UNITED STATES
SECURITIES AND EXCHANGE COMMISSION
Washington, D.C. 20549
FORM 8-K/A
CURRENT REPORT
Pursuant to Section 13 or 15(d) of the
Securities Exchange Act of 1934
June 11, 1998 (June 10, 1998)
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Date of Report (Date of earliest event reported)
MERRIMAC INDUSTRIES, INC.
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(Exact name of registrant as specified in its charter)
New Jersey 0-11201 22-1642321
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(State or other jurisdiction (Commission (IRS Employer
of incorporation) File Number) Identification No.)
41 Fairfield Place, West Caldwell, New Jersey 07006-6287
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(Address of principal executive offices) (Zip Code)
Registrant's telephone number, including area code (973) 575-1300
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<PAGE>
INFORMATION TO BE INCLUDED IN THE REPORT
Item 5. Other Events.
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Reference is made to Registrant's press release dated June 10, 1998
filed as Exhibit 20 to Registrant's Current Report on Form 8-K filed June 10,
1998. Due to typographical errors, four references to MMFM(TM), a trademark of
Registrant, incorrectly appeared as MMFMTM in the press release attached as
Exhibit 20. A corrected copy of Registrant's press release dated June 10, 1998
is filed herewith as Exhibit 20 and is incorporated herein by reference.
Item 7. Financial Statements and Exhibits.
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(c) Exhibits.
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20. Press Release of Registrant dated June 10, 1998.
SIGNATURE
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Pursuant to the requirements of the Securities Exchange Act of 1934, as
amended, the Registrant has duly caused this amended Current Report to be signed
on its behalf by the undersigned thereunto duly authorized.
MERRIMAC INDUSTRIES, INC.
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(Registrant)
By /s/ Robert V. Condon
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Robert V. Condon
Vice President, Finance and
Chief Financial Officer
Date: June 11, 1998
<PAGE>
EXHIBIT INDEX
Sequentially
Exhibit Numbered Page
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20. Press Release of Registrant dated
June 10, 1998.
Exhibit 20
Multi-Mix(TM) Microtechnology: A New 3-Dimensional Microwave
Packaging Technology Introduced by Merrimac Industries
West Caldwell, N.J., June 10, 1998: Merrimac Industries, Inc. announces today,
from the International Microwave Symposium in Baltimore, Maryland, a description
of its innovative Multi-Mix(TM) packaging technology for commercial and
military microwave components and subsystems. Surpassing conventional
technology, the patent-pending 3-D, Multi-Mix(TM) method is a unique process
based on fluoropolymer composite substrates, for application to microwave,
multilayer integrated circuits and micro-multifunction modules (MMFM(TM))
technology. Multi-Mix(TM) microtechnology creates value, for example, by
enabling filters, multiplexers, MMICs, and other active and passive circuits to
be packaged individually or cascaded into supercomponents for
mixer/pre-amplifiers, vector modulators, complex antenna feed-distribution
networks, phased array beamformers or comparators for monopulse receiving
systems.
"Multi-Mix(TM) microtechnology is like an ASIC for RF/Microwave. This enabling
technology will allow us to further penetrate the $18 billion RF/Microwave
market by opening up new segments of opportunity. This is an innovative approach
to packaging and will help Merrimac achieve its Goal of Profitable Growth," said
Mason N. Carter, Chairman and CEO.
Mr. Carter continued: "By integrating a variety of different types of
functionality, including MMICs, Merrimac can provide the Total Integrated
Packaging Solution that the marketplace demands."
By emphasizing the features of Multi-Mix(TM) microtechnology Merrimac has
adopted a key account marketing focus on new business applications, together
with the establishment of coordinated standards for certified suppliers, thus
enabling an accelerated time to market of high value products. Initial customer
reaction indicates a level of positive acceptance due to the high level of
integration coupled with reduced cycle time, size and weight reduction, and
low-cost manufacturing that is suitable for high or low volume production. The
most notable opportunities benefiting from the Multi-Mix(TM) packaging
technology are replacements for existing coaxial and waveguide microwave
component technologies. However, more recent system designs using conventional
stripline and microstrip hardware have realized the advantages of Multi-Mix(TM)
microtechnology, combining functions to reduce overall size and weight, and
improve reliability.
