77908 Plasma cleaner for semiconductor apparatus S.H. Ha 96/12/30
- ----------------------------------------------------------------------------------------------------------------------------------
</TABLE>
-39-
<PAGE> 61
<TABLE>
<S> <C> <C> <C> <C>
- ----------------------------------------------------------------------------------------------------------------------------------
96-77909 Plasma cleaner for semiconductor apparatus
- ----------------------------------------------------------------------------------------------------------------------------------
96-77915 Attaching method and structure for semiconductor package M.H. Park 96/12/30
- ----------------------------------------------------------------------------------------------------------------------------------
96-77916 Printed circuit board for BGA semiconductor package J.H. Ku 96/12/30
- ----------------------------------------------------------------------------------------------------------------------------------
96-77917 The structure of non conductive surface for semiconductor package J.Y. Chung 96/12/30
- ----------------------------------------------------------------------------------------------------------------------------------
96-77918 Semiconductor package J.Y. Chung 96/12/30
- ----------------------------------------------------------------------------------------------------------------------------------
96-77919 Leadframe for semiconductor package J.H. Cho 96/12/30 P199829
- ----------------------------------------------------------------------------------------------------------------------------------
96-77920 Printed circuit board for BGA semiconductor package L.H. Kim 96/12/30
- ----------------------------------------------------------------------------------------------------------------------------------
96-77921 The apparatus of die-bonding B.S. Kim 96/12/30 P0206515
- ----------------------------------------------------------------------------------------------------------------------------------
96-77922 Printed circuit board for BGA semiconductor package Y.M. Kim 96/12/30
- ----------------------------------------------------------------------------------------------------------------------------------
96-77923 Back-end auto-inspection system for BGA semiconductor package K.H. Lee 96/12/30
- ----------------------------------------------------------------------------------------------------------------------------------
96-77924 The apparatus providing PCB in back-end auto inspection system K.H. Lee 96/12/30
- ----------------------------------------------------------------------------------------------------------------------------------
96-77925 PCB guide in back-end auto inspection system K.H. Lee 96/12/30
- ----------------------------------------------------------------------------------------------------------------------------------
96-77926 Inspection apparatus in back-end auto-inspection system K.H. Lee 96/12/30
- ----------------------------------------------------------------------------------------------------------------------------------
96-77927 The apparatus transferring PCB in back-end auto-inspection system S.H. Jang 96/12/30
- ----------------------------------------------------------------------------------------------------------------------------------
96-77928 The apparatus outleting PCB in back-end auto-inspection system K.H. Lee 96/12/30
- ----------------------------------------------------------------------------------------------------------------------------------
96-77929 Turn-guide of PCB in back-end auto-inspection system K.H. Lee 96/12/30
- ----------------------------------------------------------------------------------------------------------------------------------
</TABLE>
-40-
<PAGE> 62
<TABLE>
<S> <C> <C> <C> <C>
- ----------------------------------------------------------------------------------------------------------------------------------
96-77930 Grip apparatus of PCB in back-end auto-inspection system K.H. Lee 96/12/30
- ----------------------------------------------------------------------------------------------------------------------------------
96-77931 The structure of PCB for BGA semiconductor package S.M. Kim 96/12/30
- ----------------------------------------------------------------------------------------------------------------------------------
96-77932 The enlarged scale semiconductor package J.Y. Chung 96/12/30
- ----------------------------------------------------------------------------------------------------------------------------------
96-77933 Structure and method of heatspreader coating surface L.H. Kim 96/12/30
- ----------------------------------------------------------------------------------------------------------------------------------
97-01592 Structure and method of CSP I.K. Shim 97/1/21
- ----------------------------------------------------------------------------------------------------------------------------------
97-02504 The sigulration method of BGA semiconductor package Y.W. Heo 97/1/28
- ----------------------------------------------------------------------------------------------------------------------------------
97-02259 Magazine (Making safely stacked guide ring) B.S. Park 97/2/14
- ----------------------------------------------------------------------------------------------------------------------------------
97-04432 Semiconductor package (PGA) Y.S. Sohn 97/2/14
- ----------------------------------------------------------------------------------------------------------------------------------
97-04433 Semiconductor package (Using the pin-type of metal sheet) Y.S. Sohn 97/2/14
- ----------------------------------------------------------------------------------------------------------------------------------
97-04434 The marking method of semiconductor package Y.S. Sohn 97/2/14
- ----------------------------------------------------------------------------------------------------------------------------------
97-04435 The method of forming solder-ball land and BGA semiconductor S.J. Kim 97/2/14
package including the same
- ----------------------------------------------------------------------------------------------------------------------------------
97-04436 The mounting method of semiconductor package K.C. Lee 97/2/14
- ----------------------------------------------------------------------------------------------------------------------------------
97-02323 The structure of printed circuit board Y.M. Kim 97/2/17
- ----------------------------------------------------------------------------------------------------------------------------------
97-04652 Structure and manufacturing method for flip-chip semiconductor S.J. Kim 97/2/17
package
- ----------------------------------------------------------------------------------------------------------------------------------
97-04653 BGA semiconductor package W.Y. Pyo 97/2/17
- ----------------------------------------------------------------------------------------------------------------------------------
97-04654 Metallic semiconductor package (CSP) Y.M. Kim 97/2/17
- ----------------------------------------------------------------------------------------------------------------------------------
97-04655 Structure and manufacturing method of CSP Y.M. Kim 97/2/17
- ----------------------------------------------------------------------------------------------------------------------------------
</TABLE>
-41-
<PAGE> 63
<TABLE>
<S> <C> <C> <C> <C>
- ----------------------------------------------------------------------------------------------------------------------------------
97-04657 Ball grid array semiconductor package S.S. Cha 97/2/17
- ----------------------------------------------------------------------------------------------------------------------------------
97-04870 CSP semiconductor package using flexible circuit board I.K. Shim 97/2/18
- ----------------------------------------------------------------------------------------------------------------------------------
97-04871 CSP semiconductor package using rigid-flex printed circuit board I.K. Shim 97/2/18
- ----------------------------------------------------------------------------------------------------------------------------------
97-06062 The structure of semiconductor package Y.W. Heo 97/2/26
- ----------------------------------------------------------------------------------------------------------------------------------
97-06063 Structure and manufacturing method of semiconductor package (CSP) Y.W. Heo 97/2/26
- ----------------------------------------------------------------------------------------------------------------------------------
97-16918 Input/ouput pad alignment D.H. Park 97/5/1
- ----------------------------------------------------------------------------------------------------------------------------------
97-16919 CSP semiconductor package using lead on chip I.T. Han 97/5/1
- ----------------------------------------------------------------------------------------------------------------------------------
97-16920 The structure of leadframe I.T. Han 97/5/1
- ----------------------------------------------------------------------------------------------------------------------------------
97-09726 The structure of inner-lead clamp S.H. Kim 97/5/1
- ----------------------------------------------------------------------------------------------------------------------------------
97-09727 Wire-bonding apparatus and spool holder J.H. Choi 97/5/1
- ----------------------------------------------------------------------------------------------------------------------------------
97-18551 Semiconductor package (Attaching heatsink on the top of chip) W.Y. Pyo 97/5/13
- ----------------------------------------------------------------------------------------------------------------------------------
97-18552 Semiconductor package and the method using the same (Eliminating W.M. Yang 97/5/13
die attaching process)
- ----------------------------------------------------------------------------------------------------------------------------------
97-18553 Semiconductor package (Positioning closely bending innerlead C.H. Lee 97/5/13
for heat dissipation)
- ----------------------------------------------------------------------------------------------------------------------------------
97-18554 The card structure for packaging directly chip S.G. Lee 97/5/13
- ----------------------------------------------------------------------------------------------------------------------------------
97-18555 Semiconductor package (Attaching adhesive tape on heatsink for K.J. Kim 97/5/13
preventing shorting)
- ----------------------------------------------------------------------------------------------------------------------------------
97-10616 A tray for storing semiconductor chip S.M. Seo 97/5/13
- ----------------------------------------------------------------------------------------------------------------------------------
</TABLE>
-42-
<PAGE> 64
<TABLE>
<S> <C> <C> <C> <C>
- ----------------------------------------------------------------------------------------------------------------------------------
97-10617 A tray for storing semiconductor chip S.M. Seo 97/5/13
- ----------------------------------------------------------------------------------------------------------------------------------
97-10618 A tray for storing semiconductor chip J.H. Song 97/5/13
- ----------------------------------------------------------------------------------------------------------------------------------
97-18506 CSP semiconductor package S.G. Lee 97/5/13
- ----------------------------------------------------------------------------------------------------------------------------------
97-18507 Semiconductor package (Attaching the leadframe of array type at S.G. Lee 97/5/13
the bottom of package)
- ----------------------------------------------------------------------------------------------------------------------------------
97-18508 Method and structure recognizing leadframe for wire bonding J.W. Park 97/5/13
(Making identification mark at one of the outline leads)
- ----------------------------------------------------------------------------------------------------------------------------------
97-18622 Magazine for semiconductor package Y.Y. Moon 97/5/13
- ----------------------------------------------------------------------------------------------------------------------------------
97-18623 Semiconductor package (Making test terminals in circuit test) W.S. Shin 97/5/13
- ----------------------------------------------------------------------------------------------------------------------------------
97-18624 Semiconductor package (BGA) W.S. Shin 97/5/13
- ----------------------------------------------------------------------------------------------------------------------------------
97-18625 The heater block apparatus of loading leadframe for S.W. Han 97/5/13
semiconductor package
- ----------------------------------------------------------------------------------------------------------------------------------
97-18626 Semiconductor package (Attaching heatsink patterned by S.K. Lee 97/5/13
protrusion shape)
- ----------------------------------------------------------------------------------------------------------------------------------
97-18627 Semiconductor package and molding device W.S. Shin 97/5/13
- ----------------------------------------------------------------------------------------------------------------------------------
97-18628 Printed circuit board for semiconductor package Y.M. Kim 97/5/13
- ----------------------------------------------------------------------------------------------------------------------------------
97-18629 Semiconductor package (Attaching coupling agent for preventing W.S. Shin 97/5/13
crack & popcorn from PCB)
- ----------------------------------------------------------------------------------------------------------------------------------
97-10650 Leadframe for semiconductor package D.Y. Kim 97/5/13
- ----------------------------------------------------------------------------------------------------------------------------------
97-14577 The cleaning apparatus of marking pad Y.K. Kwak 97/6/17
- ----------------------------------------------------------------------------------------------------------------------------------
97-14578 Inspection apparatus and turning structure for manufacturing Y.K. Kwak 97/6/17
semiconductor package
- ----------------------------------------------------------------------------------------------------------------------------------
</TABLE>
-43-
<PAGE> 65
<TABLE>
<S> <C> <C> <C> <C>
- ----------------------------------------------------------------------------------------------------------------------------------
97-14579 Pushing road apparatus for manufacturing semiconductor package C.H. Ko 97/6/17
- ----------------------------------------------------------------------------------------------------------------------------------
97-14580 Marking apparatus for manufacturing semiconductor package K.N. Kim 97/6/17
- ----------------------------------------------------------------------------------------------------------------------------------
97-14581 The bottom structure of die for manufacturing semiconductor K.N. Kim 97/6/17
package
- ----------------------------------------------------------------------------------------------------------------------------------
97-25115 Marking apparatus for manufacturing semiconductor package H.K. Yang 97/6/17
- ----------------------------------------------------------------------------------------------------------------------------------
97-25116 Rotary table apparatus of marking machine for manufacturing K.N. Kim 97/6/17
semiconductor package
- ----------------------------------------------------------------------------------------------------------------------------------
97-25117 Input/ouput magazine apparatus for manufacturing semiconductor H.K. Yang 97/6/17
package
- ----------------------------------------------------------------------------------------------------------------------------------
97-25118 Transferring apparatus of marking device for manufacturing K.H. Kim 97/6/17
semiconductor package
- ----------------------------------------------------------------------------------------------------------------------------------
97-25119 Turning apparatus of marking device for manufacturing Y.C. Cho 97/6/17
semiconductor package
- ----------------------------------------------------------------------------------------------------------------------------------
97-17040 Thermalsetting oven apparatus for semiconductor package B.H. Moon 97/6/30
- ----------------------------------------------------------------------------------------------------------------------------------
97-17041 Trim/form apparatus for manufacturing semiconductor package J.Y. Ha 97/6/30
- ----------------------------------------------------------------------------------------------------------------------------------
97-17042 Tube apparatus for manufacturing semiconductor package J.Y. Ha 97/6/30
- ----------------------------------------------------------------------------------------------------------------------------------
97-29850 Bond-pad structure for semiconductor chip J.Y. Chung 97/6/30
- ----------------------------------------------------------------------------------------------------------------------------------
97-29851 The controlling device of marking apparatus H.W. Kim 97/6/30
- ----------------------------------------------------------------------------------------------------------------------------------
