<PAGE>
Filed Pursuant to Rule 424(b)(4)
Registration No.: 333-92431
5,250,000 Shares
[LOGO OF APPLIED MICRO CIRCUITS CORPORATION]
Common Stock
------------
Our common stock is listed on The Nasdaq Stock Market's National Market
under the symbol "AMCC." On January 13, 2000, the last reported sale price for
our common stock was $146.4375 per share.
The underwriters have an option to purchase a maximum of 752,271 additional
shares from us to cover over-allotments of shares.
INVESTING IN OUR COMMON STOCK INVOLVES RISKS. SEE "RISK FACTORS" ON PAGE 7.
<TABLE>
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UNDERWRITING
PRICE TO DISCOUNTS AND PROCEEDS TO
PUBLIC COMMISSIONS AMCC
------------ ------------- ------------
<S> <C> <C> <C>
Per Share.................................. $142.00 $6.035 $135.965
Total...................................... $745,500,000 $31,683,750 $713,816,250
</TABLE>
Delivery of the shares of common stock will be made on or about January 20,
2000.
Neither the Securities and Exchange Commission nor any state securities
commission has approved or disapproved of these securities, or determined if
this prospectus is truthful or complete. Any representation to the contrary is
a criminal offense.
CREDIT SUISSE FIRST BOSTON
SALOMON SMITH BARNEY
SG COWEN
The date of this prospectus is January 13, 2000.
<PAGE>
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TABLE OF CONTENTS
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Prospectus Summary......................................................... 3
Risk Factors............................................................... 7
Use of Proceeds............................................................ 18
Underwriting............................................................... 19
Notice to Canadian Residents............................................... 21
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Page
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Legal Matters.............................................................. 22
Experts.................................................................... 22
Where You Can Find More Information........................................ 22
Disclosure Regarding Forward-Looking Statements............................ 23
</TABLE>
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YOU SHOULD RELY ONLY ON INFORMATION CONTAINED IN THIS DOCUMENT OR TO WHICH
WE HAVE REFERRED YOU. WE HAVE NOT AUTHORIZED ANYONE TO PROVIDE YOU WITH
INFORMATION THAT IS DIFFERENT. THIS DOCUMENT MAY ONLY BE USED WHERE IT IS
LEGAL TO SELL THESE SECURITIES. THE INFORMATION IN THIS DOCUMENT MAY ONLY BE
ACCURATE ON THE DATE OF THIS DOCUMENT.
<PAGE>
PROSPECTUS SUMMARY
You should read the following summary together with the more detailed
information in this prospectus concerning us and the common stock being sold in
this offering and the documents incorporated by reference in this prospectus.
Because this is only a summary, you should carefully read the entire prospectus
before you invest in our common stock, especially the risks described under
"Risk Factors." Unless otherwise stated, information in this prospectus assumes
that the underwriters' over-allotment option to purchase an additional 752,271
shares of common stock is not exercised.
Unless the context requires otherwise, references in this prospectus to
"we," "us," "our" and "AMCC" refer to Applied Micro Circuits Corporation and
its wholly owned subsidiaries.
APPLIED MICRO CIRCUITS CORPORATION
AMCC designs, develops, manufactures and markets high-performance, high-
bandwidth silicon solutions for the world's optical networks. We utilize a
combination of high-frequency analog, mixed-signal and digital design expertise
coupled with system-level knowledge and multiple silicon process technologies
to offer integrated circuit, or IC, products that enable the transport of voice
and data over fiber optic networks. Our customers include leading
communications equipment manufacturers such as Alcatel, Ciena, Cisco, Lucent,
Marconi Communications and Nortel as well as emerging communications systems
providers such as Cerent (recently acquired by Cisco), Juniper Networks,
Monterey Networks (recently acquired by Cisco), Nexabit (recently acquired by
Lucent) and Sycamore Networks.
Over the past decade, the volume of high speed data traffic across the
public communications network has grown significantly, reflecting the
increasing demand for Internet access, electronic mail communications,
electronic commerce, remote access by telecommuters and other network data
transmission services. Ryan, Hankin & Kent, a market research and consulting
firm, projects that Internet and other data traffic requirements will increase
by over 4000% between 1999 and 2003. The volume and complexity of transmitted
data has led to the increasing deployment of high-speed communications
technologies such as DWDM, SONET/SDH and ATM. Dense wave division multiplexing,
or DWDM, is a technology for increasing the bandwidth in fiber optic networks.
The synchronous optical network, or SONET, standard in North America and Japan,
and the synchronous digital hierarchy, or SDH, standard in the rest of the
world, are the standards for the transmission of signals over optical fiber.
Asynchronous transfer mode, or ATM, a transmission protocol complementary to
SONET/SDH, is optimized to handle the multiple protocols existing in today's
networks.
Enterprise networks are also rapidly being upgraded with higher bandwidth
technologies, such as Gigabit Ethernet. In addition, the Fibre Channel
standard, which facilitates data transmission at rates exceeding one gigabit
per second, is a scalable method for achieving high-speed, high-volume data
transfer among workstations, mainframes, data storage devices and other
peripherals.
Our objective is to be the premier supplier of high-bandwidth silicon ICs
for the world's optical networks. Our strategies for achieving this objective
include:
. Focusing on high-growth, fiber optic-based network markets;
. Providing complete system solutions to our customers;
. Integrating higher levels of functionality into our semiconductor
products; and
. Leveraging expertise in multiple silicon-process technologies to provide
cost-effective, optimized solutions.
3
<PAGE>
Our products target the SONET/SDH, ATM, Gigabit Ethernet and Fibre Channel
semiconductor markets. In addition, we recently introduced silicon ICs targeted
for DWDM systems. We provide our customers with complete silicon IC solutions
ranging from physical media dependent devices such as laser drivers and
physical layer products such as transceivers to overhead processor products
such as framers and mappers. Our products span data rates from OC-3, or 155
megabits per second, to OC-192, or 10 gigabits per second. We also supply
silicon ICs for the automated test equipment, or ATE, high-speed computing and
military markets.
We manufacture some products at our silicon wafer fabrication facility in
San Diego, California. We also utilize outside semiconductor wafer fabrication
facilities for the production of products designed on CMOS processes. Recently,
we have introduced several new products using IBM's silicon germanium BiCMOS
process.
Our principal executive offices are located at 6290 Sequence Drive, San
Diego, CA 92121, and our telephone number is (858) 450-9333.
THE OFFERING
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<S> <C>
Common Stock Offered....................... 5,250,000 shares
Common Stock Outstanding after this
Offering.................................. 59,427,787 shares(1)
Use of Proceeds............................ Working capital, general corporate
purposes and potentially for
acquisition opportunities that may
arise in the future. See "Use of
Proceeds."
Nasdaq National Market Symbol.............. AMCC
</TABLE>
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(1) Based upon shares outstanding as of January 7, 2000 (assuming no exercise
of options after January 7, 2000). Excludes 16,268,330 shares of common
stock reserved for issuance pursuant to Applied Micro Circuits
Corporation's employee benefit plans, under which options to purchase
7,644,584 shares of common stock were outstanding as of January 7, 2000.