The novel packaging technology employs a platform strategy, modular architecture
that integrates mathematical, electromagnetic, thermal, and mechanical modeling
capabilities on contemporary personal computers, permitting total analysis of
the microwave enclosure to be performed, prior to actual hardware fabrication.
Merrimac has implemented a software toolset to provide customer access to
MMFM(TM) S-parameter data, thus permitting prediction of system performance
while on-line.
Multi-Mix(TM) Process
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The Multi-Mix(TM) process, patent pending, begins with commercially available
polytetrafluoroethylene (PTFE) composite, copper-clad laminate material having
inherently low loss and low dielectric constant microwave properties. The fusion
bonding of multilayer structures provides a homogeneous dielectric medium for
superior electrical performance at microwave frequencies. No sheet adhesives or
prepregs are required. The bonded layers may incorporate embedded semiconductor
devices, MMICs, etched resistors, passive circuit elements and plated-through
via holes, to form a 3-dimensional subsystem enclosure that requires no further
packaging. The MMFM(TM) structure is a total integrated packaging solution. The
small footprint, low-profile unit is of rugged, lightweight construction, and
the external interface, surface-mount format is compatible with connections to
microstrip or coplanar waveguide planar transmission lines.
A low Z-axis coefficient of thermal expansion (CTE), close to that of copper,
ensures excellent reliability of plated-through holes. Controlled XY-plane
thermal expansion, together with a low modulus, afford excellent reliability of
surface-mounted devices in the most severe thermal cycling and thermal shock
environments. Furthermore, a low and uniform thermal coefficient of dielectric
constant coupled with the materials low CTE result in consistent electrical
performance over a wide operating temperature range.
Complex microwave circuit patterns and transmission-line geometries may be
chemically photoetched on the copper, maintaining dimensional tolerances of
0.0030 +/- 0.0005-inch. Incorporating thin metal film etched resistors can be
routinely accomplished with accuracies of 5% that allow power dissipation
greater than discrete chips. Indexing holes for layer to layer alignment in
assembly are precision machined or drilled into each board. Layer to layer
plated-through holes may be realized with a minimum diameter of 0.005-inch and
typical aspect ratios of 20:1. The process capability will be certifiable to ISO
9001, MIL-P-55110 and IPC-HF-318A.
Active device attachments may be embedded in cover layer cavities to provide
environmental protection and allow pre-cap inspection and test. Pick and place
of discrete components are to be demonstrated on array panels up to 18 x 24
inches, with the potential to accommodate flip chip and ball grid array
packages. Operating-frequency capability of current circuit developments has
concentrated on L-band through X-band in the near term, with extension to
Ka-band slated for the near future.
In fabricating a bonded multilayer assembly, the stacked layers are placed in an
aluminum plate alignment fixture to which carefully controlled, elevated
pressure and temperature is applied to meet the substrate fusion bonding
requirements. After cooling, edge plating for EMI shielding and ground plane
integrity is performed. Finish platings for environmental protection include
immersion tin, fused tin/lead and nickel/gold.
Value/Benefits
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The platform strategy of MMFM(TM) modeling and simulation reduces engineering
cycle time, lowers NRE and enables the Multi-Mix(TM) product to be an
economical solution for new circuit designs. Some of the perceived benefits of
the technology process include:
o High-Density Circuit Integration
o Improved Performance
o Improved Quality
o Size and Weight Reduction
o Reduced Cost
o Improved Yield
o Increased Reliability
o Potential for Millimeter-Wave Applications
On-Line Co-Design(TM) System
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The Multi-Mix(TM) module architecture utilizes a structural template which
overlays outlines and commonizes interconnection paths. Process steps are
programmed parametrically for each layer of a multilayer microwave assembly.
Actual test data for functional layer blocks are stored in a pre-designed
library. Complete design concepts from schematic to circuit layout may be
performed within a single operating environment. Functional components may be
inserted utilizing "drag-and-drop" techniques from graphical palettes for
insertion into system designs which can be tailored for a specific application.
Merrimac's library of validated functional modules is augmented by model data
for over 90,000 active and passive devices.