97-31735 A microscope for inspecting wafer J.H. Choi 97/7/9
- ----------------------------------------------------------------------------------------------------------------------------------
97-31960 A cleaning device of semiconductor package B.S. Bea 97/7/10
- ----------------------------------------------------------------------------------------------------------------------------------
</TABLE>
-44-
<PAGE> 66
<TABLE>
<S> <C> <C> <C> <C>
- ----------------------------------------------------------------------------------------------------------------------------------
97-32795 Pattern recognition system and recognition method of ground W.M. Yang 97/7/15
bonding location thereof
- ----------------------------------------------------------------------------------------------------------------------------------
97-32796 Inner lead clamp construction of wire bonding system for S.J. Kim 97/7/15
manufacturing semiconductor package and wire bonding method thereof
- ----------------------------------------------------------------------------------------------------------------------------------
97-26952 Solder ball box of ball bumping system B.S. Bae 97/6/24
- ----------------------------------------------------------------------------------------------------------------------------------
97-30513 The electrode tip mount of the wire-bonding system for J.H. Choi 97/7/1
semiconductor packages
- ----------------------------------------------------------------------------------------------------------------------------------
97-31199 The marking head in ink-marking system for semiconductor packages K.C. Park 97/7/5
- ----------------------------------------------------------------------------------------------------------------------------------
97-18255 The heater block of wire-bonder for semiconductor package S.H. Kim 97/7/10
- ----------------------------------------------------------------------------------------------------------------------------------
97-18256 The setting-gauge for capillary in wire bonder S.H. Kim 97/7/10
- ----------------------------------------------------------------------------------------------------------------------------------
97-18257 The wire spool holder of the wire-bonder S.H. Kim 97/7/10
- ----------------------------------------------------------------------------------------------------------------------------------
97-18258 The wire-supply device of the wire-bonder S.H. Kim 97/7/10
- ----------------------------------------------------------------------------------------------------------------------------------
97-32093 Removing method and apparatus for the heat from heater block S.H. Kim 97/7/10
in the wire bonder
- ----------------------------------------------------------------------------------------------------------------------------------
97-34517 The solder ball bumping system for BGA semiconductor packages K.H. Lee 97/7/23
- ----------------------------------------------------------------------------------------------------------------------------------
97-34518 The input apparatus of the solder ball bumping system for BGA K.H. Lee 97/7/23
semiconductor packages
- ----------------------------------------------------------------------------------------------------------------------------------
97-34519 The pusher of the solder ball bumping system for BGA K.H. Lee 97/7/23
semiconductor packages
- ----------------------------------------------------------------------------------------------------------------------------------
97-34520 The flow apparatus of the solder ball bumping system for BGA K.H. Lee 97/7/23
semiconductor packages
- ----------------------------------------------------------------------------------------------------------------------------------
</TABLE>
-45-
<PAGE> 67
<TABLE>
<S> <C> <C> <C> <C>
- ----------------------------------------------------------------------------------------------------------------------------------
97-34521 The table of ther solder ball bumping system for BGA K.H. Lee 97/7/23
semiconductor packages
- ----------------------------------------------------------------------------------------------------------------------------------
97-34522 The material setting apparatus of the solder ball bumping K.H. Lee 97/7/23
system for BGA semiconductor packages
- ----------------------------------------------------------------------------------------------------------------------------------
97-34523 The printer of the solder ball bumping system for BGA K.H. Lee 97/7/23
semiconductor packages
- ----------------------------------------------------------------------------------------------------------------------------------
97-34524 The solder ball supply apparatus of the solder ball bumping K.H. Lee 97/7/23
system for BGA semiconductor packages
- ----------------------------------------------------------------------------------------------------------------------------------
97-34525 The sensing apparatus of double ball in the solder ball bumping K.H. Lee 97/7/23
system for BGA semiconductor packages
- ----------------------------------------------------------------------------------------------------------------------------------
97-34526 The solder ball tool of the solder ball bumping system for K.H. Lee 97/7/23
BGA semiconductor packages
- ----------------------------------------------------------------------------------------------------------------------------------
97-34527 The PCB-exhauster for solder ball bumping system of BGA K.H. Lee 97/7/23
semiconductor packages
- ----------------------------------------------------------------------------------------------------------------------------------
97-19772 Magazine of semiconductor packages J.Y. Chung 97/7/25
- ----------------------------------------------------------------------------------------------------------------------------------
97-18629 Dotted epoxy inspection system of die bonder for manufacturing J.J. Chun 97/7/15
semiconductor package
- ----------------------------------------------------------------------------------------------------------------------------------
97-18630 Wire spool construction system for manufacturing semiconductor S.H. Kim 97/7/15
package
- ----------------------------------------------------------------------------------------------------------------------------------
97-36487 Pattern recognition system for leadframe and its control method H.K. Joh 97/7/31
- ----------------------------------------------------------------------------------------------------------------------------------
97-39483 The inspection system for BGA semiconductor packages C.B. Lee 97/8/20
- ----------------------------------------------------------------------------------------------------------------------------------
97-39484 The supply device of inspection system for BGA semiconductor S.H. Jang 97/8/20
packages
- ----------------------------------------------------------------------------------------------------------------------------------
</TABLE>
-46-
<PAGE> 68
<TABLE>
<S> <C> <C> <C> <C>
- ----------------------------------------------------------------------------------------------------------------------------------
97-39485 The griper of inspection system for BGA semiconductor packages H.D. Lee 97/8/20
- ----------------------------------------------------------------------------------------------------------------------------------
97-39486 The material feed device of inspection system for BGA S.K. Kim 97/8/20
semiconductor packages
- ----------------------------------------------------------------------------------------------------------------------------------
97-39487 The flow device of inspection system for BGA semiconductor H.H. Park 97/8/20
packages
- ----------------------------------------------------------------------------------------------------------------------------------
97-39488 The flow device of inspection system for BGA semiconductor H.H. Park 97/8/20
packages
- ----------------------------------------------------------------------------------------------------------------------------------
97-39489 The select device of inspection system for BGA semiconductor H. Cho 97/8/20
packages
- ----------------------------------------------------------------------------------------------------------------------------------
97-39490 The material feed tray for BGA semiconductor packages M.E. Lee 97/8/20
- ----------------------------------------------------------------------------------------------------------------------------------
97-22674 Operation system of microscope to wafer inspection J.H. Choi 97/8/21
- ----------------------------------------------------------------------------------------------------------------------------------
97-10103 Method of decreasing bending for integrated circuit package (BGA) Y.W. Heo 97/3/24 P122847
- ----------------------------------------------------------------------------------------------------------------------------------
97-21289 The guide-device of leadframe in trim-form-system for K.C. Park 97/8/1
semiconductor packages
- ----------------------------------------------------------------------------------------------------------------------------------
97-25666 The property remove tray of BGA semiconductor package
- ----------------------------------------------------------------------------------------------------------------------------------
97-25668 The property remove tray of BGA semiconductor package W.J. Kang 97/8/1
- ----------------------------------------------------------------------------------------------------------------------------------
97-46504 The mold for semiconductor package J.C. Hong 97/9/10
- ----------------------------------------------------------------------------------------------------------------------------------
97-46505 The heater block of wire-bonding device for semiconductor packages J.Y. Ha 97/9/10
- ----------------------------------------------------------------------------------------------------------------------------------
97-26383 The epoxy application tool of wafer mounting system off S.H. Kim 97/9/23
semiconductor packages
- ----------------------------------------------------------------------------------------------------------------------------------
</TABLE>
-47-
<PAGE> 69
<TABLE>
<S> <C> <C> <C> <C>
- ----------------------------------------------------------------------------------------------------------------------------------
97-26384 The epoxy application tool of wafer mounting system off Y.H. Park 97/9/23
semiconductor packages
- ----------------------------------------------------------------------------------------------------------------------------------
97-26385 The wafer table establishment structure of wafer mounting K.B. Choi 97/9/23
system off semiconductor package
- ----------------------------------------------------------------------------------------------------------------------------------
97-49085 Cutting device for tie-bar of leadframe S.J. Oh 97/9/26
- ----------------------------------------------------------------------------------------------------------------------------------
97-26791 Structure of a heat slug for semiconductor package L.H. Kim 97/9/26
- ----------------------------------------------------------------------------------------------------------------------------------
97-49241 Structure of a capillary J.Y. Chung 97/9/26
- ----------------------------------------------------------------------------------------------------------------------------------
97-28504 The package cleaning device of ink marking system for BGA O.K. Choi 97/10/14
semiconductor packages
- ----------------------------------------------------------------------------------------------------------------------------------
97-52603 Chip ejection method and device for semiconductor packages D.S. Kim 97/10/23
- ----------------------------------------------------------------------------------------------------------------------------------
97-52604 The Top cavity insert structure of mold for semiconductor packages Y.Y. Moon 97/10/23
- ----------------------------------------------------------------------------------------------------------------------------------
97-52605 The mold of semiconductor packages G.J. Kim 97/10/23
- ----------------------------------------------------------------------------------------------------------------------------------
97-52606 Marking method and device of marking system for semiconductor Y.K. Kim 97/10/23
packages
- ----------------------------------------------------------------------------------------------------------------------------------
97-52607 Uniformly inking device of marking head in marking system for Y.K. Kim 97/10/23
semiconductor packages
- ----------------------------------------------------------------------------------------------------------------------------------
97-52608 The top cavity insert of mold for semiconductor packages I.S. Kim 97/10/23
- ----------------------------------------------------------------------------------------------------------------------------------
97-52609 A Container of wiping fluid for semiconductor packages Y.J. Han 97/10/23
- ----------------------------------------------------------------------------------------------------------------------------------
97-52714 Semiconductor packages J.Y. Chung 97/10/23
- ----------------------------------------------------------------------------------------------------------------------------------
97-54505 Tray for storing ball grid array semiconductor package S. M. Kim 97/10/23
- ----------------------------------------------------------------------------------------------------------------------------------
</TABLE>
-48-
<PAGE> 70
<TABLE>
<S> <C> <C> <C> <C>
- ----------------------------------------------------------------------------------------------------------------------------------
97-54506 Tube for storing ball grid array semiconductor package S. M. Kim 97/10/23
- ----------------------------------------------------------------------------------------------------------------------------------
97-54508 Ball grid array semiconductor package using a silicon substrate W.J. Kang 97/10/23
- ----------------------------------------------------------------------------------------------------------------------------------
97-54510 Semiconductor package for a flip chip and its manufacturing method S.J. Kim 97/10/23
- ----------------------------------------------------------------------------------------------------------------------------------
97-54511 Printed circuit board of matrix type S.J. Kim 97/10/23
- -----------------------------------------------------------------------------------------------------------------------------------
97-54512 Flattening method of glob top material surface encapsulated for S.W. Shin 97/10/23
apparatus
- -----------------------------------------------------------------------------------------------------------------------------------
97-54513 Metal mold for manufacturing semiconductor package H.J. Lee 97/10/23
- -----------------------------------------------------------------------------------------------------------------------------------
97-54514 Lead frame of semiconductor package S.G. Lee 97/10/23
- -----------------------------------------------------------------------------------------------------------------------------------
97-54515 Marking method of a semiconductor package using a laser beam S.J. Kim 97/10/23
and its apparatus
- -----------------------------------------------------------------------------------------------------------------------------------
97-29924 Construction of bond roller for wafer mounter W.H. Kong 97/10/28
- -----------------------------------------------------------------------------------------------------------------------------------
97-29925 Anti-reverse rotation structure of tape roller for wafer mounter C.B. Lee 97/10/28
- -----------------------------------------------------------------------------------------------------------------------------------
97-55636 Wafer mounter having function for attaching barcode label of W.H. Kim 97/10/28
wafer identification number
- -----------------------------------------------------------------------------------------------------------------------------------
97-55637 Wafer mounter for semiconductor equipment W.H. Kong 97/10/28
- -----------------------------------------------------------------------------------------------------------------------------------
97-56567 Solder ball array device for ball grid array package I.S. Kim 97/10/30
- -----------------------------------------------------------------------------------------------------------------------------------
97-58067 The epoxy tool of die attach device for semiconductor packages Y.H. Kim 97/11/4
- -----------------------------------------------------------------------------------------------------------------------------------
97-58068 The PCB of BGA semiconductor packages D.Y. So 97/11/4
- -----------------------------------------------------------------------------------------------------------------------------------
97-58069 The Marking test device of semiconductor packages N.J. Myoung 97/11/4
- -----------------------------------------------------------------------------------------------------------------------------------
</TABLE>
-49-
<PAGE> 71
<TABLE>
<S> <C> <C> <C> <C>
- ----------------------------------------------------------------------------------------------------------------------------------
97-58070 The Marking test device of PCB for BGA semiconductor packages J.H. Choi 97/11/4