4
<PAGE>
SUMMARY CONSOLIDATED FINANCIAL DATA
(IN THOUSANDS, EXCEPT PER SHARE DATA)
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NINE MONTHS
ENDED
YEAR ENDED MARCH 31, DECEMBER 31,
------------------------------------------- ----------------
1995 1996 1997 1998 1999 1998 1999
------- ------- ------- ------- -------- ------- --------
(UNAUDITED)
<S> <C> <C> <C> <C> <C> <C> <C>
CONSOLIDATED STATEMENTS
OF OPERATIONS DATA:
Net revenues............ $46,950 $50,264 $57,468 $76,618 $105,000 $76,258 $115,303
Cost of revenues........ 27,513 34,169 30,057 34,321 37,937 28,415 34,818
------- ------- ------- ------- -------- ------- --------
Gross profit............ 19,437 16,095 27,411 42,297 67,063 47,843 80,485
Operating expenses:
Research and
development.......... 10,108 8,283 7,870 13,268 22,472 16,194 21,829
Selling, general and
administrative....... 10,112 11,232 12,537 14,278 18,325 13,033 19,178
Merger-related costs.. -- -- -- -- 2,350 -- --
------- ------- ------- ------- -------- ------- --------
Total operating
expenses........... 20,220 19,515 20,407 27,546 43,147 29,227 41,007
------- ------- ------- ------- -------- ------- --------
Operating income
(loss)................. (783) (3,420) 7,004 14,751 23,916 18,616 39,478
Interest income
(expense), net......... (358) (242) (29) 871 3,450 2,613 3,114
------- ------- ------- ------- -------- ------- --------
Income (loss) before
income taxes........... (1,141) (3,662) 6,975 15,622 27,366 21,229 42,592
Provision (benefit) for
income taxes........... (70) 32 659 406 10,233 7,457 14,597
------- ------- ------- ------- -------- ------- --------
Net income (loss)....... $(1,071) $(3,694) $ 6,316 $15,216 $ 17,133 $13,772 $ 27,995
======= ======= ======= ======= ======== ======= ========
Basic earnings (loss)
per share (1):
Earnings (loss) per
share................ $ (0.12) $ (0.40) $ 0.63 $ 0.72 $ 0.35 $ 0.28 $ 0.53
======= ======= ======= ======= ======== ======= ========
Shares used in
calculating basic
earnings (loss) per
share................ 8,730 9,132 10,012 21,188 49,028 48,568 52,364
======= ======= ======= ======= ======== ======= ========
Diluted earnings (loss)
per share (1):
Earnings (loss) per
share................ $ (0.03) $ (0.11) $ 0.18 $ 0.37 $ 0.31 $ 0.25 $ 0.48
======= ======= ======= ======= ======== ======= ========
Shares used in
calculating diluted
earnings (loss) per
share................ 34,388 34,788 35,814 40,588 54,860 54,396 57,930
======= ======= ======= ======= ======== ======= ========
</TABLE>
<TABLE>
<CAPTION>
DECEMBER 31, 1999
------------------------
ACTUAL AS ADJUSTED (2)
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(UNAUDITED)
<S> <C> <C>
CONSOLIDATED BALANCE SHEET DATA:
Working capital...................................... $128,948 $842,364
Total assets......................................... 192,383 905,799
Long-term debt and capital lease obligations, less
current portion..................................... 5,830 5,830
Total stockholders' equity........................... 160,474 873,890
</TABLE>
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(1) Adjusted to reflect the two-for-one stock split effected on September 9,
1999. All share and per share information has been restated to reflect the
split.
(2) Adjusted to give effect to the sale by us of 5,250,000 shares of common
stock in this offering after deducting the underwriting discounts and
commissions and estimated offering expenses payable by us.
5
<PAGE>
QUARTERLY CONSOLIDATED FINANCIAL DATA
The following table sets forth consolidated statements of operations for
each of our last six quarters. This quarterly information is unaudited and has
been prepared on the same basis as the annual consolidated financial
statements. In our opinion, this quarterly information reflects all
adjustments, consisting only of normal recurring adjustments, necessary for a
fair presentation of the information for the periods presented. The operating
results for any quarter are not necessarily indicative of results for any
future period.
<TABLE>
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QUARTER ENDED(1)
--------------------------------------------------------
SEPT. 30, DEC. 31, MARCH 31, JUNE 30, SEPT. 30, DEC. 31,
1998 1998 1999 1999 1999 1999
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<S> <C> <C> <C> <C> <C> <C>
Net revenues............ $25,472 $26,972 $28,742 $31,643 $37,898 $45,762
Cost of revenues........ 9,347 9,669 9,522 10,283 11,326 13,209
------- ------- ------- ------- ------- -------
Gross profit............ 16,125 17,303 19,220 21,360 26,572 32,553
Operating expenses:
Research and
development............ 5,454 5,847 6,278 6,354 7,194 8,281
Selling, general and
administrative......... 4,296 4,573 5,292 5,569 6,548 7,061
Merger-related costs.... -- -- 2,350 -- -- --
------- ------- ------- ------- ------- -------
Total operating
expenses............... 9,750 10,420 13,920 11,923 13,742 15,342
------- ------- ------- ------- ------- -------
Operating income........ 6,375 6,883 5,300 9,437 12,830 17,211
Interest income, net.... 877 883 837 884 1,005 1,225
------- ------- ------- ------- ------- -------
Income before income
taxes.................. 7,252 7,766 6,137 10,321 13,835 18,436
Provision for income
taxes.................. 2,584 2,646 2,776 3,535 4,738 6,324
------- ------- ------- ------- ------- -------
Net income.............. $ 4,668 $ 5,120 $ 3,361 $ 6,786 $ 9,097 $12,112
======= ======= ======= ======= ======= =======
Diluted earnings per
share (2).............. $ 0.09 $ 0.09 $ 0.06 $ 0.12 $ 0.16 $ 0.21
======= ======= ======= ======= ======= =======
Shares used in
calculating diluted
earnings per share
(2).................... 54,592 55,238 56,280 57,056 57,932 58,804
======= ======= ======= ======= ======= =======
</TABLE>
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(1) The quarterly information for the quarters ended September 30, 1998 and
December 31, 1998 have been restated from the information presented in our
quarterly reports on Form 10-Q to reflect the acquisition of Cimaron
completed on March 17, 1999 as if the companies had been combined for all
periods presented.
(2) Adjusted to reflect the two-for-one stock split effected on September 9,
1999. All share and per share information has been restated to reflect the
split.
6
<PAGE>
RISK FACTORS
This offering involves a high degree of risk. You should carefully consider
the following information about these risks, as well as the other information
contained or incorporated by reference in this prospectus, before you decide to
buy any of our common stock.
OUR OPERATING RESULTS MAY FLUCTUATE BECAUSE OF A NUMBER OF FACTORS, MANY OF
WHICH ARE BEYOND OUR CONTROL.
If our operating results are below the expectations of public market
analysts or investors, then the market price of our common stock could decline.
Some of the factors that affect our quarterly and annual results, but which are
difficult to control or predict are:
. the reduction, rescheduling or cancellation of orders by customers,
whether as a result of stockpiling of our products or otherwise;
. fluctuations in the timing and amount of customer requests for product
shipments;
. fluctuations in manufacturing output, yields and inventory levels;
. changes in the mix of products that our customers buy;
. our ability to introduce new products and technologies on a timely
basis;
. the announcement or introduction of products and technologies by our
competitors;
. the availability of external foundry capacity, purchased parts and raw
materials;
. competitive pressures on selling prices;
. the amounts and timing of costs associated with warranties and product
returns;
. the amounts and timing of investments in research and development;
. market acceptance of our products and of our customers' products;
. the timing of depreciation and other expenses that we expect to incur in
connection with any expansion of our manufacturing capacity;
. costs associated with acquisitions and the integration of acquired
operations;
. costs associated with compliance with applicable environmental
regulations or remediation;
. costs associated with litigation, including without limitation,
litigation or settlements relating to the use or ownership of
intellectual property;
. the ability of our customers to obtain components from their other
suppliers;
. general communications systems industry and semiconductor industry
conditions; and
. general economic conditions.
