<PAGE>
SECURITIES AND EXCHANGE COMMISSION
Washington, D.C. 20549
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FORM 8-K
CURRENT REPORT
PURSUANT TO SECTION 13 OR 15(D)
OF THE SECURITIES EXCHANGE ACT OF 1934
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Date of Report (Date of earliest event reported): NOVEMBER 8, 1999
IBIS TECHNOLOGY CORPORATION
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(Exact name of registrant as specified in its charter)
MASSACHUSETTS 0-23150 04-2987600
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(State or other (Commission (IRS Employer
jurisdiction of File Number) Identification No.)
incorporation)
32 CHERRY HILL DRIVE, DANVERS, MASSACHUSETTS 01923
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(Address of principal executive offices) (Zip Code)
Registrant's telephone number, including area code: (978) 777-4247
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ITEM 5. OTHER EVENTS.
On November 8, 1999, the Registrant publicly disseminated a press
release announcing its plans to develop the next-generation Ibis 2000 oxygen
implanter. The proprietary Ibis 2000 will support the volume production of high
quality SIMOX-SOI (Separation by IMplantation of OXygen/Silicon-On-Insulator)
200 mm and 300 mm wafers for the global semiconductor industry. The design and
development effort for the Ibis 2000 has commenced and it is expected to be
ready for shipping in the first quarter of 2002. The information contained in
the press release is incorporated herein by reference and filed as Exhibit 99.1
hereto.
ITEM 7. FINANCIAL STATEMENTS AND EXHIBITS.
(c) Exhibit.
99.1 The Registrant's Press Release dated November 8, 1999.
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SIGNATURES
Pursuant to the requirements of the Securities Exchange Act of 1934,
the Registrant has duly caused this report to be signed on its behalf by the
undersigned hereunto duly authorized.
IBIS TECHNOLOGY CORPORATION
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(Registrant)
Date: November 10, 1999 /s/ Debra L. Nelson
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Debra L. Nelson, Chief Financial Officer
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EXHIBIT INDEX
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Exhibit Sequential
Number Description Page Number
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<S> <C> <C>
99.1 The Registrant's Press Release 5
dated November 8, 1999
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EXHIBIT 99.1
FOR IMMEDIATE RELEASE
COMPANY CONTACTS:
Debra L. Nelson Al Alioto
Chief Financial Officer Vice President, Sales and Marketing
Ibis Technology Corporation Ibis Technology Corporation
Tel: 978-777-4247 Tel: 978-777-4247 or 831-662-9100
Email: [email protected] Email: [email protected]
AGENCY CONTACT:
Charla Jones
Northeast Regional Director
The Loomis Group, Inc.
Tel: 617-638-0022
Fax: 617-638-0033
Email: [email protected]
IBIS TECHNOLOGY ANNOUNCES PLANS TO DEVELOP
NEXT-GENERATION OXYGEN IMPLANTER
IBIS 2000 TO PRODUCE 300 MM SIMOX-SOI WAFERS
DANVERS, Mass., November 8, 1999 -- Ibis Technology Corporation (NASDAQ:
IBIS), a leading manufacturer and supplier of SIMOX-SOI (Separation by
IMplantation of OXygen / Silicon-On-Insulator) implantation equipment and
wafers to semiconductor manufacturers, today announced plans to develop the
next-generation Ibis 2000 oxygen implanter. The proprietary Ibis 2000 will
support the volume production of high quality SIMOX-SOI 200 mm and 300 mm
wafers for the global semiconductor industry. The design and development
effort has commenced and the Ibis 2000 oxygen implanter is forecasted to be
ready for shipping in the first quarter of 2002. This news comes in the wake
of September's announcement that the company is manufacturing three
additional Ibis 1000 implanters for internal wafer production and expanding
its manufacturing and engineering facility. The addition to Ibis Technology's
SIMOX production facility is forecasted to increase the company's capacity to
produce wafers by 150 percent.
Extending the capabilities of the production-proven Ibis 1000, the advanced
Ibis 2000 will substantially increase available capacity, advance process
technology, increase throughput and reduce costs. The oxygen implanter will
utilize next-generation beamline design to reduce the number of beamline
components and improve beam transport. The modular construction of the system
will enable improved serviceability and diagnostics, while simplifying the
assembly and shipping of the machine. The Ibis 2000 will be bulkhead mounted
in the cleanroom and offers front-opening unified pod (FOUP) capability. In
addition, the improved automation and operator-friendly controls will raise
the overall productivity and afford ease-of-use.
"The migration to 300 mm, which is intrinsic to the technology roadmaps of
several leading integrated circuit manufacturers, is supported by the Ibis
2000." said Martin Reid, president and chief executive officer of Ibis
Technology. "The Ibis 2000 oxygen implanter will capitalize on the technology
embodied in the Ibis 1000 platform. This development
-more-
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IBIS TECHNOLOGY ANNOUNCES PLANS TO DEVELOP NEXT GENERATION OXYGEN IMPLANTER
PAGE 2 OF 2
underscores Ibis Technology's commitment to supplying leading-edge wafers and
equipment to customers."
The Ibis 2000 will also offer extensive low-dose and low-energy capabilities,
facilitating the use of the Advantox* product portfolio introduced last year
by Ibis Technology. The portfolio significantly expands the range of
commercial applications for Ibis SIMOX-SOI wafers.
SIMOX-SOI wafers are Silicon-On-Insulator wafers that enable the production
of integrated circuits that the Company believes offer significant advantages
over-circuits constructed on conventional silicon or epitaxial wafers. These
advantages include improved microprocessing speed, reduced power consumption
and higher temperature operation. Ibis' SIMOX-SOI implantation equipment
consists of advanced proprietary high current Ibis 1000 oxygen implanters.
ABOUT IBIS TECHNOLOGY
Ibis Technology Corporation is headquartered in Danvers, Massachusetts and
maintains an office in Aptos, California. The Company is a premier
manufacturer and supplier of SIMOX-SOI implantation equipment and wafers for
the worldwide semiconductor industry.
"SAFE HARBOR" STATEMENT UNDER THE PRIVATE SECURITIES LITIGATION REFORM ACT OF
1995: The statements contained in this press release that are not historical
fact are forward-looking statements based upon management's current
expectations that are subject to risks and uncertainties that could cause
actual results to differ materially from those set forth in or implied by
forward-looking statements, including, but not limited to, the impact of the
Year 2000 issue; product demand and market acceptance risks, general economic
conditions, the impact of competitive products, technologies and pricing,
equipment capacity and supply constraints or difficulties, the cyclical
nature of the semiconductor industry, and other risks described in the
Company's Securities and Exchange Commission filings.
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