- ----------------------------------------------------------------------------------------------------------------------------------
97-63195 Magazine clamp for semiconductor packages Y.Y. Moon 97/11/26
- ----------------------------------------------------------------------------------------------------------------------------------
97-63196 Wire bonding sensing method and sensing means of wire bonding J.H. Choi 97/11/26
device for semiconductor packages
- ----------------------------------------------------------------------------------------------------------------------------------
97-64123 Printed circuit board of wafer taped chip scale package and S.J. Kim 97/11/28
method of routing it
- ----------------------------------------------------------------------------------------------------------------------------------
97-64124 Dispensing method of glob top for semiconductor package W.J. Kang 97/11/28
- ----------------------------------------------------------------------------------------------------------------------------------
97-64125 Ball grid array semiconductor package S.J. Kim 97/11/28
- ----------------------------------------------------------------------------------------------------------------------------------
97-64126 The mold of chip array ball grid array package and mold S.J. Kim 97/11/28
structure using the same
- ----------------------------------------------------------------------------------------------------------------------------------
97-64127 Printed circuit board of matrix type and molding method of the same S.J. Kim 97/11/28
- ----------------------------------------------------------------------------------------------------------------------------------
97-64128 Mold structure of through gate the for manufacturing S.M. Kim 97/11/28
semiconductor package and semiconductor package manufacturing
method using the same
- ----------------------------------------------------------------------------------------------------------------------------------
97-65410 Frame for cleaning mold for manufacturing semiconductor package H.J. Kim 97/12/2
- ----------------------------------------------------------------------------------------------------------------------------------
97-72033 Solder ball bumping system for manufacturing semiconductor package Y.C.Cho 97/12/22
- ----------------------------------------------------------------------------------------------------------------------------------
97-72034 Flux dotting device for manufacturing semiconductor package Y.K. Kwak 97/12/22
- ----------------------------------------------------------------------------------------------------------------------------------
97-72035 Solder ball bumping method of semiconductor package and its Y.C.Cho 97/12/22
apparatus
- ----------------------------------------------------------------------------------------------------------------------------------
</TABLE>
-50-
<PAGE> 72
<TABLE>
<S> <C> <C> <C> <C>
- ----------------------------------------------------------------------------------------------------------------------------------
97-72036 Solder ball mounting method of semiconductor package its apparatus K.N. Kim 97/12/22
- ----------------------------------------------------------------------------------------------------------------------------------
97-43953 Lead frame structure for semiconductor package S.H. Na 97/12/30
- ----------------------------------------------------------------------------------------------------------------------------------
97-43954 Tape automated bonding tool for a semiconductor chip S.G. Ko 97/12/30
- ----------------------------------------------------------------------------------------------------------------------------------
97-43955 Transducer holder for wire bonding of a semiconductor chip S.G. Ko 97/12/30
- ----------------------------------------------------------------------------------------------------------------------------------
97-43956 Magazine structure for safe keeping lead frame S.M. Hong 97/12/30
- ----------------------------------------------------------------------------------------------------------------------------------
97-43957 Blade construction of deflash apparatus for manufacturing K.C. Park 97/12/24
semiconductor package
- ----------------------------------------------------------------------------------------------------------------------------------
97-43958 Structure of trim/form device for manufacturing semiconductor K.C. Park 97/12/30
package
- ----------------------------------------------------------------------------------------------------------------------------------
97-43959 Mold for manufacturing semiconductor package using a flexible S.H. Ha 97/12/30
circuit board
- ----------------------------------------------------------------------------------------------------------------------------------
97-43960 Tube changing device for inserting semiconductor package H.W. Kim 97/12/30
- ----------------------------------------------------------------------------------------------------------------------------------
97-43961 Structure of singulation die for manufacturing semiconductor H.W. Kim 97/12/30
package
- ----------------------------------------------------------------------------------------------------------------------------------
97-43962 Capillary for bonding wire of a semiconductor chip S.G. Ko 97/12/30
- ----------------------------------------------------------------------------------------------------------------------------------
97-43963 Mark of tray for semiconductor package H.W. Cho 97/12/29
- ----------------------------------------------------------------------------------------------------------------------------------
97-43964 Manufacturing device for semiconductor package H.Y. Lee 97/12/30
- ----------------------------------------------------------------------------------------------------------------------------------
97-43965 Manufacturing device for semiconductor package H.Y. Lee 97/12/29
- ----------------------------------------------------------------------------------------------------------------------------------
97-43966 Lead frame of semiconductor package J.H. Cho 97/12/30
- ----------------------------------------------------------------------------------------------------------------------------------
97-43967 Paddle structure of lead frame for semiconductor package S.S. Jang 97/12/30
- ----------------------------------------------------------------------------------------------------------------------------------
</TABLE>
-51-
<PAGE> 73
<TABLE>
<S> <C> <C> <C> <C>
- ----------------------------------------------------------------------------------------------------------------------------------
97-43968 Paddle structure of lead frame for semiconductor package S.S. Jang 97/12/30
- ----------------------------------------------------------------------------------------------------------------------------------
97-43969 Press system for cutting paddle of lead frame D.J. Kim 97/12/30
- ----------------------------------------------------------------------------------------------------------------------------------
97-79219 Semiconductor package manufacturing method K.C. Park 97/12/30
- ----------------------------------------------------------------------------------------------------------------------------------
97-79220 Deflash method for manufacturing semiconductor package and its K.C. Park 97/12/30
apparatus
- ----------------------------------------------------------------------------------------------------------------------------------
97-79221 Inspecting equipment for wire bonding of a semiconductor chip M.S. Shin 97/12/30
and method thereof
- ----------------------------------------------------------------------------------------------------------------------------------
97-79222 Structure of chip array ball grid array semiconductor package J.Y. Yang 97/12/30
- ----------------------------------------------------------------------------------------------------------------------------------
97-79223 Automatic ball size filtering device of solder ball bumping H.Y. Lee 97/12/30
system for manufacturing semiconductor package and its method
- ----------------------------------------------------------------------------------------------------------------------------------
97-79224 Manufacturing method of semiconductor package T.B. Jung 97/12/30
- ----------------------------------------------------------------------------------------------------------------------------------
97-79225 Ball grid array semiconductor package using a flexible circuit S.H. Ha 97/12/30
board
- ----------------------------------------------------------------------------------------------------------------------------------
97-79226 Adhesive layer structure for manufacturing semiconductor package S.H. Ha 97/12/30
- ----------------------------------------------------------------------------------------------------------------------------------
97-79227 Attaching method of flexible circuit board on carrier frame for S.H. Ha 97/12/30
ball grid array semiconductor units
- ----------------------------------------------------------------------------------------------------------------------------------
97-79228 Ball grid array semiconductor package using a flexible circuit S.H. Ha 97/12/30
board
- ----------------------------------------------------------------------------------------------------------------------------------
97-79229 Solder ball land of ball grid array semiconductor package using S.H. Ha 97/12/30
a flexible circuit board
- ----------------------------------------------------------------------------------------------------------------------------------
97-79230 Singulation method of ball grid array semiconductor package S.H. Ha 97/12/30
using a flexible circuit board strip and its apparatus
- ----------------------------------------------------------------------------------------------------------------------------------
</TABLE>
-52-
<PAGE> 74
<TABLE>
<S> <C> <C> <C> <C>
- ----------------------------------------------------------------------------------------------------------------------------------
97-79231 Wire bonding apparatus for manufacturing semiconductor packages C.H. Woo 97/12/30
- ----------------------------------------------------------------------------------------------------------------------------------
97-79232 Ball grid array semiconductor package using a flexible circuit S.H. Ha 97/12/30
board and its manufacturing method
- ----------------------------------------------------------------------------------------------------------------------------------
97-79233 Picker block of ball bumping system for manufacturing H.Y. Lee 97/12/30
semiconductor package
- ----------------------------------------------------------------------------------------------------------------------------------
97-79234 Structure of chip size semiconductor package and its sif, Chowdhury 97/12/30
manufacturing method
- ----------------------------------------------------------------------------------------------------------------------------------
97-79235 Attaching structure for tube and plug for semiconductor units J.Y. Ha 97/12/30
- ----------------------------------------------------------------------------------------------------------------------------------
97-79236 Marking apparatus for manufacturing a semiconductor package H.Y. Lee 97/12/30
- ----------------------------------------------------------------------------------------------------------------------------------
97-79237 Flux dotting device of ball bumping system for manufacturing H.Y. Lee 97/12/30
semiconductor package
- ----------------------------------------------------------------------------------------------------------------------------------
97-79567 Tube -holder for semiconductor packages J.Y. Ha 97/12/30
- ----------------------------------------------------------------------------------------------------------------------------------
97-79572 Manufacturing device of semiconductor packages G.H. Lee 97/12/30
- ----------------------------------------------------------------------------------------------------------------------------------
97-79573 Manufacturing device of semiconductor packages G.H. Lee 97/12/30
- ----------------------------------------------------------------------------------------------------------------------------------
97-79574 Manufacturing device of semiconductor packages G.H. Lee 97/12/30
- ----------------------------------------------------------------------------------------------------------------------------------
97-50557 Plating method for out leads of a semiconductor package J.W. Lee 97/9/30
- ----------------------------------------------------------------------------------------------------------------------------------
98-03920 Lead frame of semiconductor package M. Yoo 98/3/17
- ----------------------------------------------------------------------------------------------------------------------------------
98-03926 Electro flame off tip of wire bonding system for manufacturing J.Y. Chung 98/3/17
semiconductor package
- ----------------------------------------------------------------------------------------------------------------------------------
98-09104 Printed circuit board for ball grid array semiconductor package
and its manufacturing method
- ----------------------------------------------------------------------------------------------------------------------------------
</TABLE>
-53-
<PAGE> 75
<TABLE>
<S> <C> <C> <C> <C>
- ----------------------------------------------------------------------------------------------------------------------------------
98-09105 Blade structure for sawing semiconductor wafer and sawing method W.S. Lim 98/3/17
using the same
- ----------------------------------------------------------------------------------------------------------------------------------
98-12364 Semiconductor package S.G. Lee 98/4/8
- ----------------------------------------------------------------------------------------------------------------------------------
98-06790 Tray loading device of semiconductor package manufacturing J.I. Oh 98/4/28
apparatus
- ----------------------------------------------------------------------------------------------------------------------------------
98-06791 Ejection device of pick and place system for semiconductor N.H. Kwak 98/4/28
equipment
- ----------------------------------------------------------------------------------------------------------------------------------
98-06792 Cassette loading device of mounter system for semiconductor W.H. Kong 98/4/28
equipment
- ----------------------------------------------------------------------------------------------------------------------------------
98-06793 Feeding device of material for semiconductor package manufacturing N.H. Kwak 98/4/28
apparatus
- ----------------------------------------------------------------------------------------------------------------------------------
98-06794 Magazine fixing device of semiconductor package manufacturing W.H. Kong 98/4/28
apparatus
- ----------------------------------------------------------------------------------------------------------------------------------
98-06795 Gripper device for semiconductor package manufacturing apparatus C.B. Lee 98/4/28
- ----------------------------------------------------------------------------------------------------------------------------------
98-06796 Pusher device of semiconductor package manufacturing device W.H. Kong 98/4/28
- ----------------------------------------------------------------------------------------------------------------------------------
98-06797 Dispenser structure of encapsulation apparatus for manufacturing S.B. Na 98/4/28
semiconductor
- ----------------------------------------------------------------------------------------------------------------------------------
98-15158 Control method of encapsulation apparatus for manufacturing G.H. Lee 98/4/28
semiconductor
- ----------------------------------------------------------------------------------------------------------------------------------
98-15159 Mounter device for semiconductor equipment C.B. Lee 98/4/28
- ----------------------------------------------------------------------------------------------------------------------------------
98-19303 Molding method of printed circuit board for semiconductor package S. J. Kim 98/5/27
- ----------------------------------------------------------------------------------------------------------------------------------
</TABLE>
-54-
<PAGE> 76
<TABLE>
<S> <C> <C> <C> <C>
- ----------------------------------------------------------------------------------------------------------------------------------
98-19304 Printed Circuit Board S. J. Kim 98/5/27
- ----------------------------------------------------------------------------------------------------------------------------------
98-09915 Structure of semiconductor package S.G. Lee 98/6/11
- ----------------------------------------------------------------------------------------------------------------------------------
98-09916 Structure of BGA-semiconductor package S.J. Kim 98/6/11
- ----------------------------------------------------------------------------------------------------------------------------------
98-21719 Winding method for end-wire of wire-spool S.H. Kim 98/6/11
- ----------------------------------------------------------------------------------------------------------------------------------
98-21720 Semiconductor package S.J. Son 98/6/11
- ----------------------------------------------------------------------------------------------------------------------------------