Our expense levels are relatively fixed and are based, in part, on our
expectations of future revenues. We are continuing to increase our operating
expenses for additional manufacturing capacity, personnel and new product
development. However, we have limited ability to reduce expenses quickly in
response to any revenue shortfalls. Consequently, our business, financial
condition and operating results would be harmed if we do not achieve increased
revenues. We can have revenue shortfalls for a variety of reasons, including:
. significant pricing pressures that occur because of declines in average
selling prices over the life of a product;
. sudden shortages of raw materials or production capacity constraints
that lead our suppliers to allocate available supplies or capacity to
customers with resources greater than us and, in turn, interrupt our
ability to meet our production obligations;
. fabrication, test or assembly capacity constraints for internally
manufactured devices which interrupt our ability to meet our production
obligations; and
. the reduction, rescheduling or cancellation of customer orders.
7
<PAGE>
In addition, our business is characterized by short-term orders and shipment
schedules, and customer orders typically can be canceled or rescheduled without
significant penalty to the customer. Because we do not have substantial
noncancellable backlog, we typically plan our production and inventory levels
based on internal forecasts of customer demand which are highly unpredictable
and can fluctuate substantially. In addition, from time to time, in response to
anticipated long lead times to obtain inventory and materials from our outside
suppliers and foundries, we may order materials in advance of anticipated
customer demand. This advance ordering might result in excess inventory levels
or unanticipated inventory write-downs if expected orders fail to materialize,
or other factors render the customers' products less marketable. Further, we
currently anticipate that an increasing portion of our revenues in future
periods will be derived from sales of application-specific standard products,
or ASSPs, as compared to application-specific integrated circuits, or ASICs.
Customer orders for ASSPs typically have shorter lead times than orders for
ASICs, which may make it increasingly difficult for us to predict revenues and
inventory levels and adjust production appropriately. If we are unable to plan
inventory and production levels effectively, our business, financial condition
and operating results could be materially harmed.
IF WE DO NOT SUCCESSFULLY EXPAND OUR MANUFACTURING CAPACITY ON TIME, WE MAY
FACE SERIOUS CAPACITY CONSTRAINTS.
We currently manufacture a majority of our IC products at our wafer
fabrication facility located in San Diego, California. We believe that we will
be able to satisfy our production needs from this fabrication facility through
the end of the first quarter of fiscal 2001, although this date may vary
depending on, among other things, our rate of growth. We will be required to
hire, train and manage additional production personnel in order to increase
production capacity as scheduled. To expand our capacity to fabricate wafers
using a bipolar process, we entered into a foundry agreement with a third party
wafer fabrication facility. We will have to install our fabrication processes
at this foundry, qualify our processes at this foundry and then ramp production
volumes at this foundry. If we cannot expand our capacity on a timely basis, we
could experience significant capacity constraints that could render us unable
to meet customer demand or force us to spend more to meet demand. In addition,
the depreciation and other expenses that we will incur in connection with the
expansion of our manufacturing capacity may harm our gross margin in any future
fiscal period.
We are exploring alternatives for the further expansion of our manufacturing
capacity which would likely occur after fiscal year 2001, including:
. expanding our current wafer fabrication facility;
. entering into strategic relationships to obtain additional capacity;
. building a new wafer fabrication facility; or
. purchasing a wafer fabrication facility.
Any of these alternatives could require a significant investment by us.
There can be no assurance that any of the alternatives for expansion of our
manufacturing capacity will be available on a timely basis or that we will be
able to manage our growth and effectively integrate our expansion into our
current operations.
The cost of any investment we may have to make to expand our manufacturing
capacity is expected to be funded through a combination of available cash, cash
equivalents and short-term investments, cash from operations and additional
debt, lease or equity financing. We may not be able to obtain the additional
financing necessary to fund the construction and completion of the new
manufacturing facility.
Expanding our current wafer fabrication facility, building a new wafer
fabrication facility or purchasing a wafer fabrication facility entails
significant risks, including:
. shortages of materials and skilled labor;
. unforeseen environmental or engineering problems;
8
<PAGE>
. work stoppages;
. weather interferences; and
. unanticipated cost increases.
Any one of these risks could have a material adverse effect on the building,
equipping and production start-up of a new facility or the expansion of our
existing facility. In addition, unexpected changes or concessions required by
local, state or federal regulatory agencies with respect to necessary licenses,
land use permits, site approvals and building permits could involve significant
additional costs and delay the scheduled opening of the expansion or new
facility and could reduce our anticipated revenues. Also, the timing of
commencement of operation of our expanded or new facility will depend upon the
availability, timely delivery, successful installation and testing of the
necessary process equipment. As a result of the foregoing and other factors,
our expanded or new facility may not be completed and in volume production
within its current budget or within the period currently scheduled.
Furthermore, we may be unable to achieve adequate manufacturing yields in our
expanded or new facility in a timely manner, and our revenues may not increase
commensurate with the anticipated increase in manufacturing capacity associated
with the expanded or new facility. In addition, in the future, we may be
required for competitive reasons to make capital investments in the existing
wafer fabrication facility or to accelerate the timing of the construction of a
new wafer fabrication facility in order to expedite the manufacture of products
based on more advanced manufacturing processes.
OUR OPERATING RESULTS SUBSTANTIALLY DEPEND ON MANUFACTURING OUTPUT AND YIELDS,
WHICH MAY NOT MEET EXPECTATIONS.
We manufacture most of our semiconductors at our San Diego fabrication
facility. Manufacturing semiconductors requires manufacturing tools which are
unique to each product being produced. If one of these unique manufacturing
tools was damaged or destroyed, then our ability to manufacture the related
product would be impaired and our business would suffer until the tool were
repaired or replaced.
Our yields decline whenever a substantial percentage of wafers must be
rejected or a significant number of die on each wafer are nonfunctional. Such
declines can be caused by many factors, including minute levels of contaminants
in the manufacturing environment, design issues, defects in masks used to print
circuits on a wafer and difficulties in the fabrication process. The ongoing
expansion of the manufacturing capacity of our existing wafer fabrication
facility could increase the risk of contaminants in the facility. In addition,
many of these problems are difficult to diagnose, and are time consuming and
expensive to remedy and can result in shipment delays.
Difficulties associated with adapting our technology and product design to
the proprietary process technology and design rules of outside foundries also
can lead to reduced yields. The process technology of an outside foundry is
typically proprietary to the manufacturer. Since low yields may result from
either design or process technology failures, yield problems may not be
effectively determined or resolved until an actual product exists that can be
analyzed and tested to identify process sensitivities relating to the design
rules that are used. As a result, yield problems may not be identified until
well into the production process, and resolution of yield problems may require
cooperation between ourselves and our manufacturer. In some cases this risk
could be compounded by the offshore location of certain of our manufacturers,
increasing the effort and time required to identify, communicate and resolve
manufacturing yield problems. In addition, manufacturing defects which we do
not discover during the manufacturing or testing process may lead to costly
product recalls.
We estimate yields per wafer in order to estimate the value of inventory. If
yields are materially different than projected, work-in-process inventory may
need to be revalued. We have in the past, and may in the future from time to
time, take inventory write-downs as a result of decreases in manufacturing
yields. We may suffer periodic yield problems in connection with new or
existing products or in connection with the commencement of production in a new
or expanded manufacturing facility.
