UNITED STATES
SECURITIES AND EXCHANGE COMMISSION
Washington, D.C. 20549
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FORM 8-K
CURRENT REPORT
PURSUANT TO SECTION 13 OR 15(d) OF THE SECURITIES AND EXCHANGE ACT OF 1934
Date of Report (Date of earliest event reported) July 7, 2000
Commission File Number
0-25424
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SEMITOOL, INC.
(Exact Name of Registrant as Specified in Its Charter)
Montana 81-0384392
(State or other jurisdiction of (I.R.S. Employer
incorporation or organization) Identification No.)
Semitool, Inc.
655 West Reserve Drive, Kalispell, Montana 59901
(406) 752-2107
(Address, including zip code, and telephone number, including
area code, of registrant's principal executive offices)
<PAGE>
Item 5. Other Events
See the following press release, dated July 7, 2000, announcing that the Company
is licensing its copper ECD seed layer technology to Shipley Company, L.L.C.
Contacts:
Semitool, Inc.
Bill Freeman
Sr. VP & Chief Financial Officer
(406) 752-2107
Dana Scranton
Director Strategic Marketing
(406) 751-6360
FOR IMMEDIATE RELEASE
SEMITOOL LICENSES COPPER ECD SEED LAYER
FORMULATION TO SHIPLEY
New Technology Improves Quality of Copper Deposition Process
Kalispell, MT-- July 7, 2000-- Semitool, Inc. (Nasdaq: SMTL) announced a
licensing agreement with Shipley Company, L.L.C. (Marlborough, Mass.), a leading
supplier of material and process technologies to the microelectronics and
printed wiring board industries. Under the agreement, Shipley will manufacture
and distribute a patent-pending electrochemical deposition (ECD) chemistry
developed by Semitool.
As interconnect geometries decrease the ability of physical vapor deposition
(PVD) to provide an adequate seed layer is challenged. Semitool's process
provides a conformal seed layer on top of a very thin copper PVD adhesion layer.
This, together with a subsequent fill step, is designed to enable users to
extend current PVD systems into next generation copper interconnect
applications.
"Semitool's ECD chemistry has demonstrated an ability to improve copper fill of
inlaid features to the 130 nm technology node," noted Tom Taylor, business
manager for Shipley's copper products. "Today, seed layer integrity is the
single most important limitation in achieving robust, consistent bottom-up fill.
For the next generations of copper interconnect, the ability of vacuum-deposited
seed layers to provide a continuous copper film that can be filled without
voiding is even more constrained." Taylor added, "Semitool's unique process
provides a conformal copper seed over thin PVD layers, which ensures electrical
continuity throughout the feature and avoids the typical overhang of the seed
layer associated with PVD. Partnering with Semitool helps position Shipley at
the leading edge of production-worthy copper interconnect technology."
"The development of this chemistry is an example of our leadership in the copper
ECD field," said Dr. Jurek Koziol, Semitool's VP of Electrochemical Technology.
"With the semiconductor industry ramping up chip production with copper
interconnect structures, there are some industry concerns about overall process
integration and the extendibility of PVD seed layers into future generations.
Semitool's new copper ECD seed layer process overcomes some of the currently
experienced variability issues of the PVD process, resulting in more
predictable, higher quality films."
According to Semitool, the ECD seed layer process can be performed in Semitool's
ECD systems, extending processing capabilities and market potential for this
production-proven system. Semitool's ECD seed layer chemistry is currently
available from Shipley.
About Shipley Company
Based in Marlborough, Mass., Shipley is a leading supplier of chemicals and
photoresists for the electronics industry. A 42-year-old, $1 billion subsidiary
of Philadelphia-based Rohm and Haas, Shipley serves the microlithography,
printed wiring board and surface finishing markets with an extensive global
network of Ultra High Purity manufacturing, sales and technical support in the
U.S., Europe and the Far East.
About Semitool, Inc.
Semitool is a worldwide leader in the design, development, manufacture and
support of high performance wet chemical processing equipment for use in the
fabrication of semiconductor devices. Its primary families of tools include ECD
systems for the plating of copper interconnects for integrated circuits and
other metals for various applications, and wafer surface preparation systems for
cleaning, stripping and etching processes.
Founded in 1979 and headquartered in Kalispell, Montana, Semitool maintains
sales and support centers in the United States, Europe and Asia. The Company's
stock trades on the Nasdaq National Market under the symbol SMTL.
Safe Harbor Statement
Except for historical information, the matters discussed in this news release
include forward-looking statements, including statements relating to the
acceptance, use and benefits of Semitool's ECD chemistry. Such forward-looking
statements are subject to certain risks and uncertainties that could cause
actual results to materially differ from those projected. These risks include
the risk that the expected acceptance, use and benefits of Semitool's ECD
chemistry will not be realized, as well as the risk that future competing
technologies will render this technology obsolete. For the discussions of the
risk factors related to our business, see the risk factors contained in the
Company's Annual Report on Form 10-K for the fiscal year ended September 30,
1999 and other filings with the Securities and Exchange Commission. The Company
assumes no obligation to update or supplement forward-looking statements that
become untrue because of subsequent events.
For more information on Semitool, Inc. via facsimile at no cost, simply dial
1-800-PRO-INFO (1-800-776-4636) and enter the company ticker symbol, SMTL, or
visit Semitool's web site at www.semitool.com.
Signatures
Pursuant to the requirements of the Securities Exchange Act of 1934, the
Registrant has duly caused this report to be signed on its behalf by the
undersigned thereunto duly authorized.
Semitool, Inc.
(Registrant)
July 7, 2000 by
/s/William A. Freeman
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Chief Financial Officer