98-21721 Structure of semiconductor package J.Y. Chung 98/6/11
- ----------------------------------------------------------------------------------------------------------------------------------
98-23666 BGA-semiconductor packages and its manufacturing method S.S. Cha 98/6/23
- ----------------------------------------------------------------------------------------------------------------------------------
98-12069 Singulation device for manufacturing semiconductor J.Y. Chung 98/7/2
- ----------------------------------------------------------------------------------------------------------------------------------
98-12070 A guide rail structure for semiconductor Y.Y. Cho 98/7/2
- ----------------------------------------------------------------------------------------------------------------------------------
98-12071 Magazine carrier J.Y. Ha 98/7/2
- ----------------------------------------------------------------------------------------------------------------------------------
98-12072 Lead frame of semiconductor package J.H. Jeong 98/7/2
- ----------------------------------------------------------------------------------------------------------------------------------
98-27292 Epoxy resin composition for die attachment J.S. Kwak 98/7/7
- ----------------------------------------------------------------------------------------------------------------------------------
98-35551 Lead frame structure for semiconductor packages Y.Y. Mun 98/8/31
- ----------------------------------------------------------------------------------------------------------------------------------
98-35552 Mold structure for semiconductor packages Y.Y. Mun 98/8/31
- ----------------------------------------------------------------------------------------------------------------------------------
98-35553 Air vent structure of mold for semiconductor packages Y.Y. Mun 98/8/31
- ----------------------------------------------------------------------------------------------------------------------------------
98-35554 Mold structure for semiconductor packages Y.Y. Mun 98/8/31
- ----------------------------------------------------------------------------------------------------------------------------------
98-35555 Manufacturing method and mold structure for F-BGA semiconductor Y.Y. Mun 98/8/31
packages
- ----------------------------------------------------------------------------------------------------------------------------------
</TABLE>
-55-
<PAGE> 77
<TABLE>
<S> <C> <C> <C> <C>
- ----------------------------------------------------------------------------------------------------------------------------------
98-35604 Wire bonding method for manufacturing semiconductor package J.H. Yoon 98/8/31
- ----------------------------------------------------------------------------------------------------------------------------------
98-35605 Circuit tape for semiconductor package J.H. Yoon 98/8/31
- ----------------------------------------------------------------------------------------------------------------------------------
98-35606 Circuit tape for semiconductor package J.H. Yoon 98/8/31
- ----------------------------------------------------------------------------------------------------------------------------------
98-35607 Circuit tape for semiconductor package J.H. Yoon 98/8/31
- ----------------------------------------------------------------------------------------------------------------------------------
98-35608 Lamination device of wafer and circuit tape for manufacturing W.H. Kong 98/8/31
semiconductor package and its method
- ----------------------------------------------------------------------------------------------------------------------------------
98-35609 Attaching device of circuit film and elastomer tape for W.H. Kong 98/8/31
manufacturing semiconductor package
- ----------------------------------------------------------------------------------------------------------------------------------
98-35610 Heating and pressure capacity of wafer and circuit tape for N.H. Kwak 98/8/31
manufacturing semiconductor package
- ----------------------------------------------------------------------------------------------------------------------------------
98-35611 Cutting device of circuit tape attached to wafer for C.B. Lee 98/8/31
manufacturing semiconductor package
- ----------------------------------------------------------------------------------------------------------------------------------
98-35612 Solder ball land structure of film for semiconductor package J.H. Yoon 98/8/31
- ----------------------------------------------------------------------------------------------------------------------------------
98-35613 Circuit tape applied to manufacture of a semiconductor package J.H. Yoon 98/8/31
- ----------------------------------------------------------------------------------------------------------------------------------
98-35614 Manufacturing method of semiconductor package using a circuit tape J.H. Yoon 98/8/31
- ----------------------------------------------------------------------------------------------------------------------------------
98-35615 Circuit tape for semiconductor package J.H. Yoon 98/8/31
- ----------------------------------------------------------------------------------------------------------------------------------
98-35616 Circuit tape for semiconductor package J.H. Yoon 98/8/31
- ----------------------------------------------------------------------------------------------------------------------------------
98-35617 Bonding method of wafer and circuit tape for manufacturing W.H. Kong 98/8/31
semiconductor package
- ----------------------------------------------------------------------------------------------------------------------------------
98-35618 Circuit tape and wafer bonding apparatus for manufacturing W.H. Kong 98/8/31
semiconductor package
- ----------------------------------------------------------------------------------------------------------------------------------
</TABLE>
-56-
<PAGE> 78
<TABLE>
<S> <C> <C> <C> <C>
- ----------------------------------------------------------------------------------------------------------------------------------
98-35619 Encapsulation cure method of semiconductor package J.H. Yoon 98/8/31
- ----------------------------------------------------------------------------------------------------------------------------------
98-35620 Marking method for manufacturing semiconductor package J.H. Yoon 98/8/31
- ----------------------------------------------------------------------------------------------------------------------------------
98-35621 Solder ball bumping method for manufacturing semiconductor package J.H. Yoon 98/8/31
- ----------------------------------------------------------------------------------------------------------------------------------
98-35622 Bonding method of wafer and circuit tape for manufacturing J.H. Yoon 98/8/31
semiconductor package
- ----------------------------------------------------------------------------------------------------------------------------------
98-35623 Marking method of semiconductor package J.H. Yoon 98/8/31
- ----------------------------------------------------------------------------------------------------------------------------------
98-35624 Manufacturing method of semiconductor package J.H. Yoon 98/8/31
- ----------------------------------------------------------------------------------------------------------------------------------
98-35625 Manufacturing method of semiconductor package J.H. Yoon 98/8/31
- ----------------------------------------------------------------------------------------------------------------------------------
98-36897 Printed circuit board for semiconductor package for preventing S.J. Kim 98/9/8
static electricity
- ----------------------------------------------------------------------------------------------------------------------------------
98-36898 Printed circuit board for semiconductor package for preventing S.J. Kim 98/9/8
static electricity
- ----------------------------------------------------------------------------------------------------------------------------------
98-37201 Semiconductor device S.G. Lee 98/9/9
- ----------------------------------------------------------------------------------------------------------------------------------
98-37202 Semiconductor device S.G. Lee 98/9/9
- ----------------------------------------------------------------------------------------------------------------------------------
98-37203 Molding device of ball grid array semiconductor using a carrier
frame
- ----------------------------------------------------------------------------------------------------------------------------------
98-17327 Method for controlling height of bonding block of did bonder S.J. Kim 98/9/11
- ----------------------------------------------------------------------------------------------------------------------------------
98-17328 Structure dispenser of resin injection apparatus G.H. Lee 98/9/11
- ----------------------------------------------------------------------------------------------------------------------------------
98-17505 Marking device for the lead frame of semiconductor packages B.S. Chung 98/9/15
- ----------------------------------------------------------------------------------------------------------------------------------
98-17506 Inspection jig for the strip of semiconductor packages S.J. Kim 98/9/15
- ----------------------------------------------------------------------------------------------------------------------------------
</TABLE>
-57-
<PAGE> 79
<TABLE>
<S> <C> <C> <C> <C>
- ----------------------------------------------------------------------------------------------------------------------------------
98-19770 Carrier frame structure for semiconductor packages
- ----------------------------------------------------------------------------------------------------------------------------------
98-19771 Carrier frame structure for semiconductor packages
- ----------------------------------------------------------------------------------------------------------------------------------
98-37969 Lead frame structure of semiconductor packages Y.H. Choi 98/9/15
- ----------------------------------------------------------------------------------------------------------------------------------
98-38052 A method for ascer taining wire bonding state of semiconductor C.S. Seo 98/9/15
package
- ----------------------------------------------------------------------------------------------------------------------------------
98-38258 A method for preventing short of bonding wire between bonding C.H. Woo 98/9/16
pad and lead finger
- ----------------------------------------------------------------------------------------------------------------------------------
98-38475 Singulation method of ball grid array semiconductor package K.W. Lee 98/9/17
using flexible circuit board strip
- ----------------------------------------------------------------------------------------------------------------------------------
98-18090 Semiconductor package S.H Ruy 98/9/22
- ----------------------------------------------------------------------------------------------------------------------------------
98-39241 Mold structure and method for marking COO mark of semiconductor E.H. Pyo 98/9/22
package using the mold structure
- ----------------------------------------------------------------------------------------------------------------------------------
98-40125 Micro ball grid array semiconductor package J.H. Lee 98/9/26
- ----------------------------------------------------------------------------------------------------------------------------------
98-46563 Manufacturing method of circuit board sheet for semiconductor Y.G. Park 98/10/31
package
- ----------------------------------------------------------------------------------------------------------------------------------
98-46564 Semiconductor device I.K. Shim 98/10/31
- ----------------------------------------------------------------------------------------------------------------------------------
98-46565 Semiconductor device I.K. Shim 98/10/31
- ----------------------------------------------------------------------------------------------------------------------------------
98-46566 Molding method of semiconductor device I.K. Shim 98/10/31
- ----------------------------------------------------------------------------------------------------------------------------------
98-46567 Manufacturing method of semiconductor package B.J. Han 98/10/31
- ----------------------------------------------------------------------------------------------------------------------------------
98-46568 Semiconductor Package Y.G. Park 98/10/31
- ----------------------------------------------------------------------------------------------------------------------------------
98-46569 Manufacturing method of semiconductor package B.J. Han 98/10/31
- ----------------------------------------------------------------------------------------------------------------------------------
</TABLE>
-58-
<PAGE> 80
<TABLE>
<S> <C> <C> <C> <C>
- ----------------------------------------------------------------------------------------------------------------------------------
98-46570 Manufacturing method of semiconductor package B.J. Han 98/10/31
- ----------------------------------------------------------------------------------------------------------------------------------
98-46571 Manufacturing method of semiconductor package B.J. Han 98/10/31
- ----------------------------------------------------------------------------------------------------------------------------------
98-46572 Semiconductor device I.K. Shim 98/10/31
- ----------------------------------------------------------------------------------------------------------------------------------
98-46573 Semiconductor device and its manufacturing method I.K. Shim 98/10/31
- ----------------------------------------------------------------------------------------------------------------------------------
98-46574 Semiconductor package and its manufacturing method C.K. Park 98/10/31
- ----------------------------------------------------------------------------------------------------------------------------------
98-46847 Manufacturing method and device for semiconductor packages S.H. Kim 98/11/2
- ----------------------------------------------------------------------------------------------------------------------------------
98-21474 Equipment for fabricating semiconductor package S.G. Kim 98/11/5
- ----------------------------------------------------------------------------------------------------------------------------------
98-21475 Equipment for fabricating semiconductor package K.N. Kim 98/11/5
- ----------------------------------------------------------------------------------------------------------------------------------
98-21866 Substrate structure for semiconductor packages
- ----------------------------------------------------------------------------------------------------------------------------------
98-47393 Equipment for fabricating semiconductor package J.H. Yoon 98/11/5
- ----------------------------------------------------------------------------------------------------------------------------------
98-47394 Equipment for fabricating semiconductor package S.B. Na 98/11/5
- ----------------------------------------------------------------------------------------------------------------------------------
98-47395 Method for fabricating semiconductor package K.N. Kim 98/11/5
- ----------------------------------------------------------------------------------------------------------------------------------
98-47396 Equipment for fabricating semiconductor package Y.K. Kwak 98/11/5
- ----------------------------------------------------------------------------------------------------------------------------------
98-21568 Substrate for semiconductor packages
- ----------------------------------------------------------------------------------------------------------------------------------
98-21569 Structure of flexibility substrate for semiconductor packages S.H. Ha 98/11/6
- ----------------------------------------------------------------------------------------------------------------------------------
98-47553 Equipment for fabricating semiconductor package Y.Y. Cho 98/11/6
- ----------------------------------------------------------------------------------------------------------------------------------
98-21866 Substrate structure for semiconductor packages I.G. Han 98/11/11
- ----------------------------------------------------------------------------------------------------------------------------------
98-21867 Sawing wheel for wafer cutting J.Y. Chung 98/11/11
- ----------------------------------------------------------------------------------------------------------------------------------
</TABLE>
-59-
<PAGE> 81
<TABLE>
<S> <C> <C> <C> <C>
- ----------------------------------------------------------------------------------------------------------------------------------
98-48927 Structure of flexibility substrate for semiconductor packages D.S. You 98/11/14
- ----------------------------------------------------------------------------------------------------------------------------------
98-48928 Semiconductor packages and manufacturing method of it Chowdhury, Asif 98/11/14
- ----------------------------------------------------------------------------------------------------------------------------------
98-48929 Flexible substrate structure and semiconductor packages and S.H. Lee 98/11/14
manufacturing method with the structure