9
<PAGE>
Because the majority of our costs of manufacturing are relatively fixed,
yield decreases can result in substantially higher unit costs and may result in
reduced gross profit and net income. In addition, yield decreases could force
us to allocate available product supply among customers, which could
potentially harm customer relationships.
A DISRUPTION IN THE MANUFACTURING CAPABILITIES OF OUR OUTSIDE FOUNDRIES WOULD
NEGATIVELY IMPACT THE PRODUCTION OF CERTAIN OF OUR PRODUCTS.
We rely on outside foundries for the manufacture of certain products,
including all of our products designed on CMOS processes and silicon germanium
processes. We generally do not have long-term wafer supply agreements with our
outside foundries that guarantee wafer or product quantities, prices or
delivery lead times. The outside foundries manufacture our products on a
purchase order basis. We expect that, for the foreseeable future, a single
foundry will manufacture certain products. Because establishing relationships
and ramping production with new outside foundries takes several months to over
a year, there is no readily available alternative source of supply for these
products. A manufacturing disruption experienced by one or more of our outside
foundries would impact the production of certain of our products for a
substantial period of time. Furthermore, the transition to the next generation
of manufacturing technologies at one or more of our outside foundries could be
unsuccessful or delayed.
OUR DEPENDENCE ON THIRD-PARTY MANUFACTURING AND SUPPLY RELATIONSHIPS INCREASES
THE RISK THAT WE WILL NOT HAVE AN ADEQUATE SUPPLY OF PRODUCTS TO MEET DEMAND OR
THAT OUR COST OF MATERIALS WILL BE HIGHER THAN EXPECTED.
The risks associated with our dependence upon third parties which
manufacture, assemble or package certain of our products, include:
. reduced control over delivery schedules and quality;
. risks of inadequate manufacturing yields and excessive costs;
. the potential lack of adequate capacity during periods of excess demand;
. difficulties selecting and integrating new subcontractors;
. limited warranties on wafers or products supplied to us;
. potential increases in prices; and
. potential misappropriation of our intellectual property.
These risks may lead to increased costs or delay product delivery, which
would harm our profitability and customer relationships. We may encounter
similar risks if we hire subcontractors to test our products in the future.
IF THE SUBCONTRACTORS WE USE TO MANUFACTURE OUR WAFERS OR PRODUCTS DISCONTINUE
THE MANUFACTURING PROCESSES NEEDED TO MEET OUR DEMANDS, OR FAIL TO UPGRADE
THEIR TECHNOLOGIES NEEDED TO MANUFACTURE OUR PRODUCTS, WE MAY FACE PRODUCTION
DELAYS.
Our wafer and product requirements typically represent a very small portion
of the total production of the third-party foundries. As a result, we are
subject to the risk that a producer will cease production on an older or lower-
volume process that it uses to produce our parts. Additionally, we cannot be
certain our external foundries will continue to devote resources to the
production of our products or continue to advance the process design
technologies on which the manufacturing of our products are based. Each of
these events could increase our costs and harm our ability to deliver our
products on time.
Due to an industry transition to six-inch and eight-inch wafer fabrication
facilities, there is a limited number of suppliers of the four-inch wafers that
we use to build products in our existing manufacturing facility,
10
<PAGE>
and we rely on a single supplier for these wafers. Although we believe that we
will have sufficient access to four-inch wafers to support production in our
existing fabrication facility for the foreseeable future, we cannot be certain
that our current supplier will continue to supply us with four-inch wafers on a
long-term basis. Additionally, the availability of manufacturing equipment
needed for a four-inch process is limited, and certain new equipment required
for more advanced processes may not be available for a four-inch process.
OUR FUTURE SUCCESS DEPENDS IN PART ON THE CONTINUED SERVICE OF OUR KEY DESIGN
ENGINEERING, SALES, MARKETING AND EXECUTIVE PERSONNEL AND OUR ABILITY TO
IDENTIFY, HIRE AND RETAIN ADDITIONAL PERSONNEL.
There is intense competition for qualified personnel in the semiconductor
industry, in particular design engineers, and we may not be able to continue to
attract and train engineers or other qualified personnel necessary for the
development of our business or to replace engineers or other qualified
personnel who may leave our employ in the future. Our anticipated growth is
expected to place increased demands on our resources and will likely require
the addition of new management personnel and the development of additional
expertise by existing management personnel. Loss of the services of, or failure
to recruit, key design engineers or other technical and management personnel
could be significantly detrimental to our product and process development
programs.
PERIODS OF RAPID GROWTH AND EXPANSION COULD CONTINUE TO PLACE A SIGNIFICANT
STRAIN ON OUR LIMITED PERSONNEL AND OTHER RESOURCES.
To manage expanded operations effectively, we will be required to continue
to improve our operational, financial and management systems and to
successfully hire, train, motivate and manage our employees. In addition, the
integration of past and future potential acquisitions and the expansion of our
manufacturing capacity will require significant additional management,
technical and administrative resources. We cannot be certain that we will be
able to manage our growth or effectively integrate a new or expanded wafer
fabrication facility into our current operations.
OUR CUSTOMERS ARE CONCENTRATED, SO THE LOSS OF ONE OR MORE KEY CUSTOMERS COULD
SIGNIFICANTLY REDUCE OUR REVENUES AND PROFITS.
Historically, a relatively small number of customers has accounted for a
significant portion of our revenues in any particular period. For example, our
five largest customers accounted for approximately 59% of our revenues in
fiscal 1999 and 73% for the three months ended December 31, 1999. Sales to
Nortel accounted for approximately 20% of our revenues in fiscal 1999 and 40%
for the three months ended December 31, 1999. However, we have no long-term
volume purchase commitments from any of our major customers. We anticipate that
sales of products to relatively few customers will continue to account for a
significant portion of our revenues. If Nortel or another significant customer
overstocked our products, additional orders for our products could be harmed. A
reduction, delay or cancellation of orders from one or more significant
customers or the loss of one or more key customers could significantly reduce
our revenues and profits. We cannot assure you that our current customers will
continue to place orders with us, that orders by existing customers will
continue at current or historical levels or that we will be able to obtain
orders from new customers.
AN IMPORTANT PART OF OUR STRATEGY IS TO CONTINUE OUR FOCUS ON THE MARKET FOR
HIGH-SPEED COMMUNICATIONS ICS. IF WE ARE UNABLE TO PENETRATE THESE MARKETS
FURTHER, OUR REVENUES COULD STOP GROWING AND MAY DECLINE.
Our markets frequently undergo transitions in which products rapidly
incorporate new features and performance standards on an industry-wide basis.
If our products are unable to support the new features or performance levels
required by OEMs in these markets, we would be likely to lose business from an
existing or potential customer and, moreover, would not have the opportunity to
compete for new design wins until the next product transition occurs. If we
fail to develop products with required features or performance standards, or if
we experience a delay as short as a few months in bringing a new product to
market, or if our customers fail to achieve market acceptance of their
products, our revenues could be significantly reduced for a substantial period.
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<PAGE>
A significant portion of our revenues in recent periods has been, and is
expected to continue to be, derived from sales of products based on SONET, SDH
and ATM transmission standards. If the communications market evolves to new
standards, we may not be able to successfully design and manufacture new
products that address the needs of our customers or gain substantial market
acceptance. Although we have developed products for the Gigabit Ethernet and
Fibre Channel communications standards, volume sales of these products are
modest, and we may not be successful in addressing the market opportunities for
products based on these standards.
