UNITED STATES
SECURITIES AND EXCHANGE COMMISSION
Washington, D.C. 20549
FORM 8-K
CURRENT REPORT
Pursuant to Section 13 of 15(d) of the Securities Exchange Act of 1934
Date of Report (Date of earliest event reported): August 25, 1997
Berg Electronics Corp.
(Exact name of Registrant as specified in charter)
Delaware
(State of jurisdiction of incorporation or organization)
1-14080
(Commission File Number)
75-2451903
(I.R.S. Employer Identification No.)
101 South Hanley Road
St. Louis, MO 63105
(314) 746-1323
(Address, including zip code, and telephone number, including area
code, of registrant's principal executive offices)
Item 5. Other Events
Berg Electronics Corp. has signed an agreement to supply high-density
MEG-ArrayTM interconnect systems for use in the modular packaging of
microprocessors to Intel Corporation. The 3.2mm BGA-connector, with a density of
400 connections per square inch, will be used initially in notebook computers
and other high-density mobile applications.
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Production requirements for MEG-ArrayTM connectors and related high-density
products are expected to increase Berg's capital expenditures by approximately
$40 million through 1998. Berg will expand its Valley Green, Pa. facility
by some 50,000 square feet to provide needed manufacturing capacity. Valley
Green will be the primary development and initial production site for
MEG-ArrayTM and other new micro-miniature high-density connectors. Approximately
half of a 40,000 square foot production facility currently under renovation in
Iwaki City, Japan is planned to house a second production site.
SIGNATURES
Pursuant to the requirements of the Securities Exchange Act of 1934, the
registrant has duly caused this report to be signed on its behalf by the
undersigned hereunto duly authorized.
Berg Electronics Corp.
Date September 9, 1997 /s/ JOSEPH S. CATANZARO
Joseph S. Catanzaro
Chief Accounting Officer
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