- ----------------------------------------------------------------------------------------------------------------------------------
98-49057 Substrate structure and manufacturing for semiconductor packages
- ----------------------------------------------------------------------------------------------------------------------------------
98-49058 Substrate structure and manufacturing method for semiconductor D.H. Park 98/11/16
packages
- ----------------------------------------------------------------------------------------------------------------------------------
98-49059 Substrate structure and manufacturing method for semiconductor D.H. Park 98/11/16
packages
- ----------------------------------------------------------------------------------------------------------------------------------
98-49060 Strip with display parts and semiconductor packages with the strip S.S. Cha 98/11/16
- ----------------------------------------------------------------------------------------------------------------------------------
98-22488 Structure of flexibility substrate for semiconductor packages S.H. Ha 98/11/18
- ----------------------------------------------------------------------------------------------------------------------------------
98-49887 Semiconductor packages and manufacturing method of it C.S. Han 98/11/20
- ----------------------------------------------------------------------------------------------------------------------------------
98-21618 Semiconductor package manufacturing apparatus G.H. Lee 98/11/7
- ----------------------------------------------------------------------------------------------------------------------------------
98-21619 Semiconductor package manufacturing apparatus G.H. Lee 98/11/7
- ----------------------------------------------------------------------------------------------------------------------------------
98-21620 Semiconductor package manufacturing apparatus H.D. Lee 98/11/7
- ----------------------------------------------------------------------------------------------------------------------------------
98-21621 Semiconductor package manufacturing apparatus C.H. Ko 98/11/7
- ----------------------------------------------------------------------------------------------------------------------------------
98-21622 Semiconductor package manufacturing apparatus M.H. Park 98/11/7
- ----------------------------------------------------------------------------------------------------------------------------------
98-21623 Semiconductor package manufacturing apparatus S.W. Lee 98/11/7
- ----------------------------------------------------------------------------------------------------------------------------------
98-21624 Semiconductor package manufacturing apparatus C.H. Ko 98/11/7
- ----------------------------------------------------------------------------------------------------------------------------------
</TABLE>
-60-
<PAGE> 82
<TABLE>
<S> <C> <C> <C> <C>
- ----------------------------------------------------------------------------------------------------------------------------------
98-47878 Method for fabricating semiconductor package E.H. Pyo 98/11/9
- ----------------------------------------------------------------------------------------------------------------------------------
98-47798 A flexible film for semiconductor packges
- ----------------------------------------------------------------------------------------------------------------------------------
98-48046 Semiconductor package and its manufacturing method D.H. Park 98/11/10
- ----------------------------------------------------------------------------------------------------------------------------------
98-48047 Semiconductor package B.Y. Min 98/11/10
- ----------------------------------------------------------------------------------------------------------------------------------
98-48048 Printed circuit board and manufacturing method of printed circuit B.Y. Min 98/11/10
board and semiconductor package using the printed circuit board
- ----------------------------------------------------------------------------------------------------------------------------------
98-49323 Circuit tape for ball grid array semiconductor package
- ----------------------------------------------------------------------------------------------------------------------------------
98-52923 Manufacturing method of semiconductor package Y.Y. Cho 98/12/3
- ----------------------------------------------------------------------------------------------------------------------------------
98-52924 Manufacturing method of semiconductor package J.H. Lee 98/12/3
- ----------------------------------------------------------------------------------------------------------------------------------
98-54095 Method for fabricating semiconductor package S.H. Lee 98/12/10
- ----------------------------------------------------------------------------------------------------------------------------------
98-54999 Wire bonding method of semiconductor device S.H. Kim 98/12/15
- ----------------------------------------------------------------------------------------------------------------------------------
98-25418 Flexible circuit board and semiconductor packages using it I.G. Han 98/12/17
- ----------------------------------------------------------------------------------------------------------------------------------
98-25419 Flexible circuit board structure for semiconductor package J.E. Hong 98/12/17
- ----------------------------------------------------------------------------------------------------------------------------------
98-55910 Semiconductor package C.H. Woo 98/12/17
- ----------------------------------------------------------------------------------------------------------------------------------
98-55911 Semiconductor package and its manufacturing method S.H. Kim(2) 98/12/17
- ----------------------------------------------------------------------------------------------------------------------------------
96-01240 Method of manufacturing chip size semiconductor package Y.S. Yoon 96/1/22
- ----------------------------------------------------------------------------------------------------------------------------------
98-63124 Semiconductor package E.S. Sohn 98/12/31
- ----------------------------------------------------------------------------------------------------------------------------------
98-63125 Semiconductor package S.H. Lee 98/12/31
- ----------------------------------------------------------------------------------------------------------------------------------
</TABLE>
-61-
<PAGE> 83
<TABLE>
<S> <C> <C> <C> <C>
- ----------------------------------------------------------------------------------------------------------------------------------
98-63126 Semiconductor package J.H. Lee 98/12/31
- ----------------------------------------------------------------------------------------------------------------------------------
98-63127 Semiconductor package D.S. You 98/12/31
- ----------------------------------------------------------------------------------------------------------------------------------
98-63822 Semiconductor package and its manufacturing method J.Y. Chung 98/12/31
- ----------------------------------------------------------------------------------------------------------------------------------
98-27353 Circuit tape for semiconductor device J.H. Yoon 98/12/29
- ----------------------------------------------------------------------------------------------------------------------------------
98-60454 Manufacturing apparatus of semiconductor device and punching J.H. Yoon 98/12/29
method
- ----------------------------------------------------------------------------------------------------------------------------------
98-60456 Wire for semiconductor device J.S. Kwak 98/12/29
- ----------------------------------------------------------------------------------------------------------------------------------
98-62596 Lamination method of semiconductor device and manufacturing I.K. Shim 98/12/30
apparatus
- ----------------------------------------------------------------------------------------------------------------------------------
98-62597 Test apparatus of semiconductor package and its test method Y.C. Cho 98/12/30
- ----------------------------------------------------------------------------------------------------------------------------------
98-28225 Wire bonding inspection system for manufacturing semiconductor S.H. Jang 98/12/31
package
- ----------------------------------------------------------------------------------------------------------------------------------
98-28226 Inspection apparatus of semiconductor device G.H. Lee 98/12/31
- ----------------------------------------------------------------------------------------------------------------------------------
98-58837 Device for fabricating semiconductor package S.J. Kim 98/12/26
- ----------------------------------------------------------------------------------------------------------------------------------
98-58838 Method for fabricating semiconductor package S.H. Kim 98/12/26
- ----------------------------------------------------------------------------------------------------------------------------------
98-59607 PCB board S.J. Kim 98/12/28
- ----------------------------------------------------------------------------------------------------------------------------------
98-60431 Structure for mold die in fabrication of semiconductor package D.J. Kim 98/12/29
- ----------------------------------------------------------------------------------------------------------------------------------
98-60432 Lead frame and semiconductor package with such lead frame Y.S. Lee 98/12/29
- ----------------------------------------------------------------------------------------------------------------------------------
98-60433 Semiconductor package and method for fabricating the same I.G. Han 98/12/29
- ----------------------------------------------------------------------------------------------------------------------------------
98-27790 Carrier frame for semiconductor packages D.S. You 98/12/29
- ----------------------------------------------------------------------------------------------------------------------------------
</TABLE>
-62-
<PAGE> 84
<TABLE>
<S> <C> <C> <C> <C>
- ----------------------------------------------------------------------------------------------------------------------------------
98-27791 Wire bonder capillary J.Y. Chung 98/12/30
- ----------------------------------------------------------------------------------------------------------------------------------
98-27792 Lead frame for semiconductor packages J.Y. Ha 98/12/30
- ----------------------------------------------------------------------------------------------------------------------------------
98-27793 Magazine for semiconductor packages C.Y. Jang 98/12/30
- ----------------------------------------------------------------------------------------------------------------------------------
98-61607 Structure of semiconductor package D.S. You 98/12/30
- ----------------------------------------------------------------------------------------------------------------------------------
98-61608 Structure of semiconductor package Y.S. Lee 98/12/30
- ----------------------------------------------------------------------------------------------------------------------------------
98-61609 A substrate structure and earthing method for semiconductor S.J. Kim 98/12/30
packages
- ----------------------------------------------------------------------------------------------------------------------------------
98-61610 Semiconductor packages and manufacturing method of it T.B. Jung 98/12/30
- ----------------------------------------------------------------------------------------------------------------------------------
98-61611 Cull gripper with output transfer arms of auto molding system J.U. An 98/12/30
for semiconductor packages
- ----------------------------------------------------------------------------------------------------------------------------------
98-61612 A substrate structure and earthing method for semiconductor packages S.H. Ha 98/12/30
- ----------------------------------------------------------------------------------------------------------------------------------
</TABLE>
Exhibit E, Continued
II. Japanese Patents and Applications
<TABLE>
<CAPTION>
- ------------------------------------------------------------------------------------------------------------------------------------
APPL NO TITLE INVENTOR(S) FILE DATE PRIORITY PRIORITY DATE PATENT NO ISSUE DATE
- ------------------------------------------------------------------------------------------------------------------------------------
<S> <C> <C> <C> <C> <C> <C> <C>
6-159039 Mold runner removal Young Wook Heo/ 94-7-11 93-15985 3-08-18
from a substrate-based Il Kwon Shim/
packaged electronic Bruce J. Freyman/
device John Briar
- ------------------------------------------------------------------------------------------------------------------------------------
</TABLE>
-63-
<PAGE> 85
<TABLE>
<S> <C> <C> <C> <C> <C> <C> <C>
- ------------------------------------------------------------------------------------------------------------------------------------
6-297411 Method and device for Goo Lee 96-10-11 93-25829/ 93-11-30/ 2742514 98-1-30
molding of intergrated 94-22439/ 94-09-07/
circuit package (Method) 94-22625 94-09-07
- ------------------------------------------------------------------------------------------------------------------------------------
6-198341 BGA semiconductor package Young Wook Heo/ 96-8-25 94-2982 /19/93
Il Kwon Shim
- ------------------------------------------------------------------------------------------------------------------------------------
7-153209 Method of reducing Jae Dong Kim 95-6-20 94-5635/ 94-03-21/ 2622104 97-4-4
delamination between a 94-15873 94-07-02
lead frame and molding
compound
- ------------------------------------------------------------------------------------------------------------------------------------
7-148910 Copper-oxide filled Choul Woll Kwak 95-6-15 94-13647 4-06-16 2706227 97-10-9
polymer die attach
adhesive composition
for semiconductor
package
- ------------------------------------------------------------------------------------------------------------------------------------
7-153689 Heat spreader suitable for Myung Jun Lee 95-6-20 94-14028 94-06-21 2592587 96-12-10
commonly used semiconductor
packages having different
pad sizes
- ------------------------------------------------------------------------------------------------------------------------------------
7-220236 Semiconductor leadframe Won Sun Shin 95-8-29 94-21610/ 94-08-30/ 2820645
having connection bar 94-26326/ 94-10-10/
and guide rings 94-25861 94-10-10
- ------------------------------------------------------------------------------------------------------------------------------------
</TABLE>
-64-
<PAGE> 86
<TABLE>
<S> <C> <C> <C> <C> <C> <C> <C>
- ------------------------------------------------------------------------------------------------------------------------------------
7-241960 Method for checking wire Young Wook Heo/ 95-9-20 94-24280 94-08-27 2703204 97-10-3
bonding result of BGA Dong Sin Youm
package
- ------------------------------------------------------------------------------------------------------------------------------------
7-345711 Chip mounting plate Youn Cheol Yoo/ 95-12-12 94-33994/ 4-12-14/ 2767404 4/10/98
construction of lead Hee Yeoul Yoo/ 94-37168 94-12-27
frame for semiconductor Jeong Lee/
package Doo Hyun Park/
In Gyu Han
- ------------------------------------------------------------------------------------------------------------------------------------
7-346366 Semiconductor package Won Sun Shin/ 95-12-12 94-34663 4-12-16 2660504 97-6-13
with intergral heat Byung Tae Do
dissipator
- ------------------------------------------------------------------------------------------------------------------------------------
7-352582 Ball grid array Il Kwon Shim/ 95-12-28 95-19582 95-07-05 2887144
semiconductor packages Young Wook Heo
with improved heat
dissipation and
dehumidification effect
- ------------------------------------------------------------------------------------------------------------------------------------
7-352583 BGA semiconductor package Il Kwon Shim 95-12-28 95-25172 /16/95 2727435 97-12-12
having exposed heat sink
- ------------------------------------------------------------------------------------------------------------------------------------
</TABLE>
-65-
<PAGE> 87
<TABLE>
<S> <C> <C> <C> <C> <C> <C> <C>
- ------------------------------------------------------------------------------------------------------------------------------------
8-241010 Heat sink-interated Won Sun Shin 95-8-26 95-28771 5-09-04 Notice of Allowance
semiconductor package
with double encapsulating
parts and method for
fabricating the same
- ------------------------------------------------------------------------------------------------------------------------------------
8-302542 Printed circuit board Sun Ho Ha/ 96-10-28 95-37513 5-10-27 Notice of
having epoxy barrier Young Wook Heo Allowance
around a throughout slot
and ball grid array
semiconductor package
- ------------------------------------------------------------------------------------------------------------------------------------
8-182798 Ball grid array Il Kwon Shim/ 96-6-24 95-41438 5-11-15 2881575
semiconductor package Young Wook Heo
with ring-type heat sink
- ------------------------------------------------------------------------------------------------------------------------------------