OUR MARKETS ARE SUBJECT TO RAPID TECHNOLOGICAL CHANGE, SO OUR SUCCESS DEPENDS
HEAVILY ON OUR ABILITY TO DEVELOP AND INTRODUCE NEW PRODUCTS.
The markets for our products are characterized by:
. rapidly changing technologies;
. evolving and competing industry standards;
. short product life cycles;
. changing customer needs;
. emerging competition;
. frequent new product introductions and enhancements;
. increased integration with other functions; and
. rapid product obsolescence.
To develop new products for the communications markets, we must develop,
gain access to and use leading technologies in a cost-effective and timely
manner and continue to develop technical and design expertise. In addition, we
must have our products designed into our customers' future products and
maintain close working relationships with key customers in order to develop new
products, particularly ASSPs, that meet customers' changing needs. We also must
respond to changing industry standards, trends towards increased integration
and other technological changes on a timely and cost-effective basis. Further,
if we fail to achieve design wins with key customers our business will
significantly suffer because once a customer has designed a supplier's product
into its system, the customer typically is extremely reluctant to change its
supply source due to significant costs associated with qualifying a new
supplier.
Products for communications applications, as well as for high-speed
computing applications, are based on industry standards that are continually
evolving. Our ability to compete in the future will depend on our ability to
identify and ensure compliance with these evolving industry standards. The
emergence of new industry standards could render our products incompatible with
products developed by major systems manufacturers. As a result, we could be
required to invest significant time and effort and to incur significant expense
to redesign our products to ensure compliance with relevant standards. If our
products are not in compliance with prevailing industry standards for a
significant period of time, we could miss opportunities to achieve crucial
design wins. In addition, we may not be successful in developing or using new
technologies or in developing new products or product enhancements that achieve
market acceptance. Our pursuit of necessary technological advances may require
substantial time and expense.
THE MARKETS IN WHICH WE COMPETE ARE HIGHLY COMPETITIVE AND SUBJECT TO RAPID
TECHNOLOGICAL CHANGE, PRICE EROSION AND HEIGHTENED INTERNATIONAL COMPETITION.
The communications IC market is intensely competitive. Our ability to
compete successfully in our markets depends on a number of factors, including:
. success in designing and subcontracting the manufacture of new products
that implement new technologies;
12
<PAGE>
. product quality;
. reliability;
. customer support;
. time-to-market;
. product performance;
. price;
. the efficiency of production;
. design wins;
. expansion of production of our products for particular systems
manufacturers;
. end-user acceptance of the systems manufacturers' products;
. market acceptance of competitors' products; and
. general economic conditions.
In addition, our competitors or customers may offer enhancements to our
existing products or offer new products based on new technologies, industry
standards or customer requirements including, but not limited to, all optical
networking systems that are available to customers on a more timely basis than
comparable products from us or that have the potential to replace or provide
lower-cost or higher performance alternatives to our products. The introduction
of enhancements or new products by our competitors could render our existing
and future products obsolete or unmarketable. In addition, we expect that
certain of our competitors and other semiconductor companies may seek to
develop and introduce products that integrate the functions performed by our IC
products on a single chip, thus eliminating the need for our products.
In the communications markets, we compete primarily against Conexant, Giga,
Hewlett-Packard, Lucent, Maxim, Philips, PMC-Sierra, Sony, Texas Instruments,
TriQuint and Vitesse. Some of these companies use gallium arsenide process
technologies for certain products. In certain circumstances, most notably with
respect to ASICs supplied to Nortel, our customers or potential customers have
internal IC manufacturing capabilities.
WE MUST DEVELOP OR OTHERWISE GAIN ACCESS TO IMPROVED PROCESS TECHNOLOGIES.
Our future success will depend, in large part, upon our ability to continue
to improve existing process technologies, to develop new process technologies
including silicon germanium processes, and to adapt our process technologies to
emerging industry standards. In the future, we may be required to transition
one or more of our products to process technologies with smaller geometries,
other materials or higher speeds in order to reduce costs and/or improve
product performance. We may not be able to improve our process technologies and
develop or otherwise gain access to new process technologies, including, but
not limited to silicon germanium process technologies, in a timely or
affordable manner. In addition, products based on these technologies may not
achieve market acceptance.
WE EXPECT REVENUES THAT ARE CURRENTLY DERIVED FROM NON-COMMUNICATIONS MARKETS
WILL DECLINE IN FUTURE PERIODS.
We historically have derived significant revenues from product sales to
customers in the automated test equipment, or ATE, high-speed computing and
military markets and currently anticipate that we will continue to derive
revenues from sales to customers in these markets in the near term. However, we
are not currently funding product development efforts in these markets and as a
result we expect that revenues from products in these markets will decline in
future periods. In addition, the market for ATE and high-speed computing
IC products is subject to extreme price competition, and we may not be able to
reduce the costs of manufacturing high-speed computing IC products in response
to declining average selling prices. Even if we
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<PAGE>
successfully utilize new processes or technologies to reduce the manufacturing
costs of our high-speed computing products in a timely manner, our customers in
the ATE and high-speed computing markets may not purchase these products.
Further, we expect that certain competitors will seek to develop and
introduce products that integrate the functions performed by our ATE and high-
speed computing IC products on single chips. In addition, one or more of our
customers may choose to utilize discrete components to perform the functions
served by our high-speed computing IC products or may use their own design and
fabrication facilities to create a similar product. In either case, the need
for ATE and high-speed computing customers to purchase our IC products could be
eliminated.
WE HAVE IN THE PAST AND MAY IN THE FUTURE MAKE ACQUISITIONS WHERE ADVISABLE,
WHICH WILL INVOLVE NUMEROUS RISKS. THERE IS NO ASSURANCE THAT WE WILL BE ABLE
TO ADDRESS THESE RISKS SUCCESSFULLY WITHOUT SUBSTANTIAL EXPENSE, DELAY OR OTHER
OPERATIONAL OR FINANCIAL PROBLEMS.
The risks involved with acquisitions include:
. diversion of management's attention;
. failure to retain key personnel;
. amortization of acquired intangible assets;
. client dissatisfaction or performance problems with an acquired firm;
. the cost associated with acquisitions and the integration of acquired
operations; and
. assumption of unknown liabilities, or other unanticipated events or
circumstances.
In addition, acquisitions accounted for using the pooling of interest
methods of accounting are subject to rules established by the Financial
Accounting Standards Board and the Securities and Exchange Commission. These
rules are complex and the interpretation of them is subject to change.
Additionally, the availability of pooling of interests accounting treatment for
a business combination depends in part upon circumstances and events occurring
after the effective time. The failure of a past business combination or a
future potential business combination that has been accounted for under the
pooling of interests accounting method to qualify for this accounting treatment
would materially harm our reported and future earnings and likely, the price of
our common stock.
Any of these risks could materially harm our business, financial condition
and results of operations. There can be no assurance that any business that we
acquire will achieve anticipate revenues and operating results.
WE MAY NOT BE ABLE TO PROTECT OUR INTELLECTUAL PROPERTY ADEQUATELY.
We rely in part on patents to protect our intellectual property. There can
be no assurance that our pending patent applications or any future applications
will be approved, or that any issued patents will provide us with competitive
advantages or will not be challenged by third parties, or that if challenged,
will be found to be valid or enforceable, or that the patents of others will
not have an adverse effect on our ability to do business. Furthermore, others
may independently develop similar products or processes, duplicate our products
or processes or design around any patents that may be issued to us.
