MOYCO TECHNOLOGIES INC
8-K, 1997-03-06
DENTAL EQUIPMENT & SUPPLIES
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                       SECURITIES AND EXCHANGE COMMISSION
                             Washington, D.C. 20549

                                    FORM 8-K

                                 CURRENT REPORT
                        Pursuant to Section 13 or 15(d)
                                     of the
                        Securities Exchange Act of 1934

                        Date of Report (date of earliest
                         event reported): March 3, 1997

                            Moyco Technologies, Inc.
             ------------------------------------------------------
             (Exact Name of Registrant as specified in its charter)

             Pennsylvania                  0-4123              23-1697233
     ----------------------------        -----------        ----------------
     (State or other jurisdiction        (Commission        (I.R.S. Employer
           of incorporation)             File Number)      Identification No.)

                 200 Commerce Drive, Montgomeryville, PA 18936
- --------------------------------------------------------------------------------

        Registrant's telephone number, including area code: 215-855-4300
                                                           --------------

                                      None
- --------------------------------------------------------------------------------
         (Former name or former address, if changed since last report)

<PAGE>
Item 5.  Other Matters

     On February 27, 1997, the Registrant entered into an exclusive Thirty
Million Dollar ($30,000,000) supply requirements contract with Nanophase
Technologies Corporation of Burr Ridge, Illinois ("Nanophase"). The contract
provides that Nanophase will develop and supply to the Registrant propriety
powder materials, including nanometer-sized (billionths of a meter) alumina and
ceria for purposes of manufacturing chemical mechanical planarization
(polishing) slurries to be used by semiconductor manufacturers.

     The foregoing is a summary of the press release which is attached as
Exhibit A to this report and is incorporated by reference. The foregoing
description does not purport to be complete and is qualified in its entirety by
reference to Exhibit A.

SIGNATURE

     Pursuant to the requirements of the Securities Exchange Act of 1934, the
Registrant has duly caused this report to be signed on its behalf by the
undersigned, hereunto duly authorized.

                                   MOYCO TECHNOLOGIES, INC.


                                   By:_______________________________
                                      Marvin E. Sternberg
                                      President and Chief Executive Officer
                                      and Chairman of the Board

Date: March 3, 1967



                                  Page 2 of 2

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[Moyco Technologies, Inc. Letterhead]

NEWS RELEASE
March 3, 1997
Contact: Joseph Sternberg

                        NANOPHASE TO EXCLUSIVELY PROVIDE
                      MOYCO WITH PROPRIETARY CMP FEEDSTOCK
                         VIA $30 MIL - 5 YEAR AGREEMENT

Moyco Technologies, Inc., (MOYC; Nasdaq) a Montgomeryville, PA manufacturer of
precision abrasives, CMP materials, and professional dental supplies signed an
exclusive supply requirements contract with Nanophase Technologies of Burr
Ridge, Illinois. The blanket purchase order and agreement provides that
Nanophase will develop and supply to Moyco proprietary powder materials
including nanometer-sized (billionths of a meter) alumina and ceria for purposes
of manufacturing (CMP) chemical mechanical planarization (polishing) slurries to
be used by semiconductor manufacturers. The $30,000,000 exclusive requirements
contract allows Moyco to produce proprietary slurries with unmatched operating
characteristics. Calendar year 1997 draw objectives exceed $1,500,000. The
remaining terms and conditions of the Agreement are confidential.

Moyco slurries utilizing the Nanophase nanometer-sized alumina and ceria, with
its nearly spherical particle shape and uniformly small particle size, provide
superior semiconductor polishing results including (i) significantly smoother
surfaces, (ii) more selective removal of excess metal and (iii) easier cleaning
during the manufacturing process compared to competitive slurries with
conventional feedstock materials. These improvements over current semiconductor
manufacturing standards will allow Moyco slurry customers to fabricate smaller
circuits on smoother semiconductor wafer surfaces thereby increasing yields and
computing power.

Moyco responsibilities under this Agreement are to manufacture proprietary
slurries to strict quality specifications, implement the strategic marketing
plan, and technically support and distribute these CMP formulations to
semiconductor fabricators. Moyco manufacturing processes have been documented to
yield technically superior CMP materials which have provided outstanding
performance data. Moyco works closely with semiconductor manufacturers to
customize or optimize each slurry for the unique process of each customer. Under
the arrangement with Nanophase, extremely small particles of nanocrystalline
alumina and ceria will be used as feedstock in proprietary Moyco slurries. Moyco
CMP slurries utilizing the Nanophase materials are to be distributed to,
evaluated by and/or employed in fabrication procedures of leading semiconductor
manufacturers such as Hyundai Corporation, IBM Corporation, Motorola Inc.,
Samsung Group, and Lucent Technologies.















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