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EXHIBIT 99.1
[ibis LOGO]
COMPANY CONTACTS:
Debra L. Nelson or Al Alioto
Chief Financial Officer VP Sales & Marketing
Ibis Technology Corporation Ibis Technology Corporation
Tel: 978-777-4247 Tel: 978-777-4247 or 831-662-9100
AGENCY CONTACT:
Charla Jones
Northeast Regional Director
The Loomis Group, Inc
Tel: 617-638-0022
Fax: 617-638-0033
Email: [email protected]
IBIS TECHNOLOGY TO LICENSE IBM SILICON-ON-INSULATOR TECHNOLOGY
LICENSE GIVES IBIS RIGHTS TO MANUFACTURE
WAFERS WITH IBM'S SIMOX-SOI PROCESS
DANVERS, Mass., December 28, 2000 -- Ibis Technology Corporation (NASDAQ: IBIS)
today announced that it has licensed from IBM the right to manufacture and sell
SIMOX-SOI (Separation by IMplantation of OXygen / Silicon-On-Insulator) wafers,
using IBM's proprietary SIMOX process, to IBM and to all Ibis customers. Ibis is
the leading manufacturer and supplier of SIMOX-SOI implantation equipment and
wafers to semiconductor manufacturers.
Under the royalty-bearing license agreement, Ibis may use IBM's process to
produce SIMOX-SOI wafers which Ibis will market as Advantox-MLD(TM). A
complementary product to their existing Advantox(R) product line,
Advantox-MLD(TM) wafers will be broadly marketed to integrated circuit
manufacturers looking to accelerate their SOI adoption process. Under the
agreement Ibis grants IBM rights to Ibis patents utilized in the modified low
dose ("MLD") process. Additionally, as part of the agreement Ibis will grant IBM
warrants to purchase Ibis common stock.
"Ibis is recognized as the leader in SIMOX-SOI technology and has been working
with IBM for many years to improve the quality and manufacturing standards of
SIMOX wafers. This relationship gives Ibis an opportunity to combine our
foremost SOI material with the leading production-proven process of record in
the industry and make it available to all Ibis customers," said Martin Reid,
president and CEO of Ibis. "IBM has proven the viability of the SIMOX-SOI
process, from materials manufacturing through the most complex, state-of-the-art
microprocessor production. We believe that this licensed process will establish
a new baseline
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EXHIBIT 99.1
for the production of integrated circuits. We have further improvements planned
to lower costs and improve the quality of SIMOX wafers in the future."
IBM recently announced the availability of SOI based eServer products, including
the company's iSeries 400 Model 820 and pSeries 680, which have received
extremely positive reviews. IBM also recently announced plans for a $2.5 billion
300mm wafer fabrication facility which will combine copper, SOI and low-k
dielectric technologies.
"IBM's SOI technology is helping to accelerate the industry's constant drive to
create smaller, more powerful, less expensive electronic products," said Bijan
Davari, IBM Fellow and vice president of technology and emerging products, IBM
Microelectronics. "With the growing realization in the industry that SOI
technology will be required to achieve higher levels of performance, we see this
as a tremendous opportunity to deliver the benefits of IBM's leading-edge
technology to more customers."
The Advantox(R) product line introduced by Ibis was specifically designed to
provide low cost, high quality SIMOX-SOI wafers for use in the manufacturing of
complementary metal oxide semiconductor (CMOS) applications.
ABOUT IBIS TECHNOLOGY
Ibis Technology Corporation is the premier manufacturer and supplier of enhanced
SIMOX-SOI substrates and equipment for the worldwide semiconductor industry. The
company is headquartered in Danvers, Massachusetts and maintains an office in
Aptos, California. Information about Ibis Technology Corporation and SIMOX-SOI
is available on Ibis's World Wide Web site at http://www.ibis.com
"SAFE HARBOR" STATEMENT UNDER THE PRIVATE SECURITIES LITIGATION REFORM ACT OF
1995": This release may contain forward-looking statements that are subject to
certain risks and uncertainties including statements regarding the future
anticipated success of SIMOX-SOI technology. Such statements are based upon
management's current expectations that are subject to risks and uncertainties
that could cause actual results to differ materially from those set forth in or
implied by forward-looking statements, including, but not limited to, product
demand and market acceptance risks, general economic conditions, the impact of
competitive products, technologies and pricing, the impact of rapidly changing
technology, equipment capacity and supply constraints or difficulties,
limitations on the ability to protect the Company's patents and proprietary
technology, the Company's limited history with regard to sales of implanters,
the cyclical nature of the semiconductor industry, and other risks described in
the Company's Securities and Exchange Commission filings.
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