To protect our intellectual property, we also rely on the combination of
mask work protection under the Federal Semiconductor Chip Protection Act of
1984, trademarks, copyrights, trade secret laws, employee and third-party
nondisclosure agreements and licensing arrangements. Despite these efforts, we
cannot be certain that others will not independently develop substantially
equivalent intellectual property or otherwise gain access to our trade secrets
or intellectual property, or disclose such intellectual property or trade
secrets, or that we can meaningfully protect our intellectual property.
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<PAGE>
WE COULD BE HARMED BY LITIGATION INVOLVING PATENTS AND PROPRIETARY RIGHTS.
As a general matter, the semiconductor industry is characterized by
substantial litigation regarding patent and other intellectual property rights.
We may be accused of infringing the intellectual property rights of third
parties. We have certain indemnification obligations to customers with respect
to the infringement of third-party intellectual property rights by our
products. We cannot be certain that infringement claims by third parties or
claims for indemnification by customers or end users of our products resulting
from infringement claims will not be asserted in the future or that such
assertions, if proven to be true, will not harm our business. On July 31, 1998,
the Lemelson Medical, Education & Research Foundation Limited Partnership filed
a lawsuit in the U.S. District Court for the District of Arizona against a
number of companies, including us, engaged in the manufacture and/or sale of IC
products. The complaint alleges infringement by the defendants of certain U.S.
patents held by the Lemelson Partnership relating to certain semiconductor
manufacturing processes. On November 25, 1998, we were served a summons
pursuant to this lawsuit. The complaint seeks, among other things, injunctive
relief and unspecified treble damages. Previously, the Lemelson Partnership has
offered us a license under the Lemelson patents. Although the ultimate outcome
of this matter is not currently determinable, we believe, based in part on the
licensing terms previously offered by the Lemelson Partnership, that the
resolution of this matter will not have a material adverse effect on our
financial position or liquidity; however, there can be no assurance that the
ultimate resolution of this matter will not have a material adverse effect on
our results of operations for any quarter. Furthermore, there can be no
assurance that we would prevail in any such litigation.
Any litigation relating to the intellectual property rights of third
parties, including the Lemelson Patents, whether or not determined in our favor
or settled by us, would at a minimum be costly and could divert the efforts and
attention of our management and technical personnel. In the event of any
adverse ruling in any such litigation, we could be required to pay substantial
damages, cease the manufacturing, use and sale of infringing products,
discontinue the use of certain processes or obtain a license under the
intellectual property rights of the third party claiming infringement. A
license might not be available on reasonable terms, or at all.
OUR OPERATING RESULTS ARE SUBJECT TO FLUCTUATIONS BECAUSE WE RELY SUBSTANTIALLY
ON FOREIGN CUSTOMERS.
International sales (including sales to Canada) accounted for 41% of
revenues for the fiscal year 1999 and 50% for the three months ended December
31, 1999. International sales may increase in future periods and may account
for an increasing portion of our revenues. As a result, an increasing portion
of our revenues may be subject to certain risks, including:
. changes in regulatory requirements;
. tariffs and other barriers;
. timing and availability of export licenses;
. political and economic instability;
. difficulties in accounts receivable collections;
. natural disasters;
. difficulties in staffing and managing foreign subsidiary and branch
operations;
. difficulties in managing distributors;
. difficulties in obtaining governmental approvals for communications and
other products;
. foreign currency exchange fluctuations;
. the burden of complying with a wide variety of complex foreign laws and
treaties; and
. potentially adverse tax consequences.
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<PAGE>
We are subject to the risks associated with the imposition of legislation
and regulations relating to the import or export of high technology products.
We cannot predict whether quotas, duties, taxes or other charges or
restrictions upon the importation or exportation of our products will be
implemented by the United States or other countries. Because sales of our
products have been denominated to date primarily in United States dollars,
increases in the value of the United States dollar could increase the price of
our products so that they become relatively more expensive to customers in the
local currency of a particular country, leading to a reduction in sales and
profitability in that country. Future international activity may result in
increased foreign currency denominated sales. Gains and losses on the
conversion to United States dollars of accounts receivable, accounts payable
and other monetary assets and liabilities arising from international operations
may contribute to fluctuations in our results of operations. Some of our
customer purchase orders and agreements are governed by foreign laws, which may
differ significantly from United States laws. Therefore, we may be limited in
our ability to enforce our rights under such agreements and to collect damages,
if awarded.
WE COULD INCUR SUBSTANTIAL FINES OR LITIGATION COSTS ASSOCIATED WITH OUR
STORAGE, USE AND DISPOSAL OF HAZARDOUS MATERIALS.
We are subject to a variety of federal, state and local governmental
regulations related to the use, storage, discharge and disposal of toxic,
volatile or otherwise hazardous chemicals used in our manufacturing process.
Any failure to comply with present or future regulations could result in the
imposition of fines, the suspension of production or a cessation of operations.
In addition, these regulations could restrict our ability to expand our
facilities at the present location or construct or operate a new wafer
fabrication facility or could require us to acquire costly equipment or incur
other significant expenses to comply with environmental regulations or clean up
prior discharges. Since 1993, we have been named as a potentially responsible
party, along with a large number of other companies that used Omega Chemical
Corporation in Whittier, California to handle and dispose of certain hazardous
waste material. We are a member of a large group of potentially responsible
parties that has agreed to fund certain remediation efforts at the Omega site,
which efforts are ongoing. To date, our payment obligations with respect to
these funding efforts have not been material, and we believe that our future
obligations to fund these efforts will not have a material adverse effect on
our business, financial condition or operating results. Although we believe
that we are currently in material compliance with applicable environmental laws
and regulations, we cannot assure you that we are or will be in material
compliance with these laws or regulations or that our future obligations to
fund any remediation efforts, including those at the Omega site, will not have
a material adverse effect on our business.
OUR ABILITY TO MANUFACTURE SUFFICIENT WAFERS TO MEET DEMAND COULD BE SEVERELY
HAMPERED BY A SHORTAGE OF WATER OR NATURAL DISASTERS.
We use significant amounts of water throughout our manufacturing process.
Previous droughts in California have resulted in restrictions being placed on
water use by manufacturers and residents in California. In the event of future
drought, reductions in water use may be mandated generally, and it is unclear
how such reductions will be allocated among California's different users. We
cannot be certain that near term reductions in water allocations to
manufacturers will not occur. Our existing wafer fabrication facility is, and a
potential new wafer fabrication facility may be, located in Southern California
and these facilities may be subject to natural disasters such as earthquakes or
floods. A significant natural disaster, such as an earthquake or flood, could
have a material adverse impact on our business, financial condition and
operating results.
OUR STOCK PRICE IS VOLATILE.
The market price of our common stock has fluctuated significantly to date.
In the future, the market price of our common stock could be subject to
significant fluctuations due to general market conditions and in response to
quarter-to-quarter variations in:
. our anticipated or actual operating results;
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<PAGE>
. announcements or introductions of new products;
. technological innovations or setbacks by us or our competitors;
. conditions in the semiconductor, telecommunications, data
communications, ATE, high-speed computing or military markets;
. the commencement of litigation;
. changes in estimates of our performance by securities analysts;
. announcements of merger or acquisition transactions;
. other events or factors; and
. general economic and market conditions.
In addition, the stock market in recent years has experienced extreme price
and volume fluctuations that have affected the market prices of many high
technology companies, particularly semiconductor companies, and that have often
been unrelated or disproportionate to the operating performance of companies.