8-320732 Semiconductor package Won Sun Shin/ 96-11-15 95-41844/ 5-11-17/
provided with heatsink Won Kyun Lee 95-44554 95-11-29
and surface treating
method for such a
heat sink
- ------------------------------------------------------------------------------------------------------------------------------------
8-182799 Unit printed circuit board Il Kwon Shim/ 96-6-24 95-41846 5-11-17 Notice of
carrier frame for ball Young Wook Heo Allowance
grid array semiconductor
package and method for
fabricating ball grid
array semiconductor
packages using the same
- ------------------------------------------------------------------------------------------------------------------------------------
</TABLE>
-66-
<PAGE> 88
<TABLE>
<S> <C> <C> <C> <C> <C> <C> <C>
- ------------------------------------------------------------------------------------------------------------------------------------
8-243997 Process for bonding Seong Min Seo/ 96-8-28 95-42561 5-11-21 2727443 97-12-12
semiconductor chip Jae Hwan Song
- ------------------------------------------------------------------------------------------------------------------------------------
8-354355 Semiconductor chip scale Young Wook Heo 96-12-19 95-54765 5-12-12
package and method of
producing such
- ------------------------------------------------------------------------------------------------------------------------------------
8-358683 Semiconductor package Kil Bum Kim/ 96-12-27 95-58806 5-12-27 2779789 98-5-15
lead frame with stress Young Seok Jung
absorbing means on
fused leads
- ------------------------------------------------------------------------------------------------------------------------------------
8-255585 Wafer map conversion Chee Jung Song 96-9-5 96-05343 2/29/96
method
- ------------------------------------------------------------------------------------------------------------------------------------
9-19725 Method of producing BGA Il Kwon Shim/ 97-1-17 96-05345 2/29/96 Notice of
semiconductor package Young Wook Heo Allowance
metal carrier frame and
BGA package produced by
such method
- ------------------------------------------------------------------------------------------------------------------------------------
</TABLE>
-67-
<PAGE> 89
<TABLE>
<S> <C> <C> <C> <C> <C> <C> <C>
- ------------------------------------------------------------------------------------------------------------------------------------
9-23144 Method of forming chip Young Wook Heo 97-1-22 96-06302/ 6-03-11
bumps of bumps chip 96-06303
scale semiconductor
package such package
and chip bump
- ------------------------------------------------------------------------------------------------------------------------------------
9-98041 Solder Ball land metal Moo Eun Lee 97-3-31 96-09778 6-04-01 2860648
structure of ball grid
array semiconductor
package
- ------------------------------------------------------------------------------------------------------------------------------------
9-24274 Grid array type lead Won Sun Shin/ 97-1-23 96-22897/ 96-06-21
frame and lead end grid Byung Joon Han/ 96-22898/
array semiconductor Ju Hoon Yoon/ 96-22899
package employing the Sung Bum Kwak/
same In Gyu Han
- ------------------------------------------------------------------------------------------------------------------------------------
8-353644 Semiconductor package Byung Joon Han/ 96-12-17 96-22901 96-06-21 2860646
and method for fabricating Young Wook Heo
the same
- ------------------------------------------------------------------------------------------------------------------------------------
9-275281 Mold for ball grid array Young Yeop Moon 97-9-22 96-41469/ 6-09-21/
semiconductor package 70/71/72/ 96-11-28
96-58810/
11/15/16
- ------------------------------------------------------------------------------------------------------------------------------------
</TABLE>
-68-
<PAGE> 90
<TABLE>
<S> <C> <C> <C> <C> <C> <C> <C>
- ------------------------------------------------------------------------------------------------------------------------------------
9-289089 Semiconductor package Seon Goo Lee 97-10-6 96-43843/ 96-10-04/96-10-18
having light, thin 96-46656
simple and compact
structure
- ------------------------------------------------------------------------------------------------------------------------------------
9-304957 Method for reproducing Sun Ho Ha/ 97-10-20 96-46948 6-10-19 2860651
printed circuit boards for Young Wook Heo/
semiconductor packages Byung Joon Han
including poor quality
printed circuit board
units and method for
fabricating semiconductor
packages using the
reproduced printed
circuit boards
- ------------------------------------------------------------------------------------------------------------------------------------
9-228831 Method for marking poor Young Wook Heo/ 97-8-11 96-62305 6-12-06
quality printed Il Kwon Shim
circuit board units of
printed circuit board
strip for semiconductor
packages and the printed
circuit board strip
- ------------------------------------------------------------------------------------------------------------------------------------
</TABLE>
-69-
<PAGE> 91
<TABLE>
<S> <C> <C> <C> <C> <C> <C> <C>
- ------------------------------------------------------------------------------------------------------------------------------------
9-368681 Alumina-silicon carbide Seok Ho Na 97-12-26 96-77897 6-12-30
nanocomposite for ball
bonding capillaries
of wire bonding device
and method of
manufacturing such
- ------------------------------------------------------------------------------------------------------------------------------------
9-233372 Ball grid array Il Kwon Shim/ 97-8-14 96-77898/ 6-12-30/97-02-14
semiconductor package Young Wook Heo/ 96-77899/
with solder balls fused Robert Frarcis 97-04430
on printed circuit board Darveaux
and method for fabricating
the same
- ------------------------------------------------------------------------------------------------------------------------------------
9-159227 Flexible circuit for ball Il Kwon Shim/ 97-6-2 96-77900/ 6-12-30
grid array semiconductor Young Wook Heo/ 96-77901/
package Robert Frarcis 96-77902
Darveaux
- ------------------------------------------------------------------------------------------------------------------------------------
9-368625 Circuit board with Joong Ho Cho/ 97-12-29 96-77919 2/30/96
eye-shaped internal Young Seok Chung/
circuit tip alignment Kyung Sook Choi
structure for mounting
electronic components
- ------------------------------------------------------------------------------------------------------------------------------------
10-30663 Method of manufacturing Il Kwon Shim/ 98-1-28 97-02504 /28/97 Notice of
ball grid array Sun Ho Ha Allowance
semiconductor package
- ------------------------------------------------------------------------------------------------------------------------------------
</TABLE>
-70-
<PAGE> 92
<TABLE>
<S> <C> <C> <C> <C> <C> <C> <C>
- ------------------------------------------------------------------------------------------------------------------------------------
10-51459 Circuit board Sang Suk Cha 98-2-17 97-04656 /17/97
- ------------------------------------------------------------------------------------------------------------------------------------
10-58942 Mothod of fobricating Young Wook Heo 98-2-24 97-06063 /26/97
semiconductor package
- ------------------------------------------------------------------------------------------------------------------------------------
10-334667 Method of molding BGA SungJin Kim 98-11-25 98-19303, 98-05-27/98-09-08
Semiconductor PKG 19304,
36897,36898
- ------------------------------------------------------------------------------------------------------------------------------------
10-346145 PCB for grounding SungJin Kim 98-11-27 97-64125 1/28/97
BGA Semiconductor PKG
- ------------------------------------------------------------------------------------------------------------------------------------
11-68670 Semiconductor Package SeonGoo Lee 99-3-15 98-12364 /8/98
- ------------------------------------------------------------------------------------------------------------------------------------
</TABLE>
-71-
<PAGE> 93
Exhibit E, Continued
III. United States Patents and Applications
<TABLE>
<S> <C> <C> <C> <C> <C> <C>
- -------------------------------------------------------------------------------------------------------------------------
APPL NO TITLE INVENTOR(S) FILE DATE PRIORITY PRIORITY DATE ASSIGNEE
- -------------------------------------------------------------------------------------------------------------------------
08/349237 Method and device for Goo Lee 94-10-5 93-25829/ 93-11-30/ Anam & Amkor
molding of intergrated 94-22439/ 94-09-07/
circuit package(Device) 94-22625 94-09-07
- -------------------------------------------------------------------------------------------------------------------------
08/485936 Copper-oxide filled Choul Woll Kwak 95-6-7 94-13647 94-06-16 Anam & Amkor
polymer die attach
adhesive composition
for semiconductorpackage
- -------------------------------------------------------------------------------------------------------------------------
08/530558 Method for checking wire Young Wook Heo/ 95-9-19 94-24280 94-08-27 Anam & Amkor
bonding result of BGA Dong Sin Youm
package
- -------------------------------------------------------------------------------------------------------------------------
08/588172 Ball grid array Il Kwon Shim/ 96-1-18 95-19582 95-07-05 Anam & Amkor
semiconductor packages Young Wook Heo
with improved heat
dissipation and
dehumidification effect
- -------------------------------------------------------------------------------------------------------------------------
08/570849 Bonding method for Seong Min Seo/ 95-12-12 95-28772 95-0904 Anam & Amkor
semiconductor Sunk Ju Jang
- -------------------------------------------------------------------------------------------------------------------------
08/736107 Printed circuit board Sun Ho Ha/ 96-10-24 95-37513 95-10-27 Anam & Amkor
having epoxy barrier Young Wook Heo
around a throughout slot
and ball grid array
semiconductor package
- -------------------------------------------------------------------------------------------------------------------------
08/749578 Process for bonding Seong Min Seo/ 96-11-14 95-42561 95-11-21 Anam & Amkor
semiconductor chip Jae Hwan Song
- -------------------------------------------------------------------------------------------------------------------------
08/704477 Wafer map conversion method Chee Jung Song 96-8-28 96-05343 96-12-29 Anam & Amkor
- -------------------------------------------------------------------------------------------------------------------------
</TABLE>
-72-
<PAGE> 94
<TABLE>
<S> <C> <C> <C> <C> <C> <C>
- -------------------------------------------------------------------------------------------------------------------------
08/775839 Grid array type lead Won Sun Shin/ 96-12-31 96-22897/ 96-06-21 Anam & Amkor
frame and lead end grid Byung Joon Han/ 96-22898/
array semiconductor Ju Hoon Yoon/ 96-22899
package employing the Sung Bum Kwak/
same In Gyu Han
- -------------------------------------------------------------------------------------------------------------------------
08/763605 Semiconductor package Byung Joon Han/ 96-12-11 96-22901 96-06-21 Anam & Amkor
and method for fabricating Young Wook Heo
the same
- -------------------------------------------------------------------------------------------------------------------------
09/008552 Semiconductor package Byung Joon Han/ 98-1-16 96-22901 96-06-21 Anam & Amkor
and method for fabrication Young Wook Heo
the same
- -------------------------------------------------------------------------------------------------------------------------
08/915077 Ball grid array Il Kwon Shim/ 97-8-20 96-77898/ 96-12-30/ Anam & Amkor
semiconductor package with Young Wook Heo/ 96-77899/ 97-02-14
solder balls fused on Robert Frarcis 97-04430
printed circuit board Darveaux
and method for fabricating
the same
- -------------------------------------------------------------------------------------------------------------------------
08/883541 Flexible circuit for Il Kwon Shim/ 97-6-25 96-77900/ 96-12-30 Anam & Amkor
ball grid array Young Wook Heo/ 96-77901/
semiconductor package Robert Frarcis 96-77902
Darveaux
- -------------------------------------------------------------------------------------------------------------------------
09/013330 Method of manufacturing Il Kwon Shim/ 98-1-26 97-02504 1/28/97 Anam & Amkor
ball grid array Sun Ho Ha/
semiconductor package Robert Frarcis
Darveaux
- -------------------------------------------------------------------------------------------------------------------------
09/024940 Method of fabricating Young Wook Heo 98-2-17 97-06063 2/26/97 Anam & Amkor
semiconductor package
- -------------------------------------------------------------------------------------------------------------------------
</TABLE>
-73-
<PAGE> 1
EXHIBIT 10.2
EXECUTION COPY
TRANSITION SERVICE AGREEMENT
This Transition Service Agreement ("Agreement") is made and entered into
this 6th day of May, 1999 by and between and Amkor Technology Korea, Inc., a
corporation organized under the laws of the Republic of Korea ("ATK"), and Anam
Semiconductor, Inc., a corporation organized under the laws of the Republic of
Korea ("Anam").
W I T N E S S E T H:
WHEREAS, Anam and Amkor Technology, Inc. ("ATI") have entered into a
certain Asset Purchase Agreement dated as of December 30, 1998 (the "Asset
Purchase Agreement") and an amendment to the Asset Purchase Agreement dated May
3, 1999 (the "Amendment"), pursuant to which ATK and ATI will purchase and
acquire from Anam the assets in K4; and
WHEREAS, in order to support the continued and uninterrupted operation
of K4 from the time of Closing, the parties to the Asset Purchase Agreement and
the Amendment agreed to enter into an arrangement whereby Anam will continue to
provide to ATK certain of its services that have been provided by Anam to K4
prior to the Closing Date, in accordance with the terms and conditions of this
Agreement and Section 4.7 of the Asset Purchase Agreement.
NOW, THEREFORE, in consideration of the mutual covenants, agreements and
obligations set forth herein, the parties hereto agree as follows:
ARTICLE I
DEFINITIONS
Section 1.1. Definitions. Unless otherwise defined in this Agreement,
all of the capitalized terms used in this Agreement shall have the same meanings
as they are defined in the Asset Purchase Agreement.
ARTICLE II
TERM
<PAGE> 2
-2-
Section 2.1. Term. The term of this Agreement shall commence on the
Closing Date of the Asset Purchase Agreement (the "Effective Date") and shall
continue until the parties to this Agreement separately agree, unless terminated
on an earlier date pursuant to Article 7 of this Agreement.
ARTICLE III
THE SERVICES
Section 3.1. Services to be provided by Anam. During the term of this
Agreement, Anam shall provide to ATK all of the services and parts and
components currently provided to the Business by Anam including, among other
things, the research and development, accounting, data processing, materials
procurement, electronic data processing, administrative services and all other
such support services as are reasonably required in connection with the
operation of the Business as described in detail in the Schedules attached to
this Agreement (collectively, "Services" and, individually, "Service"), upon the
detailed terms and at the rates specified in such Schedules.
Section 3.2 Services to be Provided.
(a) Anam shall ensure that the Business is continued to be
provided with all of the Services, on the terms and conditions not less
favorable than the terms and conditions pursuant to which such services and
parts and components are now being provided to the Business.
(b) In addition to the Services, Anam shall ensure that all
services currently made available to the employees of the Business including,
without limitation, cafeteria, clinic and human welfare services continue to be
provided to the Transferred Employees on the same terms and conditions as such
services which have been provided to them.
<PAGE> 3
-3-
Section 3.3. Specifics and Costs of Services.
(a) The attached Schedules of Services and costs are subject to
change with the parties' mutual written consent. The parties hereto shall use
good faith efforts to discuss any change of charge for a Service; provided,
however, that any occurrence of events and change of circumstances shall not
justify stopping a provision of Services by Anam under this Agreement.
(b) ATK is contracting for use of Anam's system on an "as-is"
basis. After the Closing Date, if there will be any modifications to Anam_s
systems at ATK's request, Anam will make its best efforts to implement such
modifications at an actual cost basis.
(c) If there will be a separation of system at ATK's discretion
for the implementation of ATK's own independent systems, Anam agrees to
cooperate as reasonably requested by ATK in order to effectuate such separation.
Section 3.4. Additional Services. In addition to the Services, the
parties hereto acknowledge that there may be additional services and facilities
which have not been identified herein but which have been used by K4 prior to
the Closing Date and which shall continue to be required or desired by ATK until
the termination of this Agreement, or such later date as the parties may agree
upon. If any such additional services or facilities are identified and requested
by ATK, and Anam agrees to provide such services, ATK will be charged at a rate
to be agreed by Anam and ATK.
