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SECURITIES AND EXCHANGE COMMISSION
Washington, D.C. 20549
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FORM 8-K
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Current Report Pursuant to Section 13 or 15(d)
Of the Securities Exchange Act of 1934
Date of Report ( date of earliest event reported):
November 28, 2000
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CHIPPAC, INC.
(Exact name of registrant as specified in its charter)
Delaware 333-91641 77-0463048
(State or other jurisdiction (Commission File Number) (IRS Employer
Identification No.) of incorporation)
3151 Coronado Drive
Santa Clara, California 95054
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(Address of principal executive offices)
(Zip Code)
Registrant's telephone number, including area code: (408)426-5900
Not Applicable
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(Former name or former address, if changed since last report)
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ITEM 5. INTENDED ACQUISITION OF VIKO TEST LABS
On November 28, 2000, ChipPAC, Inc., announced its intention to acquire
VIKO Test Labs, a division of VIKO Technology, Inc. VIKO Test Labs is one of the
semiconductor industry's premiere providers of burn-in, electrical test, package
qualification, and failure analysis services. The company, with facilities in
Santa Clara, California, and Austin, Texas, is a division of VIKO Technology,
Inc. which was established over 20 years ago. The specialized resources and
expertise of VIKO Test Labs, combined with ChipPAC's already extensive technical
capabilities, will enhance ChipPAC's support in the development phase of its
customer's products, particularly in the critical early stages of device design
and manufacture planning. The cash and stock transaction is expected to close in
January 2001 and to be accretive to full year 2001 earnings.
This announcement includes forward-looking statements, as that term is
defined in the Private Securities Reform Act of 1995, which are subject to known
and unknown risks and uncertainties that could cause actual results to differ
materially from those expressed or implied by such statements. These forward
looking statements include statements regarding the closing of the acquisition
and accretion to year 2001 earnings, VIKO's resources and expertise, expected
continued demand for ChipPAC's services and products, growth in end markets,
access to new customers, and ability to capitalize on growth in the
semiconductor industry. Some of these risks and uncertainties are detailed in
documents filed with the Securities and Exchange Commission, and include, but
may not necessarily be limited to the possibility that the deal may not close in
January 2001, or at all, fluctuations in customer demand, raw material costs,
exchange rates, timing and success of new product and service introductions,
competitive conditions in the semiconductor foundry industry, the ongoing
quality of ChipPAC and VIKO's services, and the ability of the principal
suppliers to provide materials and equipment on a timely and cost competitive
basis.
SIGNATURES
Pursuant to the requirements of the Securities Exchange Act of 1934,
the registrant has duly caused this report to be signed on its behalf by the
undersigned hereunto duly authorized,
ChipPAC, Inc.
Date: December 1, 2000 By: /s/ Robert Krakauer
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Robert Krakauer
Senior Vice President and
Chief Financial Officer