These fluctuations, as well as general economic and market conditions, may harm
the market price of our common stock.
IF WE HAVE NOT ADEQUATELY PREPARED FOR THE TRANSITION TO YEAR 2000, OUR
BUSINESS, OPERATING RESULTS AND FINANCIAL CONDITION COULD SUFFER.
We have executed a plan designed to make our computer systems, applications,
computer and manufacturing equipment and facilities Year 2000 ready. To date,
none of our systems, applications, equipment or facilities have experienced
material difficulties from the transition to Year 2000, nor have we been
notified that any of our suppliers have had any such difficulties. However, due
to the breadth of potential issues related to the Year 2000, we cannot
guarantee that we will not experience any problems in the future and the final
determination may take several months. Where practicable, we have attempted to
mitigate our risks with respect to any failures of our critical external
suppliers related to the Year 2000. The effect on our results of operations
from any failure of our systems, applications, equipment or facilities, or our
critical external suppliers, related to the Year 2000 issue cannot yet be
determined.
THE ANTI-TAKEOVER PROVISIONS OF OUR CERTIFICATE OF INCORPORATION AND OF THE
DELAWARE GENERAL CORPORATION LAW MAY DELAY, DEFER OR PREVENT A CHANGE OF
CONTROL.
Our board of directors has the authority to issue up to 2,000,000 shares of
preferred stock and to determine the price, rights, preferences and privileges
and restrictions, including voting rights, of those shares without any further
vote or action by our stockholders. The rights of the holders of common stock
will be subject to, and may harmed by, the rights of the holders of any shares
of preferred stock that may be issued in the future. The issuance of preferred
stock may delay, defer or prevent a change in control, as the terms of the
preferred stock that might be issued could potentially prohibit our
consummation of any merger, reorganization, sale of substantially all of our
assets, liquidation or other extraordinary corporate transaction without the
approval of the holders of the outstanding shares of preferred stock. In
addition, the issuance of preferred stock could have a dilutive effect on our
stockholders.
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<PAGE>
USE OF PROCEEDS
The net proceeds we will receive from the sale of 5,250,000 shares of common
stock offered by us will be approximately $713.4 million (or $815.7 million if
the underwriters' over-allotment option is exercised in full) after deducting
the underwriting discounts and commissions and estimated offering expenses
payable by us.
We intend to use the proceeds of this offering primarily for working capital
and general corporate purposes. In addition, we may use a portion of the net
proceeds to acquire businesses or technologies. Pending such uses, we expect to
invest the net proceeds in short-term, interest-bearing, investment grade
securities.
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<PAGE>
UNDERWRITING
Under the terms and subject to the conditions contained in an underwriting
agreement dated January 13, 2000, we have agreed to sell to the underwriters
named below, for whom Credit Suisse First Boston Corporation, Salomon Smith
Barney Inc. and SG Cowen Securities Corporation are acting as representatives,
the following respective numbers of shares of common stock:
<TABLE>
<CAPTION>
Number of
Underwriter Shares
- ----------- ---------
<S> <C>
Credit Suisse First Boston Corporation................................ 2,406,250
Salomon Smith Barney Inc. ............................................ 1,684,375
SG Cowen Securities Corporation....................................... 721,875
Adams, Harkness & Hill, Inc. ......................................... 43,750
Banc of America Securities LLC........................................ 43,750
E*Offering Corp....................................................... 43,750
Invemed Associates LLC................................................ 43,750
Kaufman Bros., L.P.................................................... 43,750
Needham & Company, Inc................................................ 43,750
Pacific Crest Securities Inc.......................................... 43,750
Pacific Growth Equities, Inc.......................................... 43,750
Schroder & Co. Inc.................................................... 43,750
TD Securities (USA) Inc............................................... 43,750
---------
Total............................................................. 5,250,000
=========
</TABLE>
The underwriting agreement provides that the underwriters are obligated to
purchase all the shares of common stock in the offering if any are purchased,
other than those shares covered by the over-allotment option described below.
The underwriting agreement also provides that if an underwriter defaults the
purchase commitments of non-defaulting underwriters may be increased or the
offering of common stock may be terminated.
We have granted the underwriters a 30-day option to purchase up to 752,271
additional shares at the public offering price less the underwriting discounts
and commissions. The option may be exercised only to cover any over-allotments
of common stock.
The underwriters propose to offer the shares of common stock initially at
the public offering price on the cover page of this prospectus and to selling
group members at that price less a concession of $3.62 per share. The
underwriters and selling group members may allow a discount of $.10 per share
on sales to other broker/dealers. After the public offering, the public
offering price and concession and discount to broker/dealer may be changed by
the representatives.
The following table summarizes the compensation and estimated expenses we
will pay.
<TABLE>
<CAPTION>
Per Share Total
----------------------------- -----------------------------
Without With Without With
Over-Allotment Over-Allotment Over-Allotment Over-Allotment
-------------- -------------- -------------- --------------
<S> <C> <C> <C> <C>
Underwriting discounts
and commissions payable
by AMCC................ $6.035 $6.035 $31,683,750 $36,223,705
Expenses payable by
AMCC................... $ .08 $ .07 $ 400,000 $ 400,000
</TABLE>
We, our directors and certain of our officers have agreed that we and they
will not offer, sell, contract to sell, pledge or otherwise dispose of,
directly or indirectly, or file with the Commission a registration statement
under the Securities Act relating to, any additional shares of our common stock
or securities convertible into or
19
<PAGE>
exchangeable or exercisable for any of our common stock, or publicly disclose
the intention to make any such offer, sale, pledge, disposition or filing,
without the prior written consent of Credit Suisse First Boston Corporation for
a period of 90 days after the date of this prospectus, except that we can issue
shares pursuant to the exercise of employee stock options outstanding on the
date hereof and that certain of our officers and directors may sell a portion
of their shares without consent.
We have agreed to indemnify the underwriters against liabilities under the
Securities Act or contribute to payments which the underwriters may be required
to make in that respect.
Our common stock is traded on The Nasdaq National Market under the symbol
"AMCC."
The representatives on behalf of the underwriters may engage in over-
allotment, stabilizing transactions, syndicate covering transactions, penalty
bids and "passive" market making in accordance with Regulation M under the
Securities Exchange Act of 1934.
. Over-allotment involves syndicate sales in excess of the offering size,
which creates a syndicate short position.
. Stabilizing transactions permit bids to purchase the underlying security
so long as the stabilizing bids do not exceed a specified maximum.
. Syndicate covering transactions involve purchases of the common stock in
the open market after the distribution has been completed in order to
cover syndicate short positions.
. Penalty bids permit the representatives to reclaim a selling concession
from a syndicate member when the common stock originally sold by the
syndicate member are purchased in a stabilizing or syndicate covering
transaction to cover syndicate short positions.
. In "passive" market making, market makers in the securities who are
underwriters or prospective underwriters may, subject to certain
limitations, make bids for or purchases of the securities until the
time, if any, at which a stabilizing bid is made.
These stabilizing transactions, syndicate covering transactions and penalty
bids may cause the price of the common stock to be higher than it would
otherwise be in the absence of these transactions. These transactions may be
effected on The Nasdaq National Market or otherwise and, if commenced, may be
discontinued at any time.