ARTICLE IV
PAYMENT AND INVOICE
Section 4.1. Service Fees.
(a) The fees payable by ATK to Anam for the Services shall be as
set forth in Schedules (the "Service Fees").
<PAGE> 4
-4-
Notwithstanding anything to the contrary contained herein, ATK shall not be
charged under this Agreement for any Service that is specifically required to be
performed under any other agreement between Anam and ATK and any such other
Service shall be performed and charged for in accordance with the terms of such
other agreement.
(b) In the event that a Service commences, expires or terminates
on any day other than the first day of a calendar month, the applicable Service
Fee shall be calculated on a pro rata basis based on the actual number of days
during which the Service was provided and a month of 30 days.
Section 4.2. Payment.
(a) Anam shall invoice ATK monthly in arrears within fifteen (15)
calendar days of the end of the month in question in relation to an amount
payable for the Services provided to ATK during such month. ATK shall pay an
amount invoiced by Anam and any sales, value-added or similar taxes on any
amounts to be paid to Anam hereunder in full within thirty (30) calendar days of
the date of receipt of Anam's invoice.
(b) Other than the Service Fees, no cost or expense, including
any out-of-pocket expense paid to a third party by Anam as result of Services
provided hereunder by Anam to ATK, shall be charged separately to ATK.
ARTICLE V
WARRANTIES
Section 5.1. Express Warranties. Anam warrants that the Services under
this Agreement shall be of substantially the same type and quality as have been
provided for the benefit of K4 prior to the Effective Date, and shall be of such
type and quality as are reasonably required to appropriately operate K4 in a
commercially reasonable manner.
<PAGE> 5
-5-
ARTICLE VI
INDEMNITY; LIMITATION OF LIABILITY
Section 6.1. Indemnity. Anam shall indemnify and hold harmless ATK from
and against any loss, demand, liability, claim, cost or expense of whatever kind
(collectively, "Damages") arising from and incurred by ATK due to the negligence
or willful misconduct of Anam or its personnel assigned for the Services under
this Agreement.
Section 6.2 Survival. The provisions of this Article VI shall survive
the termination of this Agreement.
ARTICLE VII
TERMINATION
Section 7.1. Termination.
(a) This Agreement may be terminated with respect to all or a
portion of the Services at any time as follows:
(i) by mutual written agreement of the parties;
(ii) at the written election of one party, in the event of
a material default by the other party of its obligations
hereunder, which default shall not have been cured within
sixty (60) calendar days after written notice given by the
non-defaulting party to the defaulting party; or
(iii) at the written election of one party, in accordance
with Section 8.1(d).
(b) ATK may terminate any Service(s) provided pursuant to this
Agreement on ninety (90) days prior written notice to Anam, unless otherwise
specified in Schedules. If ATK elects to terminate a Service, it will bear the
costs of interfacing any new
<PAGE> 6
-6-
system to the remaining Anam systems which it continues to use. ATK shall no
longer be obligated to pay Anam the Service Fees attributable to such canceled
Service(s) following the effective termination date of such Service(s) provided
that ATK fully pays any and all Service Fees, charges or other similar payment
due and accrued in connection with Service(s) provided up to and including the
effective termination date.
(c) No termination of this Agreement (including any early
termination of a Service pursuant to paragraph (b) above) shall discharge,
affect or otherwise modify in any manner the rights and obligations of the
parties hereto which have accrued or have been incurred prior to such
termination, including, without limitation, the obligation of ATK to pay Anam
any and all amounts payable hereunder for, or related to, the Services
theretofore provided.
ARTICLE VIII
FORCE MAJEURE
Section 8.1. Force Majeure.
(a) A party is not liable for a failure to perform any of its
obligations under this Agreement insofar as it proves that the failure was due
to an impediment beyond its reasonable control.
(b) An impediment within paragraph (A) above may result from
events including, but not limited to, (i) war, whether declared or not, riots,
acts of sabotage, explosions, fires, destruction of equipment/machines, or
inability to obtain raw materials, (ii) natural disasters, such as violent
storms, earthquakes, floods and destruction by lightning, (iii) the intervention
of any Governmental Authority, and (iv) boycotts, strikes and lock-outs of all
kinds and work-stoppages.
(c) A party seeking relief hereunder shall as soon as practicable
after the impediment and its effects upon its ability
<PAGE> 7
-7-
to perform became known to it give notice to the other party of such impediment.
(d) If the grounds for relief subsist for [ninety (90)] days or
more, either party shall be entitled to terminate this Agreement with written
notice to the other party pursuant to Article 5.
ARTICLE IX
MISCELLANEOUS
Section 9.1. Notices. All notices, reports and other written
communications permitted or required to be delivered by the provisions of this
Agreement shall be delivered to the party due to receive such notice, report, or
other written communication personally, by facsimile or by air courier service
at the relevant address set out below or such other address as the party may
specify by notice to the other:
to Anam: Anam Semiconductor, Inc.
280-2, 2-ga, Sungsu-dong
Sungdong-gu, Seoul 133-706 Korea
Attn: K.H. Kim
to ATK: Amkor Technology Korea, Inc.
Advanced Science & Industrial Complex, 2 block
Daechon-dong, Buk-gu, Kwangju 500-470 Korea
Attn: Michael D. O'Brien
Section 9.2. Governing Law and Jurisdiction. This Agreement and the
terms and conditions hereof shall be governed by and construed and interpreted
in accordance with the laws of the Republic of Korea. Any and all disputes which
may not be amicably settled by the parties shall be subject to the non-exclusive
jurisdiction of the Seoul District Court, and Anam and ATK each hereby agree and
consent to be subject to the jurisdiction of such court.
<PAGE> 8
-8-
Section 9.3. Effectiveness. The parties' obligations under this
Agreement are conditioned upon the Closing, the occurrence of which is subject
to various conditions set forth in the Asset Purchase Agreement. This Agreement
shall become operative if and when the Closing occurs and shall be null and void
if this Closing does not occur for any reason.
Section 9.4. Headings. The headings in this Agreement are inserted for
convenience only and are in no way intended to describe, interpret, define or
limit the scope, extent or intent of this Agreement or any provisions hereof.
Section 9.5. Amendment; Waiver. Any provision of this Agreement may be
amended or waived if, and only if, such amendment or waiver is in writing and
signed, in the case of an amendment, by Anam and ATK, or in the case of a
waiver, by the party against whom the waiver is to be effective. No failure or
delay by any party in exercising any right, power or privilege hereunder shall
operate as a waiver thereof nor shall any single or partial exercise thereof
preclude any other or further exercise thereof or the exercise of any other
right, power or privilege.
Section 9.6. Severability. If any provision of this Agreement or the
application thereof to any person or circumstance shall be deemed invalid,
illegal or unenforceable to any extent or for any reason, such provision shall
be severed from this Agreement and the remainder of this Agreement and the
application thereof shall not be affected and shall be enforceable to the
fullest extent permitted by law. A provision which is valid, legal and
enforceable shall be substituted for the severed provision.
Section 9.7. Parties in Interest. This Agreement shall inure to the
benefit of and be binding upon the parties and their respective successors and
permitted assigns. Nothing in this Agreement, express or implied, is intended to
confer upon any Person other than Anam or ATK, or their successors or permitted
assigns, any rights or remedies under or by reason of this Agreement.
Section 9.8. Counterparts. This Agreement may be executed in one or more
counterparts, each of which shall be deemed an original, and all of which shall
constitute one and the same agreement.
Section 9.9. Entire Agreement. This Agreement, the Asset
<PAGE> 9
-9-
Purchase Agreement and the other agreements referred to in the Asset Purchase
Agreement contain the entire agreement between the parties hereto with respect
to the subject matter hereof and supersede all prior agreements and
understandings, oral or written, with respect to such matter.
Section 9.10. Relationship of the Parties. Anam shall perform all
Services hereunder as an independent contractor. This Agreement does not create
a fiduciary or agency relationship between Anam and ATK, each of which shall be
and at all times remain independent companies for all purposes hereunder.
Nothing in this Agreement is intended to make either party a general or special
agent, joint venturer, partner or employee of the other for any purpose.
Section 9.11. Assignment. Neither party to this Agreement may assign any
of its rights or obligations under this Agreement, without the prior written
consent of the other party hereto.
Section 9.12. Fulfillment of Obligations. Any obligation of any party to
any other party under this Agreement, which obligation is performed, satisfied
or fulfilled by an Affiliate of such party, shall be deemed to have been
performed, satisfied or fulfilled by such party.
Section 9.13. Public Announcement. Prior to the Closing, neither Anam
nor ATK shall, without the approval of the other party hereto, make any press
release or other public announcement concerning the terms of the transactions
contemplated by this Agreement, except as may be required to comply with
requirements of any applicable Laws, and the rules and regulations of any stock
exchange upon which the securities of one of the parties is listed, in which
case the party shall use its Best Efforts to advise the other party thereof and
the parties shall use their Best Efforts to cause a mutually agreeable release
or announcement to be issued; provided that the foregoing shall not preclude
communications or disclosures necessary to implement the provisions of this
Agreement.
<PAGE> 10
IN WITNESS WHEREOF, the parties have caused this Agreement to be duly
executed in counterparts the day and year first written above.
ANAM SEMICONDUCTOR, INC.
By: /s/
---------------------------
Name:
-------------------------
Title:
------------------------
AMKOR TECHNOLOGY KOREA, INC.
By: /s/
---------------------------
Name:
-------------------------
Title:
------------------------
<PAGE> 11
Schedule A
PLANNING SERVICES
A. Contents of Services
This Service includes budget and investment control, performance
evaluation, projection of annual business plan, collection of data &
information, government & public relations. Details of the services that
will be provided to ATK are as follows:
_ Provide a guide line for investment and budget, including review
of the feasibility of proposed investments;
_ Provide annual business plan, which involves the following year_s
P&L projection, investments plan, resources, and related matters;
_ Collect and provide an internal and external data and
information, including the data and information regarding yield
rate, cost, turnover rate, investment status, semiconductor
market overview, new package trend, customer related information,
etc;
_ Provide services relating government relation; and
_ Provide company related news and advertisement to the public
whenever it is necessary.
B. Service Fee
Fee to be paid by ATK per month shall be US$40,250 (exclusive of any
VAT) which has been agreed by the parties, on the assumption that 7
employees of Anam out of 24 employees working for planning service are
exclusively assigned for the service to ATK.
<PAGE> 12
Schedule B
SPECIAL CUSTOMER SERVICES
A. Contents of Service
This Service is for the biggest customer of ATK, Intel. The services
includes quality improvement of Intel products, cost reduction
follow-up, critical part inventory, maintain direct communication with
Intel, and all related matters.
B. Service Fee
Fee to be paid by ATK per month shall be US$6,417 (exclusive of any VAT)
which has been agreed by the parties, on the assumption that 3 employees
of Anam out of 7 employees working for special customer service are
exclusively assigned for the service to ATK.
<PAGE> 13
Schedule C
GENERAL AFFAIRS (GA) SERVICES
A. Contents of Service
This Service includes company security, employees benefits, document
control, overseas business trip control, information desk, fixed asset
control, sub-contractor control, company transportation control,
printing house, broadcasting, and related matters. Details of the
services that will be provided for ATK are as follows:
_ Manage fixed assets including allocation of equipment,
liquidation of equipment, establishment and maintenance of asset
management control system, etc;
_ Coordinate contracts for outsourcing;
_ Establish strategy for operating vehicles, cafeteria, etc;
_ Support and manage employees' overseas trip such as reservation
of air ticket and hotel, travel expenses, etc; and
_ Provide printing service using printing house in K1.
B. Service Fee
Fee to be paid by ATK per month shall be US$29,000 (exclusive of any
VAT) which has been agreed by the parties, on the assumption that 8
employees of Anam out of 153 employees working for general affairs
service are exclusively assigned for the service to ATK.
<PAGE> 14
Schedule D
HUMAN RESOURCE DEVELOPMENT SERVICES
A. Contents of Service
This Service includes hiring and retirement, allocation of employees,
performance rating, promotion of employee, training and education of
employee, company regulation, and rewarding and punishment of employees.
Details of the services are as follows:
_ [Hire operators independently;]
_ [Evaluate performance of employees in connection with promotion
and reward & punishment of employees;] and
_ Establish company regulations.
Training for the employees hired for the operation of K4 shall be dome
independently by ATK at its own costs.
B. Service Fee
Fee to be paid by ATK per month shall be US$80,083 (exclusive of any
VAT) which has been agreed by the parties, on the assumption that 18
employees of Anam out of 90 employees working for human resource
development service are exclusively assigned for the service to ATK.
<PAGE> 15
Schedule E
EMPLOYEE-RELATED SERVICES
A. Contents of Service
This Service includes labor strategy, employee benefits, company outdoor
program, employee health program, payroll & social security payment and
other labor-related matters. Details of the services which will be
provided to ATK are as follows:
_ Provide advice to the management of employees;
_ Manage funds for the employee benefit, decide the types and value
of the gifts and bonuses to be given to the employees; and
_ Manage employee payrolls, severance pay and the social security
payments.
B. Service Fee
Fee to be paid by ATK per month shall be US$8,333 (exclusive of any VAT)
which has been agreed by the parties, on the assumption that 4 employees
of Anam out of 25 employees working for employee related service are
exclusively assigned for the service to ATK.