"Our On-Line Co-Design(TM) system enables Merrimac's key account customers to
dial-in through the Internet to access design libraries and to actually
co-design their products by sharing MMFM(TM) design tools and S-parameter data,"
said Jim Logothetis, Vice President of Advanced Technology. "The Multi-Mix(TM)
approach offers flexible designs and opens up a variety of potential new
applications where size, weight, and cost are the critical issues," continued
Mr. Logothetis.
Applications
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There are exciting commercial applications where RF/Microwave technology has
found widespread use and acceptance. The potential of current telecommunication
and wireless system installations including cellular radio, personal
communication (PCS), and local area networks (LANs) are only beginning to be
realized. Cable television companies are competing with communication system
providers for market share in offering virtually unlimited bandwidth in the
transmission of data, voice, and video information over RF carriers. Base
station and mobile receiver terminals are candidates for Multi-Mix(TM)
packaging technology. The number of satellite constellations in orbit or
proposed for deployment within the next decade are expanding almost daily and
the need for weight reduction is paramount. Direct broadcast satellite
transmission of television signals is already a major commercial market around
the world, and the potential number of consumer receiver terminals in the
undeveloped countries on earth is enormous.
The essential military applications that will benefit from Multi-Mix(TM)
innovations are the microwave systems on airborne and space-based radar and
electronic warfare platforms. Reduced size and weight translates directly into
increased payload and performance. Many millimeter-wave smart munition sensors
should be candidates for this packaging approach as well.
Other Applications
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A Japanese consortium of Toshiba Corp., Toyota Motor Corp., and Fujitsu recently
announced a joint digital-satellite-broadcast project targeting 70 million
automobiles in this island nation for personal mobile receivers. Using the 2.6
GHz S-band frequency allocation, the system will deliver TV-quality video and
CD-quality audio in addition to various types of data. The development of
low-cost planar, steerable phased arrays for vehicle rooftop installation has
been underway in Japan for almost a decade. The microstrip patch antenna,
feed-distribution network and receiver front end are proposed as a multilayer
board implementation. This is one of several planned intelligent transportation
system applications (ITS) where Multi-Mix(TM) microtechnology could have a
role.
The application of Multi-Mix(TM) technology to the computer industry is perhaps
the most exciting and difficult market for which to define requirements. Clock
speeds are already approaching gigabit data rates and a satisfactory solution to
the high-frequency packaging problem has yet to be addressed. Current approaches
have utilized existing multi-pin hybrid and multi-chip modules, which must
incorporate signal integrity circuitry to compensate for delays, impedance
mismatches, crosstalk and multiple reflections attributable to interface
problems. Achieving high performance, low error-rate, gigabit performance will
require a radical departure from present motherboard designs and pin grid array
packages, especially if computers are expected to communicate using the wireless
and photonic technologies of the future.
Mr. Carter said: "Globally, key account customers continue to rationalize their
business, restructure and reconsider their core competencies. There is a growing
trend to outsource the design and manufacture of their multi-functional modules
and subsystems. Multi-Mix(TM) microtechnology provides a cost effective
solution to reduce size and weight, improve performance, and service support
required by our customers."
Certain statements in this news release are forward-looking statements based on
current management expectations and are subject to risks and uncertainties.
Factors that could cause future results to differ from these expectations
include general economic and industry conditions, competitive products and
pricing pressures, risks relating to governmental regulatory actions in
communications and defense programs, and inventory risks due to technological
innovation. Additional factors to which the Company's performance is subject are
described in the Company's reports filed from time to time with the Securities
and Exchange Commission.
Merrimac Industries, Inc., with locations in West Caldwell, NJ and San Jose,
Costa Rica, has approximately 170 co-workers in the design and manufacture of
high-performance components and subsystems for communications, defense and
aerospace applications. Merrimac (MRM) is listed on the American Stock Exchange.
Contact: Mason N. Carter Fax: (973) 882-5989
Chairman and CEO E-mail: [email protected]
Phone: (973) 575-1300, Ext. 202 Internet: www.merrimacind.com
Note: Merrimac Industries, Inc. news releases are available in fax form by
calling Company News On-Call. Dial (800) 758-5804, ext. 567525; or is available
on the Internet at http://www.prnewswire.com.