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<PAGE>
NOTICE TO CANADIAN RESIDENTS
RESALE RESTRICTIONS
The distribution of the common stock in Canada is being made only on a
private placement basis exempt from the requirement that we prepare and file a
prospectus with the securities regulatory authorities in each province where
trades of common stock are effected. Accordingly, any resale of the common
stock in Canada must be made in accordance with applicable securities laws
which will vary depending on the relevant jurisdiction, and which may require
resales to be made in accordance with available statutory exemptions or
pursuant to a discretionary exemption granted by the applicable Canadian
securities regulatory authority. Purchasers are advised to seek legal advice
prior to any resale of the common stock.
REPRESENTATIONS OF PURCHASERS
Each purchaser of common stock in Canada who receives a purchase
confirmation will be deemed to represent to us and the dealer from whom such
purchase confirmation is received that (i) such purchaser is entitled under
applicable provincial securities laws to purchase such common stock without the
benefit of a prospectus qualified under such securities laws, (ii) where
required by law, that such purchaser is purchasing as principal and not as
agent, and (iii) such purchaser has reviewed the text above under "Resale
Restrictions".
RIGHTS OF ACTIONS (ONTARIO PURCHASERS)
The securities being offered are those of a foreign issuer and Ontario
purchasers will not receive the contractual right of action prescribed by
Ontario securities law. As a result, Ontario purchasers must rely on other
remedies that may be available, including common law rights of action for
damages or rescission or rights of action under the civil liability provisions
of the U.S. federal securities laws.
ENFORCEMENT OF LEGAL RIGHTS
All of the issuer's directors and officers as well as the experts named
herein may be located outside of Canada and, as a result, it may not be
possible for Canadian purchasers to effect service of process within Canada
upon the issuer or such persons. All or a substantial portion of the assets of
the issuer and such persons may be located outside of Canada and, as a result,
it may not be possible to satisfy a judgment against the issuer or such persons
in Canada or to enforce a judgment obtained in Canadian courts against such
issuer or persons outside of Canada.
NOTICE TO BRITISH COLUMBIA RESIDENTS
A purchaser of common stock to whom the Securities Act (British Columbia)
applies is advised that such purchaser is required to file with the British
Columbia Securities Commission a report within ten days of the sale of any
common stock acquired by such purchaser pursuant to this offering. This report
must be in the form attached to British Columbia Securities Commission Blanket
Order BOR #95/17, a copy of which may be obtained from us. Only one such report
must be filed in respect of common stock acquired on the same date and under
the same prospectus exemption.
TAXATION AND ELIGIBILITY FOR INVESTMENT
Canadian purchasers of common stock should consult their own legal and tax
advisors with respect to the tax consequences of an investment in the common
stock in their particular circumstances and with respect to the eligibility of
the common stock for investment by the purchaser under relevant Canadian
legislation.
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<PAGE>
LEGAL MATTERS
The validity of the shares of common stock being sold in this offering and
other legal matters relating to the offering will be passed upon for us by
Cooley Godward LLP, San Diego, California. Certain legal matters relating to
the offering will be passed upon for the underwriters by Wilson Sonsini
Goodrich & Rosati, Professional Corporation, Palo Alto, California.
EXPERTS
Ernst & Young LLP, independent auditors, have audited our consolidated
financial statements and schedule included in our annual report on Form 10-K
for the year ended March 31, 1999, as set forth in their report, which is
incorporated by reference in this prospectus and registration statement. Our
financial statements and schedule are incorporated by reference in reliance on
Ernst & Young LLP's report, given on their authority as experts in accounting
and auditing.
WHERE YOU CAN FIND MORE INFORMATION
This prospectus is part of a registration statement on Form S-3 that we
filed with the Securities and Exchange Commission. Certain information in the
registration statement has been omitted from this prospectus in accordance with
the rules of the SEC. We file proxy statements and annual, quarterly and
special reports and other information with the SEC. You can inspect and copy
the registration statement as well as the reports, proxy statements and other
information we have filed with the SEC at the public reference room maintained
by the SEC at 450 Fifth Street, N. W., Washington, D.C., and at the SEC
Regional Offices located at Citicorp Center, 500 West Madison Street, Suite
1400, Chicago, Illinois 60661-2511 and 7 World Trade Center, Suite 1300, New
York, New York 10048. You can call the SEC at 1-800-732-0330 for further
information about the public reference rooms. We are also required to file
electronic versions of these documents with the SEC, which may be accessed from
the SEC's World Wide Web site at http://www.sec.gov. Reports, proxy and
information statements and other information concerning Applied Micro Circuits
Corporation may be inspected at The Nasdaq Stock Market at 1735 K Street, N.
W., Washington, D.C. 20006.
The SEC requires us to "incorporate by reference" certain of our publicly-
filed documents into this prospectus, which means that information included in
those documents is considered part of this prospectus. Information that we file
with the SEC after the effective date of this prospectus will automatically
update and supersede this information. We incorporate by reference the
documents listed below and any future filings made with the SEC under Sections
13(a), 13(c), 14 or 15(d) of the Securities Exchange Act of 1934, or until we
terminate the effectiveness of this registration statement.
The following documents filed with the SEC are incorporated by reference in
this prospectus:
1. Our Annual Report on Form 10-K for the year ended March 31, 1999.
2. All other filings pursuant to Section 13(a) or 15(d) of the Securities
Exchange Act since the end of the fiscal year covered by the annual report
referred to in (1) above.
3. The description of our common stock in our registration statement on Form
8-A filed with the SEC on October 10, 1997, including any amendments or reports
filed for the purpose of updating such description.
4. All of the filings pursuant to the Securities Exchange Act after the date
of filing of the original registration statement and prior to the effectiveness
of the Registration Statement.
We will furnish without charge to you, on written or oral request, a copy of
any or all of the documents incorporated by reference, other than exhibits to
those documents. You should direct any requests for documents to Debra Hart,
6290 Sequence Drive, San Diego, CA 92121, telephone: (858) 450-9333.
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DISCLOSURE REGARDING FORWARD-LOOKING STATEMENTS
This prospectus, including the documents that we incorporate by reference,
contains forward-looking statements within the meaning of Section 27A of the
Securities Act of 1933 and Section 21E of the Securities Exchange Act of 1934.
Any statements about our expectations, beliefs, plans, objectives, assumptions
or future events or performance are not historical facts and may be forward-
looking. These statements are often, but not always, made through the use of
words or phrases such as "anticipate," "estimate," "plans," "projects,"
"continuing," "ongoing," "expects," "management believes," "we believe," "we
intend" and similar words or phrases. Accordingly, these statements involve
estimates, assumptions and uncertainties which could cause actual results to
differ materially from those expressed in them. Any forward-looking statements
are qualified in their entirety by reference to the factors discussed
throughout this prospectus. Among the key factors that could cause actual
results to differ materially from the forward-looking statements:
. timely product development;
. change in economic conditions of the various markets we serve;
. opportunities or acquisitions that we pursue; and
. the availability and terms of financing.
Because the risk factors referred to above could cause actual results or
outcomes to differ materially from those expressed in any forward-looking
statements made by us, you should not place undue reliance on any such forward-
looking statements. Further, any forward-looking statement speaks only as of
the date on which it is made, and we undertake no obligation to update any
forward-looking statement or statements to reflect events or circumstances
after the date on which such statement is made or to reflect the occurrence of
unanticipated events. New factors emerge from time to time, and it is not
possible for us to predict which will arise. In addition, we cannot assess the
impact of each factor on our business or the extent to which any factor, or
combination of factors, may cause actual results to differ materially from
those contained in any forward-looking statements.
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[LOGO OF APPLIED MICRO CIRCUITS CORPORATION]