<PAGE> 16
Schedule F
FINANCE & ACCOUNTING SERVICES
A. Contents of Service
This Service will include following:
_ Manage funds;
_ Provide foreign exchange service relating to export and import;
_ Prepare accounting books and records for monthly closing;
_ Manage tax payment; and
_ Manage receipts and disbursements.
B. Service Fee
Fee to be paid by ATK per month shall be US$133,083 (exclusive of any
VAT) which has been agreed by the parties, on the assumption that 9
employees of Anam out of 30 employees working for financing and
accounting services are exclusively assigned for the services to ATK.
<PAGE> 17
Schedule G
EXPORT & IMPORT IN LOGISTICS
A. Contents of Service
This Service will include following:
_ Support custom related services when imported materials are
transferred to ATK;
_ Select and contract with forwarders for exporting and importing;
_ Provide custom clearance and other government related services;
_ Prepare record of exporting and importing performances; and
_ Manage Anam Trade Information Service Tracking System at K4.
B. Service Fee
Fee to be paid by ATK per month shall be US$9,833 (exclusive of any VAT)
which has been agreed by the parties, on the assumption that 3 employees
of Anam out of 14 employees working for financing and accounting
services are exclusively assigned for the services to ATK.
<PAGE> 18
Schedule H
MATERIAL CONTROL
A. Contents of Service
This Service will include following:
_ Die input and labeling;
_ Die receiving and inspection;
_ Manage die flow;
_ Manage material inventory and bill-back services; and
_ Manage carrying in/out of other materials and spare parts.
B. Service Fee
Fee to be paid by ATK per month shall be US$9,670 (exclusive of any VAT)
which has been agreed by the parties, on the assumption that 4 employees
of Anam out of 74 employees working for material control service are
exclusively assigned for the service to ATK.
<PAGE> 19
Schedule I
PURCHASING SERVICES
A. Contents of Service
This Service will include following:
_ Establish purchasing strategy:
_ Market trend analysis (PCB, L/F, Equipment, etc);
_ Price negotiation (PCB, L/F, Equipment, etc);
_ Select supplier;
_ Follow-up monitoring (Delivery, Quality, Inventory, etc); and
_ Manage purchasing system
B. Service Fee
Fee to be paid by ATK per month shall be US$16,830 (exclusive of any
VAT) which has been agreed by the parties, on the assumption that 8
employees of Anam out of 27 employees working for purchasing service are
exclusively assigned for the service to ATK.
<PAGE> 20
Schedule J
R&D SERVICES
A. Contents of Service
This Service will include following:
_ Manages Technology Information Management System;
_ Produce technology engineering report, and hold technology
related seminars;
_ Develop new package design and run simulations
_ Develop direct/indirect material and support suppliers of ATK;
_ Support K4 plant for its new package line-up; and
_ License relevant patent to ATK;
B. Service Fee
Fee to be paid by ATK per month shall be US$63,083 (exclusive of any
VAT) which has been agreed by the parties, on the assumption that 24
employees of Anam out of 102 employees working for R&D service are
exclusively assigned for the service to ATK.
<PAGE> 21
Schedule K
QA SUPPORTING SERVICES
A. Contents of Service
This Service includes will include following:
_ Material and Die incoming quality assurance;
_ Conduct an audit for suppliers;
_ Conduct reliability test for the finished goods; and
_ Quality related specification and document control.
B. Service Fee
Fee to be paid by ATK per month shall be US$32,920 (exclusive of any
VAT) which has been agreed by the parties, on the assumption that 16
employees of Anam out of 80 employees working for QA supporting service
are exclusively assigned for the service to ATK.
<PAGE> 22
Schedule L
CUSTOMER SERVICES
A. Contents of Service
This Service includes direct communication with customer and providing
data that customer has requested. Details of the services are as
follows:
_ Customer resident support;
_ Sales support (billing service, new customer service
representative training, etc);
_ Manufacturing monitoring (On-time delivery monitoring, emergency
lot control, hand-carry service, etc); and
_ Follow-up "Voice of Customer"
B. Service Fee
Fee to be paid by ATK per month shall be US$23,250 (exclusive of any
VAT) which has been agreed by the parties, on the assumption that 15
employees of Anam out of 63 employees working for customer service are
exclusively assigned for the service to ATK.
<PAGE> 23
Schedule M
SALES & MARKETING SERVICES
A. Contents of Service
This Service is for sales and marketing in both domestic and Japan
customers. Details of the services are as follows:
_ Contract with domestic and Japan customer;
_ Produce forecast for the customer;
_ Manage delivery time and cost of products;
_ Analyze market trend and package trend; and
_ Maintain good relationships with customers.
B. Service Fee
Fee to be paid by ATK per month shall be US$17,583 (exclusive of any
VAT) which has been agreed by the parties, on the assumption that 7
employees of Anam out of 23 employees working for sales and marketing
service are exclusively assigned for the service to ATK.
<PAGE> 24
Schedule N
PRODUCTION PLANNING SERVICES
A. Contents of Service
This Service includes the following:
_ Produce overall production volume forecasts and conduct
performance control;
_ Produce summary sheets of manpower and equipment efficiency;
_ Control capacity and material usage;
_ Control plant lay-out;
_ Support expatriates support (housing, vehicles, tax, etc);
_ Conduct cost control:
- ABC (Activity Based Costing)
- Produce cost modeling
- Generate line cost and P&L by PKG, plant, company
- Calculate and analyze average sales price; and
_ Select equipment and demonstration of new equipment
_ Manage overall "Suggestion Program";
_ Manage and support ATK's "Small Group Activity" and "Improvement
Team Activities";
_ Improve working environment and minimize loss or rejection in
production line;
_ Manage the Product Data Base; and
_ Enter orders (pin count updates, registration of a new package)
B. Service Fee
<PAGE> 25
Fee to be paid by ATK per month shall be US$37,830 (exclusive of any
VAT) which has been agreed by the parties, on the assumption that 11
employees of Anam out of 33 employees working for production planning
service are exclusively assigned for the service to ATK.
<PAGE> 26
Schedule O
ICS SERVICES
A. Contents of Service
This Service includes the following:
_ Develop all the information and technology programs for the
plant;
_ Develop and establish inter-company networking system- Notes
System (e-mail, information sharing system);
_ Select hardware (PC, Server, Video conference equipment, etc) and
maintain the hardware;
_ Select software for the office users; and
_ Maintain telecommunications system.
B. Service Fee
Fee to be paid by ATK per month shall be US$182,417 (exclusive of any
VAT) which has been agreed by the parties, on the assumption that 15
employees of Anam out of 51 employees working for ICS service are
exclusively assigned for the service to ATK.
<PAGE> 27
Schedule P
MANAGEMENT ASSISTANCE SERVICES
A. Contents of Service
This Service includes the following:
_ Provide financial management, including overall management of
financial matters, including contacts with the creditor banks and
development of the financial policies.
_ Coordinate public relations with public media, such as
newspapers, magazines and broadcasting companies, publication of
monthly corporate magazine for Anam's and ATK's employees and
coordination of CI ("Corporate Identity") project.
_ Provide support for the senior management of Anam and ATK.
_ Provide construction, environment and safety management services
in connection with the management of environment and construction
of K4.
B. Service Fee
Fee to be paid by ATK per month shall be US$60,916 (exclusive of any
VAT) which has been agreed by the parties, on the assumption that 15
employees of Anam out of 46 employees working for management support
service are exclusively assigned for the service to ATK.
<PAGE> 28
Schedule Q
SECRETARIAL SUPPORT
A. Contents of Service
This Service includes the following:
_ Provide secretarial support for the senior management of Anam and
ATK, including the Chairman of Anam.
_ Provide assistance and coordination services among Anam, Anam USA
and ATI.
B. Service Fee
Fee to be paid by ATK per month shall be US$27,666 (exclusive of any
VAT) which has been agreed by the parties, on the assumption that 4
employees of Anam out of 12 employees working for secretarial support
are exclusively assigned for the service to ATK.
<PAGE> 1
Exhibit 23.1
CONSENT OF INDEPENDENT PUBLIC ACCOUNTANTS
We hereby consent to the inclusion of this Current Report on Form 8-K of Amkor
Technology, Inc. (the "Company") of our report dated February 10, 1999 except
for Note 4 as to which the date is March 18, 1999 (the "Report"), which contains
explanatory paragraphs on the Kwangju Packaging Business' dependence on support
from Amkor Technology Inc., the Kwangju Packaging Business' operations affected
by unstable economy in Asia Pacific region and "Workout Program" of Anam
Semiconductor Inc. on our audits of the carved out financial statements of the
Kwangju Packaging Business of Anam Semiconductor Inc. We also hereby consent to
the incorporation of our Report included in this Form 8-K into the Company's
previously filed Registration Statement on Form S-8 (No. 333-62891).
SAMIL ACCOUNTING CORPORATION
May 28, 1999
Seoul, Korea
<PAGE> 1
Exhibit 99.2
AMKOR TECHNOLOGY NEWS RELEASE
Contact: Jeffrey Luth
VP Investor Relations
Amkor Technology, Inc.
ext. 5613
AMKOR TECHNOLOGY COMPLETES ACQUISITION OF K4 PACKAGING PLANT
AMKOR NOW OWNS PREMIER SEMICONDUCTOR PACKAGING COMPLEX
West Chester, PA - May 17, 1999 - Amkor Technology, Inc. (Nasdaq:AMKR) said
today that it has completed the acquisition of the K4 semiconductor packaging
plant from Anam Semiconductor, Inc. for approximately $582 million, including
the assumption of $7 million in employee benefit liabilities. The transaction
was funded with the proceeds of Amkor's recently completed offering of $625
million in long term debt.
With more than 1,000,000 square feet of total facility space, and nearly 800,000
square feet of manufacturing / administrative space, K4 is one of the world's
largest semiconductor packaging plants. Located on a 100-acre site in Kwangju,
South Korea, K4 has the infrastructure already in place to accommodate an
additional 1.6 million square feet of manufacturing space when fully expanded.
"Amkor's ownership of this world class facility has important strategic
benefits," said Amkor's President, John Boruch. "Often referred to as a
city-in-a-city, K4 is a state-of-the-art, fully expandable complex that
assembles some of the most technologically advanced semiconductor devices in the
world, including many of our advanced leadframe and laminate package products.
According to industry analysts, the market for laminate package products is
projected to experience significant growth over the next several years due to
the ongoing miniaturization of semiconductor design and increasing integration
of functions within a package. We expect Amkor to be a significant participant
in that market growth as it develops," added Mr. Boruch
"K4's existing physical plant, together with its fully-expandable configuration,
provides Amkor with the capability to accommodate the rapidly growing needs of
the marketplace for advanced semiconductor packaging products," continued Mr.
Boruch. "We are delighted to welcome the more than 1700 highly trained employees
of K4 into the Amkor family."
-more-
<PAGE> 2
"With the acquisition of K4, Amkor now owns and operates four packaging and test
factories, including three in the Philippines," noted Mr. Boruch. "While we will
continue to subcontract a sizable portion of our packaging and test business
under a long-term supply agreement with Anam Semiconductor, the acquisition of
K4 puts more of our revenue within our wholly owned factories. As production
volume at K4 continues to ramp, we expect to increase our manufacturing margins,
since the gross margin on K4-derived revenue will no longer be subject to the
contractual limitations of the supply agreement."
"While we are incurring considerable interest expense with this acquisition, K4
is expected to be a substantial contributor to Amkor's EBITDA during 1999,"
continued Mr. Boruch.
Amkor's Executive Vice President, Michael D. O'Brien, will have overall
responsibility for Amkor Technology Korea. Dan Sparks joins Amkor Technology
Korea as Director of Finance. Mr. Sparks will be based in Kwangju and will be
responsible for managing the development of financial accounting and reporting
systems at K4.
The K4 facility opened in 1996 and commenced volume production in 1997. K4 has
been building manufacturing volume throughout 1997 and 1998, during which time
several of the world's leading semiconductor companies have qualified K4 for
package production. Amkor expects to accelerate the ramp up of production at K4
during the next 12 to 24 months to meet projected market requirements.
Amkor Technology, Inc. is the world's largest provider of contract semiconductor
packaging and test services. The company offers a complete set of semiconductor
services including deep submicron wafer fabrication, wafer probe testing, IC
packaging assembly and design, final testing, burn-in, characterization and
reliability testing. More information on Amkor Technology, Inc. is available
from the company's SEC filings and on Amkor's web site, http://www.amkor.com.
Amkor is traded on the Nasdaq Stock Market under the symbol AMKR.
The statements in this news release may contain forward-looking statements -
such as (1) the belief that the market for laminate products is expected to
experience significant growth over the next several years; (2) the expectation
that Amkor will be a significant participant in the market growth for laminate
products; (3) the expectation that Amkor will increase manufacturing margins at
K4; (4) the expectation that K4 will be a significant contributor to Amkor's
EBITDA during 1999; and (5) we will accelerate the ramp up of production at K4
during the next 12 to 24 months - that involve risks and uncertainties that
could cause actual results to differ from anticipated results. Further
information on risk factors that could affect the company's results is detailed
in the company's filings with the Securities and Exchange Commission, including
the Report on Form 10-K for the fiscal year ended December 31, 1998.
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